Patents by Inventor Yoshitomo Tomida

Yoshitomo Tomida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device and fabrication method therefor
    Patent number: 8415791
    Abstract: A semiconductor device includes a support plate having a hole formed therein and a conductor formed on a wall surface of the hole, a semiconductor element; and a conductive post formed by a conductor having a first end portion at one end, and a second end portion at an other end. The second end portion of the conductive post is connected to the semiconductor element, and a side surface of the conductive post is fixed to the conductor on the wall surface of the hole deformed by pressing force of the conductive post on a side closer to the first end portion than the second end portion.
    Type: Grant
    Filed: November 23, 2010
    Date of Patent: April 9, 2013
    Assignee: Ibiden Co., Ltd.
    Inventors: Kiyotaka Tsukada, Tetsuya Muraki, Atsunari Yamashita, Yoshitomo Tomida
  • Semiconductor device and production method thereof
    Patent number: 8278753
    Abstract: The semiconductor device comprises a support plate; a semiconductor element; and conductor posts consisting of a conductor having a first end at one end and a second end at the other end, the second end being connected to the semiconductor element and the conductor posts being connected to the support plate at a position on the side of the second end that is closer to the first end, wherein the conductor posts have a heat conductivity of approximately 200 W/m·K or higher and a Vickers hardness of approximately 70 or lower.
    Type: Grant
    Filed: November 23, 2010
    Date of Patent: October 2, 2012
    Assignee: Ibiden Co., Ltd.
    Inventors: Kiyotaka Tsukada, Tetsuya Muraki, Atsunari Yamashita, Yoshitomo Tomida
  • SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREOF
    Publication number: 20110121448
    Abstract: The semiconductor device comprises a support plate; a semiconductor element; and conductor posts consisting of a conductor having a first end at one end and a second end at the other end, the second end being connected to the semiconductor element and the conductor posts being connected to the support plate at a position on the side of the second end that is closer to the first end, wherein the conductor posts have a heat conductivity of approximately 200 W/m·K or higher and a Vickers hardness of approximately 70 or lower.
    Type: Application
    Filed: November 23, 2010
    Publication date: May 26, 2011
    Applicant: IBIDEN CO., LTD.
    Inventors: Kiyotaka TSUKADA, Tetsuya Muraki, Atsunari Yamashita, Yoshitomo Tomida
  • SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREFOR
    Publication number: 20110121450
    Abstract: A semiconductor device includes a support plate having a hole formed therein and a conductor formed on a wall surface of the hole, a semiconductor element; and a conductive post formed by a conductor having a first end portion at one end, and a second end portion at an other end. The second end portion of the conductive post is connected to the semiconductor element, and a side surface of the conductive post is fixed to the conductor on the wall surface of the hole deformed by pressing force of the conductive post on a side closer to the first end portion than the second end portion.
    Type: Application
    Filed: November 23, 2010
    Publication date: May 26, 2011
    Applicant: IBIDEN CO., LTD.
    Inventors: Kiyotaka Tsukada, Tetsuya Muraki, Atsunari Yamashita, Yoshitomo Tomida