Abstract: [Problems] To provide a process for producing a conductor built-in ceramic which can eliminate the need to conduct metallic lead wire processing, can suppress the entry of a foreign matter, dust and the like from gaps between bases formed in dewaxing and firing and can reduce a dielectric breakdown failure, and a conductor built-in ceramic produced by the production process. [Means for Solving Problems] A process for producing a conductor built-in ceramic, comprising the step of producing a molded product (11) for an energization part using a conduction mixture, containing an electroconductive ceramic powder and a binder, the step of holding the molded product (11) for an energization part within a mold (13) and filling a mixture (15), for a base, containing an insulating ceramic powder and a binder into the mold (13) to produce an element compact (17) comprising a molded product (11), for an energization part, covered with the mixture (15) for a base, and the step of firing the element compact (17).

Abstract: [Problems] To provide a process for producing a conductor built-in ceramic which can eliminate the need to conduct metallic lead wire processing, can suppress the entry of a foreign matter, dust and the like from gaps between bases formed in dewaxing and firing and can reduce a dielectric breakdown failure, and a conductor built-in ceramic produced by the production process. [Means for Solving Problems] A process for producing a conductor built-in ceramic, comprising the step of producing a molded product (11) for an energization part using a conduction mixture, containing an electroconductive ceramic powder and a binder, the step of holding the molded product (11) for an energization part within a mold (13) and filling a mixture (15), for a base, containing an insulating ceramic powder and a binder into the mold (13) to produce an element compact (17) comprising a molded product (11), for an energization part, covered with the mixture (15) for a base, and the step of firing the element compact (17).

Abstract: The present invention provides a low reflection glass plate which has an effect of reducing reflectance against light even at an incident angle of 60° sufficiently, in high yield. A process for producing a low reflection glass plate, characterized by the use of a treating fluid (1) comprising a resin B1, fine gold particles, an organic metal compound of at least one metal (M1) selected from the group consisting of iron, titanium and zirconium, and an organic solvent, and a treating fluid (2) comprising a film-forming compound, a resin B2 having the same thermal decomposition temperature as the resin B1 or a higher thermal decomposition temperature than the resin B1, wherein said process comprises applying the treating fluid (1) on the surface of a transparent glass substrate, followed by drying at a temperature of from 50 to 250° C. to remove the organic solvent, further applying the treating fluid (2), followed by drying at from 50 to 250° C.

Abstract: The present invention provides a low reflection glass plate which has an effect of reducing reflectance against light even at an incident angle of 60° sufficiently, in high yield. A process for producing a low reflection glass plate, characterized by the use of a treating fluid (1) comprising a resin B1, fine gold particles, an organic metal compound of at least one metal (M1) selected from the group consisting of iron, titanium and zirconium, and an organic solvent, and a treating fluid (2) comprising a film-forming compound, a resin B2 having the same thermal decomposition temperature as the resin B1 or a higher thermal decomposition temperature than the resin B1, wherein said process comprises applying the treating fluid (1) on the surface of a transparent glass substrate, followed by drying at a temperature of from 50 to 250° C. to remove the organic solvent, further applying the treating fluid (2), followed by drying at from 50 to 250° C.