Patents by Inventor Yosuke Omori

Yosuke Omori has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240105497
    Abstract: A substrate processing apparatus includes a holder configured to hold a substrate by attracting the substrate on an attraction surface. The attraction surface includes an outer attraction portion configured to attract an outer peripheral portion of the substrate and an inner attraction portion configured to attract a portion of the substrate at an inner side than the outer peripheral portion. The holder includes a transforming unit configured to transform the outer attraction portion relative to the inner attraction portion.
    Type: Application
    Filed: September 27, 2023
    Publication date: March 28, 2024
    Inventors: Yosuke Omori, Norifumi Kohama
  • Publication number: 20240006207
    Abstract: A bonding apparatus includes a first holder; a second holder; a horizontally moving unit; an elevating unit; an inclination measuring unit; and a controller. The first holder is configured to attract and hold a first substrate on a bottom surface thereof. The second holder is disposed under the first holder and configured to attract and hold a second substrate on a top surface thereof. The horizontally moving unit is configured to move the first substrate and the second substrate relative to each other in a horizontal direction. The elevating unit is configured to move the second substrate up and down between a proximate position and a spaced position. The inclination measuring unit is configured to measure an inclination of the second holder. The controller calculates a position of the second substrate in the horizontal direction based on a measurement result of the inclination measuring unit.
    Type: Application
    Filed: June 27, 2023
    Publication date: January 4, 2024
    Inventors: Takashi Nakamitsu, Tetsuya Maki, Yosuke Omori, Keiichi Saiki
  • Patent number: 11837574
    Abstract: A bonding apparatus includes a holder; a pressing member; and a curvature adjuster. The holder is configured to attract and hold a substrate to be bonded. The pressing member is configured to come into contact with a central portion of the substrate attracted to and held by the holder and press the substrate to allow the central portion of the substrate to be protruded. The curvature adjuster is configured to adjust a curvature of the substrate pressed by the pressing member.
    Type: Grant
    Filed: May 14, 2021
    Date of Patent: December 5, 2023
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Kenji Sugakawa, Yosuke Omori
  • Patent number: 11820367
    Abstract: A turning controller for a vehicle is configured to execute: a time obtaining process that obtains collision prediction time; a lateral movement amount determining process that determines whether a target lateral movement amount is greater than or equal to a lateral movement amount determination value; and an automatic turning process that, in a case in which the collision prediction time is shorter than or equal to a determination prediction time, outputs a command for steering the front wheel to the front wheel steering device and outputs a command for steering the rear wheel to the rear wheel steering device, in order to avoid a collision between the vehicle and the obstacle; a counter-phase process in the automatic turning process in a case in which the target lateral movement amount is determined to be greater than or equal to the lateral movement amount determination value.
    Type: Grant
    Filed: September 15, 2021
    Date of Patent: November 21, 2023
    Assignee: J-QUAD DYNAMICS INC.
    Inventor: Yosuke Omori
  • Patent number: 11735465
    Abstract: A substrate processing apparatus includes a holder having thereon an attraction surface configured to attract a substrate and including, as multiple regions in which attracting pressures for attracting the substrate are controlled independently, a first region having a circular shape and a second region having an annular shape and disposed at an outside of the first region in a diametrical direction; multiple attracting pressure generators configured to independently generate the attracting pressures respectively in the multiple regions forming the attraction surface; multiple attracting pressure adjusters configured to independently adjust the attracting pressures respectively generated by the attracting pressure generators; and a controller configured to control the multiple attracting pressure generators and the multiple attracting pressure adjusters. The controller generates different attracting pressures in at least a part of the first region and in at least a part of the second region.
    Type: Grant
    Filed: January 9, 2019
    Date of Patent: August 22, 2023
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Kenji Sugakawa, Yosuke Omori
  • Patent number: 11715663
    Abstract: A bonding apparatus includes a first holder, a first transforming device, a second holder, a second transforming device, a suction device and a control device. The first holder attracts and holds a first substrate from above. The first transforming device transforms the first substrate held by the first holder such that a central portion of the first substrate is protruded downwards. The second holder is provided under the first holder, and attracts and holds a second substrate, which is to be bonded to the first substrate, from below. The second transforming device transforms the second substrate held by the second holder such that a central portion of the second substrate is protruded upwards. The suction device generates different attracting forces in multiple division regions included in an attraction region of the second substrate. The control device controls the suction device.
    Type: Grant
    Filed: February 22, 2021
    Date of Patent: August 1, 2023
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Kenji Sugakawa, Yosuke Omori
  • Publication number: 20230026661
    Abstract: A bonding apparatus configured to bond substrates includes a first holder configured to vacuum-exhaust a first substrate to attract and hold the first substrate on a bottom surface thereof; a second holder disposed under the first holder, and configured to vacuum-exhaust a second substrate to attract and hold the second substrate on a top surface thereof; a mover configured to move the first holder and the second holder relatively in a horizontal direction; a laser interferometer system configured to measure a position of the first holder or the second holder which is moved by the mover; a linear scale configured to measure a position of the mover; and a controller configured to control the mover based on a measurement result of the laser interferometer system and a measurement result of the liner scale.
