Abstract: A display device is formed by burying at least part of a light emitting device in an insulating material, wherein a drive electrode for the light emitting device is formed so as to be extracted on a surface of the insulating material. A display unit is produced by two-dimensionally arraying such light emitting devices on a base body. Since the display device is modularized by burying a light emitting device finely formed in an insulating material, to re-shape the light emitting device into a size easy to handle, it is possible to suppress the production cost of the display unit using such display devices, and to ensure a desirable handling performance of the light emitting device; for example, facilitate the carrying of the light emitting device or the mounting thereof on a base body.

Abstract: A device transfer method includes the steps of: covering a plurality of devices, which have been formed on a substrate, with a resin layer; forming electrodes in the resin layer in such a manner that the electrodes are connected to the devices; cutting the resin layer, to obtain resin buried devices each containing at least one of the devices; and peeling the resin buried devices from the substrate and transferring them to a device transfer body. This device transfer method is advantageous in easily, smoothly separating devices from each other, and facilitating handling of the devices in a transfer step and ensuring good electric connection between the devices and external wiring, even if the devices are fine devices.

Abstract: There are provided a base member 14, a position restriction mechanism 15, a height restriction mechanism 17, an evenness holding mechanism, and an alignment mechanism 20, 22. A plurality of semiconductor modules is serially layered on the base member. Each semiconductor module comprises a semiconductor chip 7 mounted on a printed-wiring board 6 and a bump 13 formed on an interlayer connection land 8. The position restriction mechanism 15 restricts respective positions of the semiconductor modules 2 to be layered on the base member 14. The height restriction mechanism 17 restricts the height of the entire layered semiconductor module unit 4 layered on the base member 14. The evenness holding mechanism maintains evenness of the semiconductor module 2. The alignment mechanism 20, 22 aligns a mother substrate 5 on which a multilayer semiconductor module unit 4 is mounted.

Abstract: A method of selectively transferring devices arrayed on a first substrate to a second substrate on which an adhesive resin layer is previously formed is provided. The method includes steps of selectively heating the adhesive resin layer on the second substrate by laser irradiation from the back surface side of the second substrate, and curing the selectively heated portions of the adhesive resin layer, thereby adhesively bonding those to be transferred of the devices to the second substrate. At this time, portions, corresponding to the devices, of the adhesive layer are heated directly or indirectly via the devices or wiring portions by laser irradiation from the back surface side of the substrate. The heated portions of the adhesive resin layer selectively exhibit the adhesive forces. The heated portions of the adhesive layer are then cured, so that only the devices to be transferred are selectively transferred to the second substrate.

Abstract: A method of selectively transferring devices arrayed on a first substrate to a second substrate on which an adhesive resin layer is previously formed is provided. The method includes steps of selectively heating the adhesive resin layer on the second substrate by laser irradiation from the back surface side of the second substrate, and curing the selectively heated portions of the adhesive resin layer, thereby adhesively bonding those to be transferred of the devices to the second substrate. At this time, portions, corresponding to the devices, of the adhesive layer are heated directly or indirectly via the devices or wiring portions by laser irradiation from the back surface side of the substrate. The heated portions of the adhesive resin layer selectively exhibit the adhesive forces. The heated portions of the adhesive layer are then cured, so that only the devices to be transferred are selectively transferred to the second substrate.

Abstract: A method of selectively transferring devices arrayed on a first substrate to a second substrate on which an adhesive resin layer is previously formed is provided. The method includes steps of selectively heating the adhesive resin layer on the second substrate by laser irradiation from the back surface side of the second substrate, and curing the selectively heated portions of the adhesive resin layer, thereby adhesively bonding those to be transferred of the devices to the second substrate. At this time, portions, corresponding to the devices, of the adhesive layer are heated directly or indirectly via the devices or wiring portions by laser irradiation from the back surface side of the substrate. The heated portions of the adhesive resin layer selectively exhibit the adhesive forces. The heated portions of the adhesive layer are then cured, so that only the devices to be transferred are selectively transferred to the second substrate.

Abstract: A method of selectively transferring devices arrayed on a first substrate to a second substrate on which an adhesive resin layer is previously formed is provided. The method includes steps of selectively heating the adhesive resin layer on the second substrate by laser irradiation from the back surface side of the second substrate, and curing the selectively heated portions of the adhesive resin layer, thereby adhesively bonding those to be transferred of the devices to the second substrate. At this time, portions, corresponding to the devices, of the adhesive layer are heated directly or indirectly via the devices or wiring portions by laser irradiation from the back surface side of the substrate. The heated portions of the adhesive resin layer selectively exhibit the adhesive forces. The heated portions of the adhesive layer are then cured, so that only the devices to be transferred are selectively transferred to the second substrate.

Abstract: A projector includes: a light source unit; an optical apparatus including, an optical device, a holding frame for holding a periphery of the optical device, a cooling tube that is provided in the holding frame along the periphery of the optical device and in which a cooling fluid flows, wherein a gap between the holding frame and the cooling tube is filled with a thermally conductive material; a cooling unit for circulating the cooling fluid in the optical apparatus; and a projection optical apparatus for enlarging and projecting an optical image formed by means of the optical apparatus.

