Patents by Inventor Yoshitomo Kojima

Yoshitomo Kojima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus for forming grooves on a wafer by use of a laser
    Patent number: 3991296
    Abstract: An apparatus for forming grooves in a semiconductor wafer by the use of a laser beam includes a movable stage on which the wafer is mounted and a transparent member mounted on the stage in a sealed manner and covering the wafer. A liquid is introduced into the space defined between the wafer and the transparent member.
    Type: Grant
    Filed: November 12, 1975
    Date of Patent: November 9, 1976
    Assignee: Nippon Electric Company, Ltd.
    Inventors: Yoshitomo Kojima, Hiroshi Suga