Patents by Inventor Yosuke Okamoto
Yosuke Okamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11974501Abstract: Provided is a novel chalcogen-containing organic semiconductor compound having excellent carrier mobility. The compound is represented by Formula (1a) or (1b): [Chem. 1] where in Formulas (1a) and (1b), X represents S, O, or Se, and R1 each independently represents a hydrogen atom, a halogen atom, an alkyl group, an aryl group, an aralkyl group, a pyridyl group, a furyl group, a thienyl group, or a thiazolyl group.Type: GrantFiled: August 29, 2019Date of Patent: April 30, 2024Assignees: THE UNIVERSITY OF TOKYO, PI-CRYSTAL INC.Inventors: Toshihiro Okamoto, Junichi Takeya, Masato Mitani, Yosuke Ito, Tomonori Matsumuro
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Publication number: 20230005157Abstract: The present invention relates to a method of detecting an edge (or a contour line) of a pattern, which is formed on a workpiece (e.g., a wafer or a mask) for use in manufacturing of semiconductor, from an image generated by a scanning electron microscope. The pattern-edge detection method includes: generating an objective image of a target pattern formed on a workpiece; generating a feature vector representing features of each pixel constituting the objective image; inputting the feature vector to a model constructed by machine learning; outputting, from the model, a determination result indicating whether the pixel having the feature vector is an edge pixel or a non-edge pixel; and connecting a plurality of pixels, each having a feature vector that has obtained a determination result indicating an edge pixel, with a line to generate a virtual edge.Type: ApplicationFiled: December 10, 2020Publication date: January 5, 2023Inventor: Yosuke OKAMOTO
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Patent number: 10599056Abstract: According to one embodiment, in a position measuring method, alignment measurement in a light exposure process is executed by irradiating a first mark with light having a wavelength of ?1, with respect to a processing object that includes a first layer and a second layer stacked above a substrate and a resist applied on the second layer. The first mark is provided in the first layer and includes a plurality of segments arranged at a pitch smaller than a resolution limit given by light having the wavelength of ?1. Then, overlay measurement is executed by irradiating the first mark and a second mark with light having a wavelength of ?2 shorter than the wavelength of ?1. The second mark has been formed by performing a light exposure and development process to the resist, and includes a plurality of segments arranged at the pitch.Type: GrantFiled: January 31, 2019Date of Patent: March 24, 2020Assignee: Toshiba Memory CorporationInventors: Miki Toshima, Osamu Yamane, Yosuke Okamoto
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Publication number: 20200081357Abstract: According to one embodiment, in a position measuring method, alignment measurement in a light exposure process is executed by irradiating a first mark with light having a wavelength of ?1, with respect to a processing object that includes a first layer and a second layer stacked above a substrate and a resist applied on the second layer. The first mark is provided in the first layer and includes a plurality of segments arranged at a pitch smaller than a resolution limit given by light having the wavelength of ?1. Then, overlay measurement is executed by irradiating the first mark and a second mark with light having a wavelength of ?2 shorter than the wavelength of ?1. The second mark has been formed by performing a light exposure and development process to the resist, and includes a plurality of segments arranged at the pitch.Type: ApplicationFiled: January 31, 2019Publication date: March 12, 2020Applicant: Toshiba Memory CorporationInventors: Miki Toshima, Osamu Yamane, Yosuke Okamoto
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Patent number: 9952505Abstract: According to one embodiment, an imprint device includes a holding unit, a mounting unit, a moving unit, a curing unit, a pressing portion, and a detecting portion. The holding unit holds template having a pattern portion pressed onto a transfer portion provided on a substrate. The mounting unit mounts the substrate. The moving unit is provided on at least either the holding unit or the mounting unit. The moving unit moves the holding unit and the mounting unit in directions approaching each other or directions away from each other. The curing unit cures the transfer portion onto which the pattern portion of the template is pressed. The pressing portion pushes the template pressed onto the transfer portion in a direction intersecting a pressing direction of the template. The detecting portion detects a position of the template pushed by the pressing portion.Type: GrantFiled: September 9, 2014Date of Patent: April 24, 2018Assignee: TOSHIBA MEMORY CORPORATIONInventors: Yosuke Okamoto, Nobuhiro Komine, Kazuhiro Segawa, Manabu Takakuwa, Kentaro Kasa
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Patent number: 9941177Abstract: A pattern accuracy detecting apparatus includes a stage for supporting a substrate, an optical warpage detecting unit that measures a shape of a substrate disposed on the stage, an optical pattern detection unit that detects a position of a pattern on the substrate, and a processing unit that corrects the detected pattern position based on the measured shape of the substrate.Type: GrantFiled: August 31, 2016Date of Patent: April 10, 2018Assignee: Toshiba Memory CorporationInventors: Kentaro Kasa, Kazuya Fukuhara, Kazutaka Ishigo, Manabu Takakuwa, Yoshinori Hagio, Kazuhiro Segawa, Yuki Murasaka, Tetsuya Kugimiya, Yuu Yamayose, Yosuke Okamoto
