Abstract: In a power grid stabilization system, a second energy storage system has a larger energy storage capacity than a first energy storage system. A bidirectional AC/DC converter is connected between an AC power grid and a pair of input and output terminals of the first energy storage system. A first bidirectional DC/DC converter is connected between the pair of input and output terminals of the first energy storage system and a pair of input and output terminals of the second energy storage system.

Abstract: The aim of the present invention is to provide a method capable of producing an optically active pyrimidinamide derivative on an industrial scale. Compound (I) or a salt thereof is subjected to an asymmetric reduction reaction, the obtained compound (II) or a salt thereof is subjected to a deprotection reaction, and the obtained compound (III) or a salt thereof is reacted with compound (VI) or a salt thereof to obtain compound (V) or a salt thereof. wherein each symbol is as defined in the specification.

Abstract: The aim of the present invention is to provide a method capable of producing an optically active pyrimidinamide derivative on an industrial scale. Compound (I) or a salt thereof is subjected to an asymmetric reduction reaction, the obtained compound (II) or a salt thereof is subjected to a deprotection reaction, and the obtained compound (III) or a salt thereof is reacted with compound (VI) or a salt thereof to obtain compound (V) or a salt thereof. wherein each symbol is as defined in the specification.

Abstract: The aim of the present invention is to provide a method capable of producing an optically active pyrimidinamide derivative on an industrial scale. Compound (I) or a salt thereof is subjected to an asymmetric reduction reaction, the obtained compound (II) or a salt thereof is subjected to a deprotection reaction, and the obtained compound (III) or a salt thereof is reacted with compound (VI) or a salt thereof to obtain compound (V) or a salt thereof. wherein each symbol is as defined in the specification.

Abstract: ‘Kiyoka’ is a new variety of tea plant bred by crossbreeding FYZ-41 (‘Yabukita’ x ‘Shizuinzatsu 131’), a hybrid, as the female parent and ‘Saemidori’ as the male parent. The plant may be used, e.g., for cultivation of tea leaves and leaf buds for consumption. The steamed leaves and leaf buds of ‘Kiyoka’ have a distinctive floral aroma, and excellent taste.

Abstract: A medium transporting apparatus includes a placement section, a transport unit, and a separation unit having an inclined surface, wherein the transport unit includes a transport roller that can be moved in a transport direction, a force to move the transport roller to the upstream side in the transport direction is applied from a medium to the transport roller as a counteracting force against a force for the transport roller to transport the medium to the downstream side in the transport direction, and when the counteracting force becomes larger than a predetermined force, the transport roller is moved to the upstream side in the transport direction by the counteracting force.

Abstract: The present invention discloses a thermosetting resin composition which comprises (A) 35 to 75 parts by weight of a thermosetting resin comprising a compound having a hydrobenzoxazine ring as a main component, (B) 10 to 25 parts by weight of a polycondensation product of a phenol, a compound having a triazine ring and an aldehyde, and (C) 10 to 45 parts by weight of an epoxy resin, based on 100 parts by weight of the total amount of organic solid components of Components (A), (B) and (C), and (i) a bisphenol F epoxy resin having a weight-average molecular weight of 1,000 to 3,000, or (ii) a mixed epoxy resin of bisphenol F epoxy resin and bisphenol A epoxy resin having a weight average molecular weight of 1,000 to 3,000, is contained in Component (C) in an amount of 0 to 100% by weight of Component (C); and a prepreg, a laminated board for a wiring board and a wiring board using the same.

Abstract: Disclosed are a varnish for laminate or prepreg, comprising a heat treatment product which is obtained by mixing together (a) an epoxy resin, (b) dicyandiamide, and (c) a compound having an imidazole ring so that the component (c) is present in an amount of 0.001 to 0.03% by weight, based on the weight of the component (a), and subjecting the resultant mixture to reaction for heat treatment in an organic solvent at a temperature of 70° C. to less than 140° C. so that all of the components are compatible with one another in the absence of a solvent; and (d) inorganic filler, a laminate or prepreg prepared using the varnish and a printed wiring board prepared using the laminate and/or prepreg.

Abstract: Disclosed are a varnish for laminate or prepreg, comprising a heat treatment product which is obtained by mixing together (a) an epoxy resin, (b) dicyandiamide, and (c) a compound having an imidazole ring so that the component (c) is present in an amount of 0.001 to 0.03% by weight, based on the weight of the component (a), and subjecting the resultant mixture to reaction for heat treatment in an organic solvent at a temperature of 70° C. to less than 140° C. so that all of the components are compatible with one another in the absence of a solvent; and (d) inorganic filler, a laminate or prepreg prepared using the varnish and a printed wiring board prepared using the laminate and/or prepreg.

Abstract: Disclosed are a varnish for laminate or prepreg, comprising a heat treatment product which is obtained by mixing together (a) an epoxy resin, (b) dicyandiamide, and (c) a compound having an imidazole ring so that the component (c) is present in an amount of 0.001 to 0.03% by weight, based on the weight of the component (a), and subjecting the resultant mixture to reaction for heat treatment in an organic solvent at a temperature of 70° C. to less than 140° C. so that all of the components are compatible with one another in the absence of a solvent; and (d) inorganic filler, a laminate or prepreg prepared using the varnish and a printed wiring board prepared using the laminate and/or prepreg.

