Patents by Inventor Yosuke IWASA
Yosuke IWASA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10242939Abstract: A semiconductor device includes: an oscillator; a semiconductor chip that includes an oscillation circuit connected to the oscillator, a timer circuit that generates a timing signal of a frequency according to a oscillation frequency of the oscillation circuit, and a frequency correction section that corrects a frequency of the timing signal based on temperature data; and a discrete device that includes at least one of a temperature sensing device that detects a peripheral temperature, that supplies the detected temperature as temperature data to the frequency correction section, and that is provided as a separate body to the semiconductor chip, or a capacitor that is electrically connected to both the oscillator and the oscillation circuit and that is provided as a separate body to the semiconductor chip, wherein the oscillator, the semiconductor chip and the discrete device are contained within a single package.Type: GrantFiled: January 15, 2018Date of Patent: March 26, 2019Assignee: LAPIS Semiconductor Co., Ltd.Inventor: Yosuke Iwasa
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Publication number: 20180158763Abstract: A semiconductor device includes: an oscillator; a semiconductor chip that includes an oscillation circuit connected to the oscillator, a timer circuit that generates a timing signal of a frequency according to a oscillation frequency of the oscillation circuit, and a frequency correction section that corrects a frequency of the timing signal based on temperature data; and a discrete device that includes at least one of a temperature sensing device that detects a peripheral temperature, that supplies the detected temperature as temperature data to the frequency correction section, and that is provided as a separate body to the semiconductor chip, or a capacitor that is electrically connected to both the oscillator and the oscillation circuit and that is provided as a separate body to the semiconductor chip, wherein the oscillator, the semiconductor chip and the discrete device are contained within a single package.Type: ApplicationFiled: January 15, 2018Publication date: June 7, 2018Applicant: LAPIS Semiconductor Co., Ltd.Inventor: Yosuke IWASA
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Patent number: 9881855Abstract: A semiconductor device includes: an oscillator; a semiconductor chip that includes an oscillation circuit connected to the oscillator, a timer circuit that generates a timing signal of a frequency according to a oscillation frequency of the oscillation circuit, and a frequency correction section that corrects a frequency of the timing signal based on temperature data; and a discrete device that includes at least one of a temperature sensing device that detects a peripheral temperature, that supplies the detected temperature as temperature data to the frequency correction section, and that is provided as a separate body to the semiconductor chip, or a capacitor that is electrically connected to both the oscillator and the oscillation circuit and that is provided as a separate body to the semiconductor chip, wherein the oscillator, the semiconductor chip and the discrete device are contained within a single package.Type: GrantFiled: November 30, 2016Date of Patent: January 30, 2018Assignee: LAPIS Semiconductor Co., Ltd.Inventor: Yosuke Iwasa
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Patent number: 9703304Abstract: A voltage booster circuit includes a reference voltage generation circuit that generates a first potential and supplies the first potential to a first potential line; a booster section that supplies a second potential to a second potential line, the second potential being boosted from the first potential; a booster control section, connected to the second potential line, that controls the booster section in accordance with the second potential; a switch connected to the first potential line and the second potential line; and a control circuit that controls the switch in accordance with a potential difference between the first potential and the second potential.Type: GrantFiled: March 23, 2015Date of Patent: July 11, 2017Assignee: LAPIS SEMICONDUCTOR CO., LTD.Inventor: Yosuke Iwasa
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Patent number: 9634663Abstract: A semiconductor circuit including a level shifter circuit that, in accordance with supply of a power supply voltage, converts a potential of an input signal from a first potential to a second potential that is higher than the first potential and outputs the second potential through an output node; a potential supply circuit, to which a reset signal at a level in accordance with the power supply voltage is supplied, that supplies a predetermined potential in accordance with the level of the reset signal; and a control circuit that controls the potential of the output node of the level shifter circuit in accordance with the level of the predetermined potential supplied from the potential supply circuit.Type: GrantFiled: March 23, 2015Date of Patent: April 25, 2017Assignee: LAPIS SEMICONDUCTOR CO., LTD.Inventor: Yosuke Iwasa
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Patent number: 9606007Abstract: The present invention provides a semiconductor device and a measurement method that enables high precision measurement of temperature or humidity or the like over a wide range. A semiconductor device of the present invention determines which is faster out of a reference oscillation and a thermistor oscillation, and using the faster oscillation as a reference, measures a count value based on the other oscillation. Moreover, the count based on the faster oscillation is employed as a reference value, and a count value based on the other oscillation when the reference value is taken as a measurement value. A frequency ratio is computed based on the reference value and the measurement value, and based on the computed frequency ratio, a table expressing correspondence relationships between frequency ratio and temperature is referred to and a temperature acquired.Type: GrantFiled: March 21, 2014Date of Patent: March 28, 2017Assignee: LAPIS Semiconductor Co., Ltd.Inventor: Yosuke Iwasa
