Abstract: An image pickup module includes a printed wiring board, an electronic component, solder, and a thermosetting resin. The printed wiring board has a first surface provided with first lands. The electronic component includes an image pickup element and has a second surface provided with second lands. The thermosetting resin is in contact with the solder and bonds the printed wiring board to the electronic component. The solder bonds the first lands to the second lands and has a hollow portion. The area of the hollow portion is 5% to 50% of the total area of the solder as observed from the electronic component side in a transmission mode using an X-ray.

Abstract: An image pickup module includes a printed wiring board, an electronic component, solder, and a thermosetting resin. The printed wiring board has a first surface provided with first lands. The electronic component includes an image pickup element and has a second surface provided with second lands. The thermosetting resin is in contact with the solder and bonds the printed wiring board to the electronic component. The solder bonds the first lands to the second lands and has a hollow portion. The area of the hollow portion is 5% to 50% of the total area of the solder as observed from the electronic component side in a transmission mode using an X-ray.

Abstract: The printed circuit board (100) includes the interposer (2) where the semiconductor element (1) is mounted and the electrode pad (8) is formed on one surface, the printed wiring board (3) where the electrode pad (9) is formed on one surface facing the interposer (2), and the joint material (70) for bonding the electrode pads (8) and (9). The joint material (70) includes the solder layer (60) formed by the solder material (11) and the metal layers (50), (50) provided to the electrode pads (8) and (9). Each metal layer (50) includes the metal particle aggregate (10) in which metal particles are integrated with voids and is formed by filling the voids in the metal particle aggregate (10) with melted solder material (11). It is possible to ensure the height of the solder, improve reliability of the bonding, and downsize the semiconductor device by using such joint material.

Abstract: In a semiconductor device according to the present invention, a solder resist has a plurality of openings that expose electrodes. Solder bumps are formed in the openings and each have a solder ball portion protruding from the corresponding opening. The height of the openings is set to increase with increasing gap distance between the electrodes of an interposer substrate and board electrodes of a printed wiring board on which the semiconductor device is mounted. Thus, the solder bumps that correspond to sections where the gap distance is large can be increased in height, whereas the solder bumps that correspond to sections where the gap distance is small can be decreased in height, thereby avoiding the occurrence of defective joints caused by a reduction in size and thickness of the interposer substrate, as well as extending the lifespan of solder joints.

Abstract: The printed circuit board (100) includes the interposer (2) where the semiconductor element (1) is mounted and the electrode pad (8) is formed on one surface, the printed wiring board (3) where the electrode pad (9) is formed on one surface facing the interposer (2), and the joint material (70) for bonding the electrode pads (8) and (9). The joint material (70) includes the solder layer (60) formed by the solder material (11) and the metal layers (50), (50) provided to the electrode pads (8) and (9). Each metal layer (50) includes the metal particle aggregate (10) in which metal particles are integrated with voids and is formed by filling the voids in the metal particle aggregate (10) with melted solder material (11). It is possible to ensure the height of the solder, improve reliability of the bonding, and downsize the semiconductor device by using such joint material.

Abstract: In a semiconductor device according to the present invention, a solder resist has a plurality of openings that expose electrodes. Solder bumps are formed in the openings and each have a solder ball portion protruding from the corresponding opening. The height of the openings is set to increase with increasing gap distance between the electrodes of an interposer substrate and board electrodes of a printed wiring board on which the semiconductor device is mounted. Thus, the solder bumps that correspond to sections where the gap distance is large can be increased in height, whereas the solder bumps that correspond to sections where the gap distance is small can be decreased in height, thereby avoiding the occurrence of defective joints caused by a reduction in size and thickness of the interposer substrate, as well as extending the lifespan of solder joints.