Abstract: The present invention discloses a thermosetting resin composition which comprises (A) 35 to 75 parts by weight of a thermosetting resin comprising a compound having a hydrobenzoxazine ring as a main component, (B) 10 to 25 parts by weight of a polycondensation product of a phenol, a compound having a triazine ring and an aldehyde, and (C) 10 to 45 parts by weight of an epoxy resin, based on 100 parts by weight of the total amount of organic solid components of Components (A), (B) and (C), and (i) a bisphenol F epoxy resin having a weight-average molecular weight of 1,000 to 3,000, or (ii) a mixed epoxy resin of bisphenol F epoxy resin and bisphenol A epoxy resin having a weight average molecular weight of 1,000 to 3,000, is contained in Component (C) in an amount of 0 to 100% by weight of Component (C); and a prepreg, a laminated board for a wiring board and a wiring board using the same.

Abstract: The present invention discloses a thermosetting resin composition which comprises (A) 35 to 75 parts by weight of a thermosetting resin comprising a compound having a dihydrobenzoxazine ring as a main component, (B) 10 to 25 parts by weight of a polycondensation product of a phenol, a compound having a triazine ring and an aldehyde, and (C) 10 to 45 parts by weight of an epoxy resin, based on 100 parts by weight of the total amount of organic solid components of Components (A), (B) and (C), and (i) a bisphenol F epoxy resin having a weight average molecular weight of 1,000 to 3,000, or (ii) a mixed epoxy resin of bisphenol F epoxy resin and bisphenol A epoxy resin having a weight average molecular weight of 1,000 to 3,000, is contained in Component (C) in an amount of 0 to 100% by weight of Component (C); and a prepreg, a laminated board for a wiring board and a wiring board using the same.

Abstract: The present invention relates to a resin composition containing an epoxy resin, an amine-type curing agent, an organophosphorus compound having a structure represented by formula 1 and an organic solvent, wherein the epoxy resin and the organophosphorus compound has been compounded at a temperature of 50° C. or lower. The resin composition has enough flame retardancy without containing any halogen-containing flame retarder, has good heat resistance and good chemical resistance, and causes no problems with respect to reaction stability or curability caused by consumption of an epoxy resin through a reaction occurring during compounding of the resin composition.

Abstract: Disclosed are a varnish for laminate or prepreg, comprising a heat treatment product which is obtained by mixing together (a) an epoxy resin, (b) dicyandiamide, and (c) a compound having an imidazole ring so that the component (c) is present in an amount of 0.001 to 0.03% by weight, based on the weight of the component (a), and subjecting the resultant mixture to reaction for heat treatment in an organic solvent at a temperature of 70° C. to less than 140° C. so that all of the components are compatible with one another in the absence of a solvent; and (d) inorganic filler, a laminate or prepreg prepared using the varnish and a printed wiring board prepared using the laminate and/or prepreg.

Abstract: A fixing device includes a pressure application roller 120 pressed against a fixing belt 110 (or fixing roller) to be heated. One of the them is driven while the other follows the one in rotation. A recording medium S having a toner image thereon is moved to pass through a central part N1 of a press contact portion N, whereby the toner image is fused and fixed on the recording medium. High grip portions G are provided on both side ends of the fixing belt or the pressure application roller.

Abstract: A fixing device includes a pressure application roller 120 pressed against a fixing belt 110 (or fixing roller) to be heated. One of the them is driven while the other follows the one in rotation. A recording medium S having a toner image thereon is moved to pass through a central part N1 of a press contact portion N, whereby the toner image is fused and fixed on the recording medium. High grip portions G are provided on both side ends of the fixing belt or the pressure application roller.

Abstract: A fixing device includes a pressure application roller 120 pressed against a fixing belt 110 (or fixing roller) to be heated. One of the them is driven while the other follows the one in rotation. A recording medium S having a toner image thereon is moved to pass through a central part N1 of a press contact portion N, whereby the toner image is fused and fixed on the recording medium. High grip portions G are provided on both side ends of the fixing belt or the pressure application roller.

Abstract: The present invention relates to a resin composition containing an epoxy resin, an amine-type curing agent, an organophosphorus compound having a structure represented by formula 1 and an organic solvent, wherein the epoxy resin and the organophosphorus compound has been compounded at a temperature of 50° C. or lower. The resin composition has enough flame retardancy without containing any halogen-containing flame retarder, has good heat resistance and good chemical resistance, and causes no problems with respect to reaction stability or curability caused by consumption of an epoxy resin through a reaction occurring during compounding of the resin composition.

Abstract: A flame retardant epoxy resin composition which can improve heat resistance and exhibit an excellent adhesion strength and insulation reliability when applied to a printed circuit board or to a multilayered interconnection laminate is provided, and a prepreg and a metal foil clad laminate using the same composition are manufactured. This flame retardant epoxy resin composition consists of: (a) an epoxy resin containing a glicidylether compound which is a condensate of bisphenol A or bisphenol F with formaldehyde; (b) a condensate of bisphenol A with formaldehyde; (c) haloganated bisphenol A as a flame retardant agent; and (d) a hardening accelerator, wherein the haloganated bisphenol A is contained in 45 weight % or less of a total solid resin weight. A metal foil clad laminate is provided using this composition as a varnish, impregnating the same into a base material to obtain the prepreg, laminating the prepreg, depositing a metal foil on one or both surfaces thereof, and heating under pressure.

Abstract: ‘Kiyoka’ is a new variety of tea plant bred by crossbreeding FYZ-41 (‘Yabukita’ x ‘Shizuinzatsu 131’), a hybrid, as the female parent and ‘Saemidori’ as the male parent. The steamed leaves and leaf buds of ‘Kiyoka’ have a distinctive floral aroma, and excellent taste.