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Publication number: 20170084522Abstract: A semiconductor device includes: an oscillator; a semiconductor chip that includes an oscillation circuit connected to the oscillator, a timer circuit that generates a timing signal of a frequency according to a oscillation frequency of the oscillation circuit, and a frequency correction section that corrects a frequency of the timing signal based on temperature data; and a discrete device that includes at least one of a temperature sensing device that detects a peripheral temperature, that supplies the detected temperature as temperature data to the frequency correction section, and that is provided as a separate body to the semiconductor chip, or a capacitor that is electrically connected to both the oscillator and the oscillation circuit and that is provided as a separate body to the semiconductor chip, wherein the oscillator, the semiconductor chip and the discrete device are contained within a single package.Type: ApplicationFiled: November 30, 2016Publication date: March 23, 2017Applicant: LAPIS Semiconductor Co., Ltd.Inventor: Yosuke IWASA
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Patent number: 9543964Abstract: A semiconductor device includes: an oscillator; a semiconductor chip that includes an oscillation circuit connected to the oscillator, a timer circuit that generates a timing signal of a frequency according to a oscillation frequency of the oscillation circuit, and a frequency correction section that corrects a frequency of the timing signal based on temperature data; and a discrete device that includes at least one of a temperature sensing device that detects a peripheral temperature, that supplies the detected temperature as temperature data to the frequency correction section, and that is provided as a separate body to the semiconductor chip, or a capacitor that is electrically connected to both the oscillator and the oscillation circuit and that is provided as a separate body to the semiconductor chip, wherein the oscillator, the semiconductor chip and the discrete device are contained within a single package.Type: GrantFiled: October 30, 2015Date of Patent: January 10, 2017Assignee: LAPIS Semiconductor Co., Ltd.Inventor: Yosuke Iwasa
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Publication number: 20160049943Abstract: A semiconductor device includes: an oscillator; a semiconductor chip that includes an oscillation circuit connected to the oscillator, a timer circuit that generates a timing signal of a frequency according to a oscillation frequency of the oscillation circuit, and a frequency correction section that corrects a frequency of the timing signal based on temperature data; and a discrete device that includes at least one of a temperature sensing device that detects a peripheral temperature, that supplies the detected temperature as temperature data to the frequency correction section, and that is provided as a separate body to the semiconductor chip, or a capacitor that is electrically connected to both the oscillator and the oscillation circuit and that is provided as a separate body to the semiconductor chip, wherein the oscillator, the semiconductor chip and the discrete device are contained within a single package.Type: ApplicationFiled: October 30, 2015Publication date: February 18, 2016Applicant: LAPIS Semiconductor Co., Ltd.Inventor: Yosuke IWASA
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Patent number: 9252779Abstract: A semiconductor device. The semiconductor device includes: an oscillator; a semiconductor chip that includes an oscillation circuit connected to the oscillator, a timer circuit that generates a timing signal of a frequency according to a oscillation frequency of the oscillation circuit, and a frequency correction section that corrects a frequency of the timing signal based on temperature data; and a discrete device that includes at least one of a temperature sensing device that detects a peripheral temperature, that supplies the detected temperature as temperature data to the frequency correction section, and that is provided as a separate body to the semiconductor chip, or a capacitor that is electrically connected to both the oscillator and the oscillation circuit and that is provided as a separate body to the semiconductor chip, wherein the oscillator, the semiconductor chip and the discrete device are contained within a single package.Type: GrantFiled: September 12, 2013Date of Patent: February 2, 2016Assignee: LAPIS SEMICONDUCTOR CO., LTD.Inventor: Yosuke Iwasa
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Publication number: 20150280711Abstract: The present invention provides a semiconductor circuit including: a level shifter circuit that, in accordance with supply of a power supply voltage, converts a potential of an input signal from a first potential to a second potential that is higher than the first potential and outputs the second potential through an output node; a potential supply circuit, to which a reset signal at a level in accordance with the power supply voltage is supplied, that supplies a predetermined potential in accordance with the level of the reset signal; and a control circuit that controls the potential of the output node of the level shifter circuit in accordance with the level of the predetermined potential supplied from the potential supply circuit.Type: ApplicationFiled: March 23, 2015Publication date: October 1, 2015Inventor: YOSUKE IWASA
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Publication number: 20150277459Abstract: The present invention provides a voltage booster circuit including: a reference voltage generation circuit that generates a first potential and supplies the first potential to a first potential line; a booster section that supplies a second potential to a second potential line, the second potential being boosted from the first potential; a booster control section, connected to the second potential line, that controls the booster section in accordance with the second potential; a switch connected to the first potential line and the second potential line; and a control circuit that controls the switch in accordance with a potential difference between the first potential and the second potential.Type: ApplicationFiled: March 23, 2015Publication date: October 1, 2015Inventor: YOSUKE IWASA
