Patents by Inventor Yoshiyuki Michiaki

Yoshiyuki Michiaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230279523
    Abstract: There are provided an inexpensive copper powder, which has a low content of oxygen even it has a small particle diameter and which has a high shrinkage starting temperature when it is heated, and a method for producing the same. While a molten metal of copper heated to a temperature, which is higher than the melting point of copper by 250 to 700° C. (preferably 350 to 650° C. and more preferably 450 to 600° C.), is allowed to drop, a high-pressure water is sprayed onto the heated molten metal of copper in a non-oxidizing atmosphere (such as an atmosphere of nitrogen, argon, hydrogen or carbon monoxide) to rapidly cool and solidify the heated molten metal of copper to produce a copper powder which has an average particle diameter of 1 to 10 ?m and a crystallite diameter Dx(200) of not less than 40 nm on (200) plane thereof, the content of oxygen in the copper powder being 0.7% by weight or less.
    Type: Application
    Filed: May 12, 2023
    Publication date: September 7, 2023
    Applicant: Dowa Electronics Materials Co., Ltd.
    Inventors: Masahiro Yoshida, Kenichi Inoue, Atsushi Ebara, Yoshiyuki Michiaki, Takahiro Yamada
  • Patent number: 11692241
    Abstract: While a molten metal of copper heated to a temperature, which is higher than the melting point of copper by 250 to 700° C. (preferably 350 to 650° C. and more preferably 450 to 600° C.), is allowed to drop, a high-pressure water is sprayed onto the heated molten metal of copper in a non-oxidizing atmosphere (such as an atmosphere of nitrogen, argon, hydrogen or carbon monoxide) to rapidly cool and solidify the heated molten metal of copper to produce a copper powder which has an average particle diameter of 1 to 10 ?m and a crystallite diameter Dx(200) of not less than 40 nm on (200) plane thereof, the content of oxygen in the copper powder being 0.7% by weight or less.
    Type: Grant
    Filed: December 21, 2017
    Date of Patent: July 4, 2023
    Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Masahiro Yoshida, Kenichi Inoue, Atsushi Ebara, Yoshiyuki Michiaki, Takahiro Yamada
  • Patent number: 11420256
    Abstract: A silver powder which has a small content of carbon and which is difficult to be agglutinated, and a method for producing the same. While a molten metal, which is prepared by melting silver to which 40 ppm or more of copper is added, is allowed to drop, a high-pressure water is sprayed onto the molten metal to rapidly cool and solidify the molten metal to produce a silver powder which contains 40 ppm or more of copper, 0.1% by weight or less of carbon and 0.
    Type: Grant
    Filed: September 18, 2018
    Date of Patent: August 23, 2022
    Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Yoshiyuki Michiaki, Masahiro Yoshida, Kenichi Inoue
  • Patent number: 11407030
    Abstract: There is provided a silver powder which has a small average particle diameter and a small thermal shrinkage percentage, and a method for producing the same. While a molten metal of silver heated to a temperature (1292 to 1692° C.), which is higher than the melting point (962° C.) of silver by 330 to 730° C., is allowed to drop, a high-pressure water is sprayed onto the molten metal of silver (preferably at a water pressure of 90 to 160 MPa) to rapidly cool and solidify the molten metal of silver to powderize silver to produce a silver powder which has an average particle diameter of 1 to 6 ?m and a shrinkage percentage of not greater than 8% (preferably not greater than 7%) at 500° C., the product of the average particle diameter by the shrinkage percentage at 500° C. being 1 to 11 ?m·% (preferably 1.5 to 10.5 ?m·%).
    Type: Grant
    Filed: November 2, 2020
    Date of Patent: August 9, 2022
    Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Atsushi Ebara, Kenichi Inoue, Yoshiyuki Michiaki, Takahiro Yamada, Masahiro Yoshida
  • Patent number: 11041229
    Abstract: An object of the present invention is to provide metal powder that can be used to form an external electrode, which is excellent in solder wettability and solder leach resistance while having a layer structure with fewer layers than in the related art and, furthermore, is excellent in electrical conductivity. This silver-coated alloy powder comprises a coating layer on a surface of an alloy core particle containing copper, nickel, zinc, and inevitable impurities, the coating layer containing silver.