Abstract: A method of selectively transferring devices arrayed on a first substrate to a second substrate on which an adhesive resin layer is previously formed is provided. The method includes steps of selectively heating the adhesive resin layer on the second substrate by laser irradiation from the back surface side of the second substrate, and curing the selectively heated portions of the adhesive resin layer, thereby adhesively bonding those to be transferred of the devices to the second substrate. At this time, portions, corresponding to the devices, of the adhesive layer are heated directly or indirectly via the devices or wiring portions by laser irradiation from the back surface side of the substrate. The heated portions of the adhesive resin layer selectively exhibit the adhesive forces. The heated portions of the adhesive layer are then cured, so that only the devices to be transferred are selectively transferred to the second substrate.

Abstract: A method for forming via holes includes placing an insulating layer on a first wiring layer, forming opening portions in the insulating layer, and forming a second wiring layer on the insulating layer. At the time of forming the opening portions, the insulating layer is irradiated with a laser beam with the focus position staggered.

Abstract: An optical device and a projector having the optical device is provided, which have a liquid-crystal display having, on an exit side, a first exit polarizer plate and a second exit polarizer plate arranged thermally insulated from each other and separated in an optical axis direction, the first exit polarizer plate being bonded on a first heat conductor plate which is bonded on an incident surface of a color-combining optical unit while the second exit polarizer plate is bonded on a second heat conductor plate held by a polarization-plate holding frame. By heat release through respective independent routes, it is possible to suppress the deterioration due to the temperature rise on the exit polarizer plates and liquid-crystal display.

Abstract: The invention provides a holder frame, optical device and projector which can prevent the substrate from deviating in position, the substrate from being compressed at the outer periphery and color unevenness from occurring. More particularly, in the four sides of a luminous-flux incident surface of a holder frame, there can be formed a plurality of cutouts extending from a vicinity of an opening to an outer edge of the luminous-flux incident surface and nearly orthogonal to a lengthwise of each side. Also, in the four sides of an accommodating surface of the holder frame, there are formed a plurality of cutouts extending from a vicinity of an opening to an outer edge of the accommodating surface and nearly orthogonal to a lengthwise of each side. The cutouts in each side of the accommodating surface of the holder frame are formed in positions between the cutouts formed in each side of the luminous-flux incident surface of the holder frame as viewed from a side of luminance-flux incidence.

Abstract: The invention provides a fixing plate, optical device and projector capable of preventing against color unevenness occurrence and pixel deviation. Specifically, in each of the four sides of a luminous-flux exit surface of a plate part of a fixing plate, there can alternately be formed a first cutout in a groove form extending from an opening toward an outer edge of the plate part and nearly orthogonal to a lengthwise of each side, and a second cutout in a groove form extending from the outer edge toward the opening and nearly orthogonal to the lengthwise of each side.

Abstract: A projector including: a light source device; an optical device including, an optical modulator that modulates a luminous flux from a light source in response to image information, an optical modulator holding frame that holds the periphery of the optical modulator, and an optical modulator cooling duct that is disposed, along the periphery of the optical modulator, within the optical modulator holding frame, and that allows a cooling fluid to flow therethrough; and a projection optical device that magnifies and projects an optical image formed by the optical device.

Abstract: A display device is formed by burying at least part of a light emitting device in an insulating material, wherein a drive electrode for the light emitting device is formed so as to be extracted on a surface of the insulating material. A display unit is produced by two-dimensionally arraying such light emitting devices on a base body. Since the display device is modularized by burying a light emitting device finely formed in an insulating material, to re-shape the light emitting device into a size easy to handle, it is possible to suppress the production cost of the display unit using such display devices, and to ensure a desirable handling performance of the light emitting device; for example, facilitate the carrying of the light emitting device or the mounting thereof on a base body.

Abstract: A method for forming via holes includes placing an insulating layer on a first wiring layer, forming opening portions in the insulating layer, and forming a second wiring layer on the insulating layer. At the time of forming the opening portions, the insulating layer is irradiated with a laser beam with the focus position staggered.

Abstract: An optical apparatus includes a color synthesizing prism, a plurality of exit-side polarizer plates which are respectively arranged on the light entrance side faces of the color synthesizing prism through entrance-side heat conduction plates, a plurality of liquid-crystal display devices which are respectively arranged on the entrance sides of the plurality of exit-side polarizer plates, and a plurality of entrance-side polarizer plates which are respectively arranged on the entrance sides of the plurality of liquid-crystal display devices. The entrance-side heat conduction plate which is located in the optical path of colored light generating the largest quantity of heat can be arranged in heat insulation from the entrance-side heat conduction plates which are located in the optical paths of the other colored lights, and it can be joined to an armoring case through heat conduction members.

Abstract: Heat of optical devices is transferred to a bottom surface portion 512B of an optical parts housing portion 512 of an optical parts casing 5A. A duct 6 is formed on the bottom surface portion 512B. A cooling air passing through a first passage 6A cools the bottom surface portion 512B, and then is supplied to a hole 515R to cool a liquid crystal panel 441R, etc. The cooling air passing through a second passage 6B of the duct 6 is introduced into holes 515B, 515G to cool the liquid crystal panels 441B, 441G. Accordingly, the optical parts casing projector capable of cooling sufficiently the optical modulator devices and other parts, e.g., the bottom surface portion, etc. of the optical parts casing.

Abstract: A method for forming via holes includes placing an insulating layer on a first wiring layer, forming opening portions in the insulating layer, and forming a second wiring layer on the insulating layer. At the time of forming the opening portions, the insulating layer is irradiated with a laser beam with the focus position staggered.

Abstract: A method for forming via holes includes placing an insulating layer on a first wiring layer, forming opening portions in the insulating layer, and forming a second wiring layer on the insulating layer. At the time of forming the opening portions, the insulating layer is irradiated with a laser beam with the focus position staggered.