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Patent number: 9784573Abstract: According to one embodiment, an adjusting unit adjusts a refracting angle of incident light with respect to a substrate, a detector detects reflected light from the substrate, and a calculating unit calculates positional deviation of the pattern based on patterns respectively reflected in reflected lights obtained from the incident light generating N number of refracting angles with respect to the substrate, where N is an integer of two or greater.Type: GrantFiled: June 11, 2015Date of Patent: October 10, 2017Assignee: TOSHIBA MEMORY CORPORATIONInventors: Hidenori Sato, Yosuke Okamoto, Nobuhiro Komine, Manabu Takakuwa
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Publication number: 20170271214Abstract: A pattern accuracy detecting apparatus includes a stage for supporting a substrate, an optical warpage detecting unit that measures a shape of a substrate disposed on the stage, an optical pattern detection unit that detects a position of a pattern on the substrate, and a processing unit that corrects the detected pattern position based on the measured shape of the substrate.Type: ApplicationFiled: August 31, 2016Publication date: September 21, 2017Inventors: Kentaro KASA, Kazuya FUKUHARA, Kazutaka ISHIGO, Manabu TAKAKUWA, Yoshinori HAGIO, Kazuhiro SEGAWA, Yuki MURASAKA, Tetsuya KUGIMIYA, Yuu YAMAYOSE, Yosuke OKAMOTO
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Publication number: 20160330815Abstract: An illuminating method for illuminating a specific region S and peripheral regions Ca, Cb thereof by a plurality of light sources 10a, 10b, wherein the light sources 10a, 10b have mutually different flicker frequencies, and their irradiation areas Ia, Ib overlap each other in the specific region S, thus causing an observer to perceive in the specific region S a flicker stimulation having a frequency different from the flicker frequencies of light perceived by the observer in the peripheral regions Ca, Cb where the irradiation areas do not overlap each other.Type: ApplicationFiled: September 2, 2014Publication date: November 10, 2016Inventors: Seiji NAKAGAWA, Yosuke OKAMOTO
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Publication number: 20160245645Abstract: According to one embodiment, an adjusting unit adjusts a refracting angle of incident light with respect to a substrate, a detector detects reflected light from the substrate, and a calculating unit calculates positional deviation of the pattern based on patterns respectively reflected in reflected lights obtained from the incident light generating N number of refracting angles with respect to the substrate, where N is an integer of two or greater.Type: ApplicationFiled: June 11, 2015Publication date: August 25, 2016Applicant: Kabushiki Kaisha ToshibaInventors: Hidenori SATO, Yosuke OKAMOTO, Nobuhiro KOMINE, Manabu TAKAKUWA
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Patent number: 9244365Abstract: According to one embodiment, a method for measuring pattern misalignment, includes: a first step obtaining image data; a second step specifying a measurement region; a third step calculating a first shift amount (x1, y1); a fourth step determining, after calculating the first shift amount, a first distribution; a fifth step executing a plurality of times the second step, the third step, and the fourth step; a seventh step calculating a second shift amount (x2, y2); an eighth step determining, after calculating the second shift amount, a second distribution; a ninth step executing a plurality of times the sixth step, the seventh step, and the eighth step; and a tenth step calculating a difference (x2?x1, y2?y1) between the second pattern misalignment and the first pattern misalignment.Type: GrantFiled: July 29, 2013Date of Patent: January 26, 2016Assignee: Kabushiki Kaisha ToshibaInventors: Yosuke Okamoto, Yoshinori Hagio
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Patent number: 9146458Abstract: An EUV exposure apparatus according to embodiments includes a reticle stage which suctions a rear surface side of an EUV mask to retain the EUV mask. In addition, the EUV exposure apparatus includes a detection unit which detects a position of a measurement mark formed on the rear surface of the EUV mask in the state where the EUV mask is suctioned on the reticle stage. In addition, the EUV exposure apparatus includes a control unit which calculates a distortion amount of the EUV mask based on the position of the measurement mark and performs exposure control on a wafer while correcting the distortion amount.Type: GrantFiled: March 13, 2013Date of Patent: September 29, 2015Assignee: KABUSHIKI KAISHA TOSHIBAInventors: Yoshinori Hagio, Yosuke Okamoto
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Publication number: 20150251350Abstract: According to one embodiment, an imprint device includes a holding unit, a mounting unit, a moving unit, a curing unit, a pressing portion, and a detecting portion. The holding unit holds template having a pattern portion pressed onto a transfer portion provided on a substrate. The mounting unit mounts the substrate. The moving unit is provided on at least either the holding unit or the mounting unit. The moving unit moves the holding unit and the mounting unit in directions approaching each other or directions away from each other. The curing unit cures the transfer portion onto which the pattern portion of the template is pressed. The pressing portion pushes the template pressed onto the transfer portion in a direction intersecting a pressing direction of the template. The detecting portion detects a position of the template pushed by the pressing portion.Type: ApplicationFiled: September 9, 2014Publication date: September 10, 2015Applicant: Kabushiki Kaisha ToshibaInventors: Yosuke OKAMOTO, Nobuhiro KOMINE, Kazuhiro SEGAWA, Manabu TAKAKUWA, Kentaro KASA