    Type: Grant
    Filed: August 31, 2017
    Date of Patent: June 22, 2021
    Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Kyoso Masuda, Kenichi Inoue, Yuki Kaneshiro, Atsushi Ebara, Yoshiyuki Michiaki, Kozo Ogi, Takahiro Yamada, Masahiro Yoshida
  • Publication number: 20210078081
    Abstract: There is provided a silver powder which has a small average particle diameter and a small thermal shrinkage percentage, and a method for producing the same. While a molten metal of silver heated to a temperature (1292 to 1692° C.), which is higher than the melting point (962° C.) of silver by 330 to 730° C., is allowed to drop, a high-pressure water is sprayed onto the molten metal of silver (preferably at a water pressure of 90 to 160 MPa) to rapidly cool and solidify the molten metal of silver to powderize silver to produce a silver powder which has an average particle diameter of 1 to 6 ?m and a shrinkage percentage of not greater than 8% (preferably not greater than 7%) at 500° C., the product of the average particle diameter by the shrinkage percentage at 500° C. being 1 to 11 ?m·% (preferably 1.5 to 10.5 ?m·%).
    Type: Application
    Filed: November 2, 2020
    Publication date: March 18, 2021
    Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Atsushi Ebara, Kenichi Inoue, Yoshiyuki Michiaki, Takahiro Yamada, Masahiro Yoshida
  • Publication number: 20210046549
    Abstract: Provided is a soft magnetic powder capable of forming a powder magnetic core having a high magnetic permeability with a decreased oxygen content even when the particle size is small. There is provided a soft magnetic powder including Fe alloy containing Si which is a soft magnetic powder containing 0.1% to 15 mass % of Si, and having a product of D50 multiplied by [O] (D50×[O]) being 3.0 [?m·mass %] or less, wherein D50 represents a volume-based cumulative 50% particle size [?m] of the soft magnetic powder as measured by a laser diffraction particle size distribution analyzer, and [O] represents an oxygen content [mass %].
    Type: Application
    Filed: September 3, 2018
    Publication date: February 18, 2021
    Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Masahiro YOSHIDA, Yoshiyuki MICHIAKI, Kenichi INOUE
  • Patent number: 10828702
    Abstract: There is provided a silver powder which has a small average particle diameter and a small thermal shrinkage percentage, and a method for producing the same. While a molten metal of silver heated to a temperature (1292 to 1692° C.), which is higher than the melting point (962° C.) of silver by 330 to 730° C., is allowed to drop, a high-pressure water is sprayed onto the molten metal of silver (preferably at a water pressure of 90 to 160 MPa) to rapidly cool and solidify the molten metal of silver to powderize silver to produce a silver powder which has an average particle diameter of 1 to 6 ?m and a shrinkage percentage of not greater than 8% (preferably not greater than 7%) at 500° C., the product of the average particle diameter by the shrinkage percentage at 500° C. being 1 to 11 ?m·% (preferably 1.5 to 10.5 ?m·%).
    Type: Grant
    Filed: October 26, 2016
    Date of Patent: November 10, 2020
    Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Atsushi Ebara, Kenichi Inoue, Yoshiyuki Michiaki, Takahiro Yamada, Masahiro Yoshida
  • Publication number: 20200238388
    Abstract: A silver powder which has a small content of carbon and which is difficult to be agglutinated, and a method for producing the same. While a molten metal, which is prepared by melting silver to which 40 ppm or more of copper is added, is allowed to drop, a high-pressure water is sprayed onto the molten metal to rapidly cool and solidify the molten metal to produce a silver powder which contains 40 ppm or more of copper, 0.1% by weight or less of carbon and 0.
    Type: Application
    Filed: September 18, 2018
    Publication date: July 30, 2020
    Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Yoshiyuki Michiaki, Masahiro Yoshida, Kenichi Inoue
  • Publication number: 20200122236
    Abstract: There are provided an inexpensive copper powder, which has a low content of oxygen even it has a small particle diameter and which has a high shrinkage starting temperature when it is heated, and a method for producing the same. While a molten metal of copper heated to a temperature, which is higher than the melting point of copper by 250 to 700° C. (preferably 350 to 650° C. and more preferably 450 to 600° C.), is allowed to drop, a high-pressure water is sprayed onto the heated molten metal of copper in a non-oxidizing atmosphere (such as an atmosphere of nitrogen, argon, hydrogen or carbon monoxide) to rapidly cool and solidify the heated molten metal of copper to produce a copper powder which has an average particle diameter of 1 to 10 ?m and a crystallite diameter Dx(200) of not less than 40 nm on (200) plane thereof, the content of oxygen in the copper powder being 0.7% by weight or less.