    Type: Application
    Filed: September 28, 2022
    Publication date: January 26, 2023
    Inventors: Takashi Nakamitsu, Shuhei Matsumoto, Yosuke Omori
  • Publication number: 20230014665
    Abstract: A substrate processing apparatus includes a holder having thereon an attraction surface configured to attract a substrate and including an outer attracting member configured to attract a peripheral portion of the substrate and an inner attracting member configured to attract a portion of the substrate inside the peripheral portion of the substrate attracted by the outer attracting member in a diametrical direction of the attraction surface; a moving device configured to move the outer attracting member with respect to the inner attracting member; and a controller configured to control a distortion, which is caused at the substrate attracted to the attraction surface, by controlling a movement of the outer attracting member with respect to the inner attracting member.
    Type: Application
    Filed: September 21, 2022
    Publication date: January 19, 2023
    Inventors: Kimio Motoda, Norifumi Kohama, Norio Wada, Yosuke Omori, Kenji Sugakawa
  • Patent number: 11488929
    Abstract: A bonding apparatus configured to bond substrates comprises a first holder configured to vacuum-exhaust a first substrate to attract and hold the first substrate on a bottom surface thereof; a second holder disposed under the first holder, and configured to vacuum-exhaust a second substrate to attract and hold the second substrate on a top surface thereof; a mover configured to move the first holder and the second holder relatively in a horizontal direction; a laser interferometer system configured to measure a position of the first holder or the second holder which is moved by the mover; a linear scale configured to measure a position of the mover; and a controller configured to control the mover based on a measurement result of the laser interferometer system and a measurement result of the liner scale.
    Type: Grant
    Filed: October 11, 2017
    Date of Patent: November 1, 2022
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Takashi Nakamitsu, Shuhei Matsumoto, Yosuke Omori
  • Patent number: 11482431
    Abstract: A substrate processing apparatus includes a holder having thereon an attraction surface configured to attract a substrate and including an outer attracting member configured to attract a peripheral portion of the substrate and an inner attracting member configured to attract a portion of the substrate inside the peripheral portion of the substrate attracted by the outer attracting member in a diametrical direction of the attraction surface; a moving device configured to move the outer attracting member with respect to the inner attracting member; and a controller configured to control a distortion, which is caused at the substrate attracted to the attraction surface, by controlling a movement of the outer attracting member with respect to the inner attracting member.
    Type: Grant
    Filed: January 11, 2019
    Date of Patent: October 25, 2022
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Kimio Motoda, Norifumi Kohama, Norio Wada, Yosuke Omori, Kenji Sugakawa
  • Publication number: 20220203976
    Abstract: A travel control device is a device that eliminates deviation of a vehicle from a target path by driving actuators when the vehicle deviates from the target path. The travel control device includes a movable range deriving unit that derives a movable range that is a range in which the vehicle is able to reach by driving the actuators on a basis of a traveling state of the vehicle, a target setting unit that sets a point included in the movable range in the target path as a target position, and an instruction unit that instructs the actuators to drive the vehicle toward the target position.
    Type: Application
    Filed: April 7, 2020
    Publication date: June 30, 2022
    Applicant: ADVICS CO., LTD.
    Inventor: Yosuke OMORI
  • Publication number: 20220178708
    Abstract: A control device of a vehicle controls an actuator of the vehicle to cause the vehicle to travel based on a follow-up route. The control device includes a width information obtaining unit that obtains a road width in which the vehicle can pass on a road on which the vehicle travels. The control device includes a locus follow-up control unit that creates a follow-up route based on the obtained road width. The locus follow-up control unit derives a control amount for causing the vehicle to travel along the follow-up route.
    Type: Application
    Filed: April 7, 2020
    Publication date: June 9, 2022
    Applicant: ADVICS CO., LTD.
    Inventors: Tatsuya HIROMURA, Yosuke OMORI
  • Publication number: 20220169246
    Abstract: A control device of a vehicle controls an actuator to cause the vehicle to travel based on a target locus. The control device includes a travel assisting unit that generates a target locus and sets a point on the target locus as a target position. The control device includes a braking control unit capable of communicating with the travel assisting unit. The braking control unit executes a process of calculating a control amount for causing the vehicle to follow the target position received from the travel assisting unit. The braking control unit executes a process of instructing the actuator to perform driving based on the control amount.
    Type: Application
    Filed: April 7, 2020
    Publication date: June 2, 2022
    Applicant: ADVICS CO., LTD.
    Inventor: Yosuke OMORI
  • Publication number: 20220089150
    Abstract: A turning controller for a vehicle is configured to execute: a time obtaining process that obtains collision prediction time; a lateral movement amount determining process that determines whether a target lateral movement amount is greater than or equal to a lateral movement amount determination value; and an automatic turning process that, in a case in which the collision prediction time is shorter than or equal to a determination prediction time, outputs a command for steering the front wheel to the front wheel steering device and outputs a command for steering the rear wheel to the rear wheel steering device, in order to avoid a collision between the vehicle and the obstacle; a counter-phase process in the automatic turning process in a case in which the target lateral movement amount is determined to be greater than or equal to the lateral movement amount determination value.