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Patent number: 8976356Abstract: According to one embodiment, a measurement mark includes: a first line pattern, first lines extending in a first direction, the first lines arranged in a second direction in the first line pattern, the first line pattern capable of forming a first moire pattern by overlapping with an arrangement pattern including a pattern, and a first polymer and a second polymer being alternately arranged in the pattern; a second line pattern, second lines extending in the first direction, the second lines being arranged in the second direction in the second line pattern, the second line pattern capable of forming a second moire pattern by overlapping with the arrangement pattern; and a reference pattern with a reference position configured to assess a first shift amount from the reference position of the first moire pattern and a second shift amount from the reference position of the second moire pattern.Type: GrantFiled: July 17, 2013Date of Patent: March 10, 2015Assignee: Kabushiki Kaisha ToshibaInventors: Nobuhiro Komine, Yosuke Okamoto
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Patent number: 8953163Abstract: An exposure apparatus according to an embodiment controls the positioning between layers using an alignment correction value calculated on the basis of lower layer position information of a lower-layer-side pattern and upper layer position information of an upper-layer-side pattern. The lower layer position information includes alignment data, a focus map, and a correction value which is set on the basis of the previous substrate. The upper layer position information includes alignment data, a focus map, and a correction value which is a correction value for the positioning and is used when the upper-layer-side pattern is transferred.Type: GrantFiled: February 27, 2013Date of Patent: February 10, 2015Assignee: Kabushiki Kaisha ToshibaInventors: Kentaro Kasa, Manabu Takakuwa, Yosuke Okamoto, Masamichi Kishimoto
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Publication number: 20150009488Abstract: According to one embodiment, a mask distortion measuring apparatus is provided, including a light source, a mask holding unit, a projection optical system, an imaging unit, and a distortion calculating unit. The mask holding unit holds masks overlaid with each other. The projection optical system forms a projection image of patterns provided on the masks by irradiating light from the light source to the masks. The imaging unit images the projection image. The distortion calculating unit calculates misalignment of another mask with respect to a mask to be a reference in the masks using the projection image imaged at the imaging unit.Type: ApplicationFiled: February 21, 2014Publication date: January 8, 2015Applicant: Kabushiki Kaisha ToshibaInventors: Yosuke OKAMOTO, Nobuhiro Komine
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Patent number: 8914766Abstract: According to one embodiment, generating virtual data by mirroring data based on a dimension measurement result in a measurement region on an inner side of a shot region to a non-shot region on an outer side of a shot edge, and calculating dose data of the measurement region and a non-measurement region based on data in the measurement region and the virtual data are included.Type: GrantFiled: July 1, 2013Date of Patent: December 16, 2014Assignee: Kabushiki Kaisha ToshibaInventors: Yosuke Okamoto, Takashi Koike
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Publication number: 20140349219Abstract: According to embodiments, an exposure method is provided. In the exposure method, a transmittance of a pellicle is adjusted every position of a mask pattern included in a reflection type mask. And when adjusting the transmittance of the pellicle, a film thickness of the pellicle is adjusted on the basis of a transmittance correction amount. Thereafter, exposure is conducted onto a substrate by using the reflection type mask with the pellicle stuck thereon.Type: ApplicationFiled: November 25, 2013Publication date: November 27, 2014Applicant: Kabushiki Kaisha ToshibaInventors: Hiroyuki MIZUNO, Yosuke Okamoto, Takeshi Koshiba, Satoshi Nagai
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Patent number: 8859167Abstract: According to one embodiment, a positional deviation measuring method includes measuring a positional deviation of a device pattern formed in a lower layer portion using an alignment mark of the lower layer portion as a reference; measuring a positional deviation of a device pattern formed in an upper layer portion above the lower layer portion using an alignment mark of the upper layer portion as a reference; measuring a positional deviation between the alignment mark of the lower layer portion and the alignment mark of the upper layer portion; and calculating a positional deviation between the device patterns based on the positional deviation between the alignment marks.Type: GrantFiled: December 21, 2012Date of Patent: October 14, 2014Assignee: Kabushiki Kaisha ToshibaInventors: Yoshinori Hagio, Yosuke Okamoto
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Publication number: 20140285652Abstract: According to one embodiment, a method for measuring pattern misalignment, includes: a first step obtaining image data; a second step specifying a measurement region; a third step calculating a first shift amount (x1, y1); a fourth step determining, after calculating the first shift amount, a first distribution; a fifth step executing a plurality of times the second step, the third step, and the fourth step; a seventh step calculating a second shift amount (x2, y2); an eighth step determining, after calculating the second shift amount, a second distribution; a ninth step executing a plurality of times the sixth step, the seventh step, and the eighth step; and a tenth step calculating a difference (x2?x1, y2?y1) between the second pattern misalignment and the first pattern misalignment.Type: ApplicationFiled: July 29, 2013Publication date: September 25, 2014Applicant: Kabushiki Kaisha ToshibaInventors: Yosuke OKAMOTO, Yoshinori Hagio