Patents by Inventor Yosuke Katayama

Yosuke Katayama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Non-contact, electromagnetically coupled transmission and receiving system for IC cards
    Patent number: 5418353
    Abstract: A non-contact IC card communication in which power consumption of a driver of a reader/writer is reduced and the size of a power supply circuit for operating the driver is made small. The driver has a low output impedance. A current detecting circuit including a detecting coil magnetically coupled with a transceiver coil of the reader/writer through a magnetic coiling element and a resistor detects a current which flows through the transceiver coil. A voltage drop to be detected is small and is approximately constant for a variation of the transceiver coil current. When data is read from an IC card, a load of the driver is changed. The driver drives the transceiver coil in a constant voltage fashion even if a current flowing through the transceiver coil changes due to the change in load. Input voltages of a rectifying/smoothing circuit and a regulator in the IC card become approximately constant. As a result, the amplitude of a high frequency output voltage of the driver can be made small.
    Type: Grant
    Filed: October 19, 1994
    Date of Patent: May 23, 1995
    Assignees: Hitachi Maxell, Ltd., NII Data Communications Systems Corporation
    Inventors: Yosuke Katayama, Wasao Takasugi, Toshiharu Ieki, Takashi Takeuchi
  • Non-contact IC recording medium
    Patent number: 5353434
    Abstract: An IC recording medium for executing data transmission/reception without contact with a reader/writer.
    Type: Grant
    Filed: June 4, 1991
    Date of Patent: October 4, 1994
    Assignees: Hitachi Maxell, Ltd., NTT Data Communications Systems Corporation
    Inventor: Yosuke Katayama
  • Semiconductor card and manufacturing method therefor
    Patent number: 5229641
    Abstract: A semiconductor card which at least comprises a printed circuit board, a volatile memory element mounted on the printed circuit board, a battery electrically connected with the printed board for serving to back up the volatile memory element, an input/output interface portion mounted on the printed board for communication with an external device, and a sealant or sealing layer made of a thermosetting resin in which the printed circuit board, volatile memory element and interface portion are integrally embedded, the semiconductor card further including a battery receiving portion formed of a thermoplastic resin having a space for receiving the battery therein, and a battery cover formed of a thermoplastic resin so as to serve to close an opening in the battery receiving portion, the battery receiving portion being fixed to the printed circuit board and integrally embedded in the sealing layer together with the other stated elements on the printed circuit board, and the battery receiving portion is joined after
    Type: Grant
    Filed: August 26, 1992
    Date of Patent: July 20, 1993
    Assignee: Hitachi Maxell, Ltd.
    Inventor: Yosuke Katayama