    Type: Application
    Filed: December 21, 2017
    Publication date: April 23, 2020
    Applicant: Dowa Electronics Materials Co., Ltd.
    Inventors: Masahiro Yoshida, Kenichi Inoue, Atsushi Ebara, Yoshiyuki Michiaki, Takahiro Yamada
  • Publication number: 20190194778
    Abstract: An object of the present invention is to provide metal powder that can be used to form an external electrode, which is excellent in solder wettability and solder leach resistance while having a layer structure with fewer layers than in the related art and, furthermore, is excellent in electrical conductivity. This silver-coated alloy powder comprises a coating layer on a surface of an alloy core particle containing copper, nickel, zinc, and inevitable impurities, the coating layer containing silver.
    Type: Application
    Filed: August 31, 2017
    Publication date: June 27, 2019
    Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Kyoso MASUDA, Kenichi INOUE, Yuki KANESHIRO, Atsushi EBARA, Yoshiyuki MICHIAKI, Kozo OGI, Takahiro YAMADA, Masahiro YOSHIDA
  • Publication number: 20190009341
    Abstract: While a molten metal obtained by melting silver and a metal, which is selected from the group consisting of tin, zinc, lead and indium, in an atmosphere of nitrogen is allowed to drop, a high-pressure water (preferably pure water or alkaline water) is sprayed onto the molten metal in the atmosphere or an atmosphere of nitrogen to rapidly cool and solidify the molten metal to produce a silver alloy powder which comprises silver and the metal which is selected from the group consisting of tin, zinc, lead and indium and which has an average particle diameter of 0.5 to 20 ?m, the silver alloy powder having a temperature of not higher than 300° C. at a shrinking percentage of 0.5%, a temperature of not higher than 400° C. at a shrinking percentage of 1.0% and a temperature of not higher than 450° C. at a shrinking percentage of 1.5% in a thermomechanical analysis.
    Type: Application
    Filed: December 26, 2016
    Publication date: January 10, 2019
    Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Masahiro YOSHIDA, Yoshiyuki MICHIAKI, Kenichi INOUE
  • Patent number: 10170213
    Abstract: There is provided a silver powder, which is able to obtain a conductive paste having a high thixotropic ratio and a high Casson yield value and which is able to form a conductive pattern having a low resistance, and a method for producing the same. An aliphatic amine such as hexadecylamine is added to a silver powder, the surface of which is coated with a fatty acid such as stearic acid, to be stirred and mixed to form the aliphatic amine on the outermost surface of the silver powder while allowing the fatty acid to react with the aliphatic amine to form an aliphatic amide such as hexadecanamide between the fatty acid and the aliphatic amine.
    Type: Grant
    Filed: January 2, 2018
    Date of Patent: January 1, 2019
    Assignee: Dowa Electronics Materials Co., Ltd.
    Inventors: Yoshiyuki Michiaki, Hiroshi Kamiga
  • Publication number: 20180326497
    Abstract: There is provided a silver powder which has a small average particle diameter and a small thermal shrinkage percentage, and a method for producing the same. While a molten metal of silver heated to a temperature (1292 to 1692° C.), which is higher than the melting point (962° C.) of silver by 330 to 730° C., is allowed to drop, a high-pressure water is sprayed onto the molten metal of silver (preferably at a water pressure of 90 to 160 MPa) to rapidly cool and solidify the molten metal of silver to powderize silver to produce a silver powder which has an average particle diameter of 1 to 6 ?m and a shrinkage percentage of not greater than 8% (preferably not greater than 7%) at 500° C., the product of the average particle diameter by the shrinkage percentage at 500° C. being 1 to 11 ?m·% (preferably 1.5 to 10.5 ?m·%).
    Type: Application
    Filed: October 26, 2016
    Publication date: November 15, 2018
    Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Atsushi Ebara, Kenichi Inoue, Yoshiyuki Michiaki, Takahiro Yamada, Masahiro Yoshida
  • Publication number: 20180158564
    Abstract: There is provided a silver powder, which is able to obtain a conductive paste having a high thixotropic ratio and a high Casson yield value and which is able to form a conductive pattern having a low resistance, and a method for producing the same. An aliphatic amine such as hexadecylamine is added to a silver powder, the surface of which is coated with a fatty acid such as stearic acid, to be stirred and mixed to form the aliphatic amine on the outermost surface of the silver powder while allowing the fatty acid to react with the aliphatic amine to form an aliphatic amide such as hexadecanamide between the fatty acid and the aliphatic amine.
