Abstract: The invention relates to A slurry composition, comprising: an inorganic powder; a dispersant; and a solvent wherein the dispersant is a block copolymer comprising at least one hydrophobic block A and at least one hydrophilic block B, and wherein the blocks A and B comprise repeating units represented by the following general formula (I) wherein R1 is selected from a hydrogen atom, a linear or branched alkyl group having 1 to 10 carbon atoms and a cyclic alkyl group having 4 to 6 carbon atoms, and wherein at least one carboxylic acid group or a salt thereof is covalently linked to the block copolymer.

Abstract: A laminate with superior thermal conductivity, heat resistance, drill workability, and fire retardancy is provided. In a prepreg obtained by impregnating a woven or nonwoven fabric base with a thermosetting resin composition, the thermosetting resin composition contains 80 to 200 parts by volume of an inorganic filler per 100 parts by volume of a thermosetting resin, the inorganic filler contains (A) gibbsite type aluminum hydroxide particles having an average particle diameter (D50) of 2 to 15 ?m and (B) magnesium oxide having an average particle diameter (D50) of 0.5 to 15 ?m, and a compounding ratio (volume ratio) of the gibbsite type aluminum hydroxide particles (A) to the magnesium oxide (B) is 1:0.3 to 3.

Abstract: A multi-layer printed-wiring-board is used in densely packaging electronic components such as semiconductors having improved function, and a production method therefor, and more specifically it achieves a multi-layer printed-wiring-board having excellent copper-foil-peel-strength and high connection-reliability in which occurrence of structural defects such as delamination (interlayer peeling) is prevented, and a production method therefor. Because of thinning of the printed-wiring-board or diversification of insulating layers constituting the printed-wiring-board, peeling such as delamination may occur between the insulating layers or in an interface between the insulating layer and the plated conductor.

Abstract: A wiring board includes a base in which plate wirings formed of a metal plate are integrally formed with an insulating portion made of resin or a resin composition and surface wirings electrically connected to the plate wirings. The base has first and second surfaces on which the surface wirings are formed. The surface wirings are thinner than the plate wirings, and the minimum wiring gap between the surface wirings is smaller than the minimum wiring gap between the plate wirings. One of the plate wirings has substantially the same shape as that of a region where the first top-surface wiring on the first surface and the first bottom-surface wiring on the second surface overlap with each other in the normal direction of the first surface. The first top-surface wiring and the first bottom-surface wiring are connected to each other through the above-mentioned one of the plate wirings.

Abstract: Disclosed is a prepreg obtained by impregnating a woven fabric base with a thermosetting resin composition, wherein the thermosetting resin composition contains 80 to 200 volume parts of an inorganic filler per 100 volume parts of a thermosetting resin, and the inorganic filler contains (A) gibbsite aluminum hydroxide particles having an average particle diameter (D50) of 2 to 15 ?m, (B) at least one inorganic component selected from the group consisting of boehmite particles having an average particle diameter (D50) of 2 to 15 ?m and inorganic particles that have an average particle diameter (D50) of 2 to 15 ?m and that contain crystal water having a release initiation temperature of 400° C. or higher or contain no crystal water, and (C) aluminum oxide particles having an average particle diameter (D50) of 1.

Abstract: A laminate with superior thermal conductivity, heat resistance, drill workability, and fire retardancy is provided. In a prepreg obtained by impregnating a woven or nonwoven fabric base with a thermosetting resin composition, the thermosetting resin composition contains 80 to 200 parts by volume of an inorganic filler per 100 parts by volume of a thermosetting resin, the inorganic filler contains (A) gibbsite type aluminum hydroxide particles having an average particle diameter (D50) of 2 to 15 ?m and (B) magnesium oxide having an average particle diameter (D50) of 0.5 to 15 ?m, and a compounding ratio (volume ratio) of the gibbsite type aluminum hydroxide particles (A) to the magnesium oxide (B) is 1:0.3 to 3.

Abstract: Disclosed is a prepreg obtained by impregnating a woven fabric base with a thermosetting resin composition, wherein the thermosetting resin composition contains 80 to 200 volume parts of an inorganic filler per 100 volume parts of a thermosetting resin, and the inorganic filler contains (A) gibbsite aluminum hydroxide particles having an average particle diameter (D50) of 2 to 15 ?m, (B) at least one inorganic component selected from the group consisting of boehmite particles having an average particle diameter (D50) of 2 to 15 ?m and inorganic particles that have an average particle diameter (D50) of 2 to 15 ?m and that contain crystal water having a release initiation temperature of 400° C. or higher or contain no crystal water, and (C) aluminum oxide particles having an average particle diameter (D50) of 1.

Abstract: A multi-layer printed-wiring-board is used in densely packaging electronic components such as semiconductors having improved function, and a production method therefor, and more specifically it achieves a multi-layer printed-wiring-board having excellent copper-foil-peel-strength and high connection-reliability in which occurrence of structural defects such as delamination (interlayer peeling) is prevented, and a production method therefor. Because of thinning of the printed-wiring-board or diversification of insulating layers constituting the printed-wiring-board, peeling such as delamination may occur between the insulating layers or in an interface between the insulating layer and the plated conductor.