Patents by Inventor Yosi Schacham-Diamand

Yosi Schacham-Diamand has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5695810
    Abstract: A technique for electrolessly depositing a CoWP barrier material on to copper and electrolessly depositing copper onto a CoWP barrier material to prevent copper diffusion when forming layers and/or structures on a semiconductor wafer.
    Type: Grant
    Filed: November 20, 1996
    Date of Patent: December 9, 1997
    Assignees: Cornell Research Foundation, Inc., Sematech, Inc., Intel Corporation
    Inventors: Valery M. Dubin, Yosi Schacham-Diamand, Bin Zhao, Prahalad K. Vasudev, Chiu H. Ting