    Type: Application
    Filed: January 2, 2018
    Publication date: June 7, 2018
    Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Yoshiyuki Michiaki, Hiroshi Kamiga
  • Patent number: 9984788
    Abstract: There is provided a silver powder, which is able to obtain a conductive paste having a high thixotropic ratio and a high Casson yield value and which is able to form a conductive pattern having a low resistance, and a method for producing the same. An aliphatic amine such as hexadecylamine is added to a silver powder, the surface of which is coated with a fatty acid such as stearic acid, to be stirred and mixed to form the aliphatic amine on the outermost surface of the silver powder while allowing the fatty acid to react with the aliphatic amine to form an aliphatic amide such as hexadecanamide between the fatty acid and the aliphatic amine.
    Type: Grant
    Filed: July 24, 2015
    Date of Patent: May 29, 2018
    Assignee: Dowa Electronics Materials Co., Ltd.
    Inventors: Yoshiyuki Michiaki, Hiroshi Kamiga
  • Publication number: 20170206998
    Abstract: There is provided a silver powder, which is able to obtain a conductive paste having a high thixotropic ratio and a high Casson yield value and which is able to form a conductive pattern having a low resistance, and a method for producing the same. An aliphatic amine such as hexadecylamine is added to a silver powder, the surface of which is coated with a fatty acid such as stearic acid, to be stirred and mixed to form the aliphatic amine on the outermost surface of the silver powder while allowing the fatty acid to react with the aliphatic amine to form an aliphatic amide such as hexadecanamide between the fatty acid and the aliphatic amine.
    Type: Application
    Filed: July 24, 2015
    Publication date: July 20, 2017
    Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Yoshiyuki Michiaki, Hiroshi Kamiga
  • Patent number: 9114389
    Abstract: Provided is a catalyst having the ability to combust PM at relatively low temperatures and having high HC and CO removal (conversion) efficiency even at the above operating temperature. In the catalyst composition, at least one kind of platinum group element selected from Pt, Rh, and Pd is dispersed in and supported by a platinum group-supporting carrier containing at least one kind of element selected from Zr, Al, Y, Si, Bi, Pr, and Tb, and the platinum group-supporting carrier is supported on the surface of a Ce oxide containing Ce as an essential component. The catalyst composition has both PM combustion activity and gas purification activity.
    Type: Grant
    Filed: May 10, 2011
    Date of Patent: August 25, 2015
    Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Yoshiyuki Michiaki, Takuma Honda, Shin Hamada
  • Patent number: 9006131
    Abstract: A composite oxide for an exhaust gas purification catalyst is provided which can burn PM in diesel engine exhaust gas at low temperatures and has a good S desorption property. The composite oxide for an exhaust gas purification catalyst is composed of Ce, Bi, Pr, R, and oxygen in a molar ratio of Ce:Bi:Pr:R=(1?x?y?z):x:y:z. The ratios of Ce, Bi, Pr, and R satisfy 0<x+y+z?0.5 and preferably 0<x?0.1, 0<y?0.25, and 0<z?0.3. Particularly, when R is Zr, the composite oxide exhibits a good S desorption property at a temperature of about 600° C. and can recover its catalytic activity at low temperatures. Therefore, the exhaust gas purification catalyst is suitable as a PM combustion catalyst.
    Type: Grant
    Filed: September 28, 2009
    Date of Patent: April 14, 2015
    Assignee: Dowa Electronics Materials Co., Ltd.
    Inventors: Yoshiyuki Michiaki, Yoshichika Horikawa
  • Publication number: 20130095997
    Abstract: Provided is a catalyst having the ability to combust PM at relatively low temperatures and having high HC and CO removal (conversion) efficiency even at the above operating temperature. In the catalyst composition, at least one kind of platinum group element selected from Pt, Rh, and Pd is dispersed in and supported by a platinum group-supporting carrier containing at least one kind of element selected from Zr, Al, Y, Si, Bi, Pr, and Tb, and the platinum group-supporting carrier is supported on the surface of a Ce oxide containing Ce as an essential component. The catalyst composition has both PM combustion activity and gas purification activity.
    Type: Application
    Filed: May 10, 2011
    Publication date: April 18, 2013
    Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Yoshiyuki Michiaki, Takuma Honda, Shin Hamada