Patents by Inventor Yosuke SONOHARA

Yosuke SONOHARA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wiring substrate and method for producing wiring substrate
    Patent number: 11272623
    Abstract: A wiring substrate includes an insulating layer having a front surface and a back surface and at least two wiring parts that are disposed at least on the front surface of the insulating layer and that are insulated from each other. At least one of the wiring parts is electrically isolated on the insulating layer. Each of the wiring parts includes a conductive base layer disposed on the front surface of the insulating layer, a conductive layer disposed on a front surface of the conductive base layer, and a conductive covering layer arranged to cover at least a portion of a front surface of the conductive layer, at least a portion of a side surface of the conductive base layer, and at least a portion of a side surface of the conductive layer. The conductive base layer and the conductive layer overlap and coincide with each other in plan view.
    Type: Grant
    Filed: May 28, 2018
    Date of Patent: March 8, 2022
    Assignee: NGK SPARK PLUG CO., LTD.
    Inventor: Yosuke Sonohara
  • WIRING SUBSTRATE AND METHOD FOR PRODUCING WIRING SUBSTRATE
    Publication number: 20200196455
    Abstract: A wiring substrate includes an insulating layer having a front surface and a back surface and at least two wiring parts that are disposed at least on the front surface of the insulating layer and that are insulated from each other. At least one of the wiring parts is electrically isolated on the insulating layer. Each of the wiring parts includes a conductive base layer disposed on the front surface of the insulating layer, a conductive layer disposed on a front surface of the conductive base layer, and a conductive covering layer arranged to cover at least a portion of a front surface of the conductive layer, at least a portion of a side surface of the conductive base layer, and at least a portion of a side surface of the conductive layer. The conductive base layer and the conductive layer overlap and coincide with each other in plan view.
    Type: Application
    Filed: May 28, 2018
    Publication date: June 18, 2020
    Inventor: Yosuke SONOHARA