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Patent number: 8848331Abstract: A protection device includes: a serial element unit that includes a first switching element and a resistive element, one end being connected to a control terminal of a protection-target switching element, the other end being connected to a first voltage line, the protection-target switching element including a first terminal connected to the first voltage line, a second terminal connected to a second voltage line and an inductor unit, and the control terminal, the protection-target switching element switching a conduction state at the normal time to a non-conduction state between the first terminal and the second terminal when an off-voltage is applied to the control terminal; a capacitance provided at the protection-target switching element and has a predetermined capacitance value; and a controller that performs control such that the first switching element is in a conduction state if the protection-target switching element is put into a non-conduction state.Type: GrantFiled: September 16, 2011Date of Patent: September 30, 2014Assignee: Lapis Semiconductor Co., Ltd.Inventors: Yosuke Iwasa, Atsuhiro Kai, Osamu Kuroki
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Publication number: 20140286472Abstract: The present invention provides a semiconductor device and a measurement method that enables high precision measurement of temperature or humidity or the like over a wide range. A semiconductor device of the present invention determines which is faster out of a reference oscillation and a thermistor oscillation, and using the faster oscillation as a reference, measures a count value based on the other oscillation. Moreover, the count based on the faster oscillation is employed as a reference value, and a count value based on the other oscillation when the reference value is taken as a measurement value. A frequency ratio is computed based on the reference value and the measurement value, and based on the computed frequency ratio, a table expressing correspondence relationships between frequency ratio and temperature is referred to and a temperature acquired.Type: ApplicationFiled: March 21, 2014Publication date: September 25, 2014Applicant: LAPIS SEMICONDUCTOR CO., LTD.Inventor: Yosuke IWASA
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Publication number: 20140077888Abstract: A semiconductor device. The semiconductor device includes: an oscillator; a semiconductor chip that includes an oscillation circuit connected to the oscillator, a timer circuit that generates a timing signal of a frequency according to a oscillation frequency of the oscillation circuit, and a frequency correction section that corrects a frequency of the timing signal based on temperature data; and a discrete device that includes at least one of a temperature sensing device that detects a peripheral temperature, that supplies the detected temperature as temperature data to the frequency correction section, and that is provided as a separate body to the semiconductor chip, or a capacitor that is electrically connected to both the oscillator and the oscillation circuit and that is provided as a separate body to the semiconductor chip, wherein the oscillator, the semiconductor chip and the discrete device are contained within a single package.Type: ApplicationFiled: September 12, 2013Publication date: March 20, 2014Applicant: LAPIS SEMICONDUCTOR CO., LTD.Inventor: Yosuke IWASA
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Publication number: 20120319793Abstract: There is provided an oscillation circuit including: a band-gap circuit that outputs an output voltage adjusted for temperature dependency so as to give a constant output voltage independent of temperature; a voltage-current conversion circuit including a first variable resistor, the voltage-current conversion circuit converting an output voltage output from the band-gap circuit into an output current corresponding to the resistance of the first variable resistor and outputting a bias current based on the converted output current; and a CR oscillation circuit including a second variable resistor, a capacitor and a comparator section, the CR oscillation circuit oscillating with an oscillation frequency based on the resistance of the second variable resistor and the capacitance value of the capacitor, and the CR oscillation circuit operating according to the amperage of the bias current the comparator section has input from the voltage-current conversion circuit.Type: ApplicationFiled: June 12, 2012Publication date: December 20, 2012Applicant: LAPIS SEMICONDUCTOR CO., LTD.Inventor: YOSUKE IWASA
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Publication number: 20120069483Abstract: A protection device includes: a serial element unit that includes a first switching element and a resistive element, one end being connected to a control terminal of a protection-target switching element, the other end being connected to a first voltage line, the protection-target switching element including a first terminal connected to the first voltage line, a second terminal connected to a second voltage line and an inductor unit, and the control terminal, the protection-target switching element switching a conduction state at the normal time to a non-conduction state between the first terminal and the second terminal when an off-voltage is applied to the control terminal; a capacitance provided at the protection-target switching element and has a predetermined capacitance value; and a controller that performs control such that the first switching element is in a conduction state if the protection-target switching element is put into a non-conduction state.Type: ApplicationFiled: September 16, 2011Publication date: March 22, 2012Applicant: OKI SEMICONDUCTOR CO., LTD.Inventors: Yosuke IWASA, Atsuhiro KAI, Osamu KUROKI