    Type: Application
    Filed: September 15, 2021
    Publication date: March 24, 2022
    Applicants: ADVICS CO., LTD., DENSO CORPORATION, AISIN CORPORATION, JTEKT CORPORATION, J-QuAD DYNAMICS INC.
    Inventor: Yosuke OMORI
  • Publication number: 20220089149
    Abstract: A turn assist device is configured to execute a turn assist process that assists turning of a vehicle in a case in which a steering operation of a steering wheel is in progress in a situation in which collision prediction time is shorter than or equal to determination prediction time. The turn assist process includes: an in-phase process that outputs a command for steering a rear wheel in the same direction as a steering direction of a front wheel, and a counter-phase process that outputs a command for steering the rear wheel in a direction opposite to the steering direction of the front wheel when a difference between an actual value of the lateral acceleration of the vehicle and a lateral acceleration target value exceeds a difference determination value during execution of the in-phase process.
    Type: Application
    Filed: September 2, 2021
    Publication date: March 24, 2022
    Applicants: ADVICS CO., LTD., DENSO CORPORATION, AISIN CORPORATION, JTEKT CORPORATION, J-QuAD DYNAMICS INC.
    Inventor: Yosuke OMORI
  • Publication number: 20210358879
    Abstract: A bonding apparatus includes a holder; a pressing member; and a curvature adjuster. The holder is configured to attract and hold a substrate to be bonded. The pressing member is configured to come into contact with a central portion of the substrate attracted to and held by the holder and press the substrate to allow the central portion of the substrate to be protruded. The curvature adjuster is configured to adjust a curvature of the substrate pressed by the pressing member.
    Type: Application
    Filed: May 14, 2021
    Publication date: November 18, 2021
    Inventors: Kenji Sugakawa, Yosuke Omori
  • Patent number: 11164842
    Abstract: Deformation of substrates after the substrates are bonded can be suppressed. A bonding apparatus includes a first holding unit configured to attract and hold a first substrate from above; a second holding unit provided under the first holding unit and configured to attract and hold a second substrate from below; and a striker configured to press a central portion of the first substrate from above and bring the first substrate into contact with the second substrate. The first holding unit is configured to attract and hold a partial region of a peripheral portion of the first substrate, and the first holding unit attracts and holds the region which intersects with a direction, among directions from the central portion of the first substrate toward the peripheral portion thereof, in which a bonding region between the first substrate and the second substrate is expanded faster.
    Type: Grant
    Filed: August 30, 2019
    Date of Patent: November 2, 2021
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Yosuke Omori, Kenji Sugakawa
  • Publication number: 20210272836
    Abstract: A bonding apparatus includes a first holder, a first transforming device, a second holder, a second transforming device, a suction device and a control device. The first holder attracts and holds a first substrate from above. The first transforming device transforms the first substrate held by the first holder such that a central portion of the first substrate is protruded downwards. The second holder is provided under the first holder, and attracts and holds a second substrate, which is to be bonded to the first substrate, from below. The second transforming device transforms the second substrate held by the second holder such that a central portion of the second substrate is protruded upwards. The suction device generates different attracting forces in multiple division regions included in an attraction region of the second substrate. The control device controls the suction device.
    Type: Application
    Filed: February 22, 2021
    Publication date: September 2, 2021
    Inventors: Kenji Sugakawa, Yosuke Omori
  • Patent number: 10982833
    Abstract: The vehicle lamp of the present invention includes: a first light source that emits light for low-beam light distribution; a lens arranged in a front side of the first light source; a shade that is arranged between the first light source and the lens and forms a cut-off line of a low-beam light distribution pattern; a reflector that reflects light from the first light source towards the lens; and a second light source that is arranged between the first light source and the lens and emits light for high-beam additional light distribution. A rear focal point of the lens is located more to a front side than a second focal point which is a focal point on a front side of the reflector, and a lens optical axis of the lens is inclined forward and obliquely downward with respect to a lamp optical axis of the lamp.
    Type: Grant
    Filed: October 11, 2018
    Date of Patent: April 20, 2021
    Assignee: Ichikoh Industries, Ltd.
    Inventors: Kazunori Iwasaki, Yasuhiro Okubo, Takanori Hamamoto, Yosuke Omori
  • Patent number: 10985132
    Abstract: There is provided a bonding apparatus for bonding substrates together, which includes: a first holding part configured to adsorptively hold a first substrate by vacuum-drawing the first substrate on a lower surface of the first substrate; a second holding part provided below the first holding part and configured to adsorptively hold a second substrate by vacuum-drawing the second substrate on an upper surface of the second substrate; a pressing member provided in the first holding part and configured to press a central portion of the first substrate; and a plurality of substrate detection parts provided in the first holding part and configured to detect a detachment of the first substrate from the first holding part.
    Type: Grant
    Filed: July 14, 2020
    Date of Patent: April 20, 2021
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Yoshitaka Otsuka, Takashi Nakamitsu, Yosuke Omori, Kenji Sugakawa