Abstract: A multilayer ceramic electronic component includes a ceramic element assembly and outer electrodes provided on respective end surfaces of the ceramic element assembly. Each outer electrode includes an underlying electrode layer that is provided on the ceramic element assembly and that includes a sintered metal and glass and a conductive resin layer that is provided on the underlying electrode layer and that includes a metal filler and a resin. The underlying electrode layer satisfies at least one condition of a condition that a maximum exposure length of the glass exposed at the interface between the underlying electrode layer and the conductive resin layer is about 3.8 ?m or less and a condition that an exposure rate of the glass exposed at the interface between the underlying electrode layer and the conductive resin layer is about 10.1% or less.

Abstract: A multilayer ceramic capacitor includes a laminate and an outer electrode. The laminate includes a plurality of laminated ceramic layers and a plurality of internal electrode layers. The internal electrode layers are respectively laminated on the ceramic layers. The outer electrode is provided on each end surface of the laminate. Each outer electrode includes a metal layer. The metal layer includes at least a Pd layer, an Ni layer, and an Sn layer laminated from a portion adjacent to or in a vicinity of the laminate in order of the Pd layer, the Ni layer, and the Sn layer. The metal layer is located at an outermost surface of the outer electrode. A thickness of the Ni layer is greater than or equal to about 0.4.

Abstract: A ceramic electronic component includes a ceramic body and first and second outer electrodes. The first and second outer electrodes respectively include first and second resin-containing electrode layers and first and second Ni plating layers. The first and second Ni plating layers are respectively provided on the first and second resin-containing electrode layers. When a thickness of the first or second Ni plating layer is t1 and a distance by which a portion of the first or second Ni plating layer that is in contact with the second principal surface extends in the length direction is t2, t2/t1 is less than about 1.

Abstract: A multilayer ceramic electronic component includes a ceramic element assembly and outer electrodes provided on respective end surfaces of the ceramic element assembly. Each outer electrode includes an underlying electrode layer that is provided on the ceramic element assembly and that includes a sintered metal and glass and a conductive resin layer that is provided on the underlying electrode layer and that includes a metal filler and a resin. The underlying electrode layer satisfies at least one condition of a condition that a maximum exposure length of the glass exposed at the interface between the underlying electrode layer and the conductive resin layer is about 3.8 ?m or less and a condition that an exposure rate of the glass exposed at the interface between the underlying electrode layer and the conductive resin layer is about 10.1% or less.

Abstract: A multilayer ceramic electronic component includes a ceramic body and outer electrodes on two end surfaces of the ceramic body. Each of the outer electrodes includes a base electrode layer that is on the ceramic body and includes a sintered metal and glass, and a conductive resin layer that is on the base electrode layer and includes a metal filler and a resin. When a maximum thickness of the conductive resin layers that respectively lie on end surfaces of the ceramic body is denoted as T1 and when a maximum thickness of conductive resin layers adjacent to a first main surface and second main surface of the ceramic body or a first side surface or a second side surface of the ceramic body is denoted as T2, T1/T2 is about 2.4 or more.

Abstract: A multilayer ceramic capacitor includes a laminated body, and an external electrode on both end surfaces of the laminated body. The external electrode includes a base electrode layer, a conductive resin layer on the base electrode layer, and a plating layer on the conductive resin layer. The amount of a curvature radius along a boundary portion between the base electrode layer and the conductive resin layer the boundary between the base electrode layer and the conductive resin layer at the ridge line of the laminated body is about 296.6 ?m or more, the long side length in terms of flattened powder value is about 10.3 ?m or more, the solid content concentration of PVC in the conductive resin layer is about 45 vol % or higher and about 60 vol % or lower, and the thickness of the conductive resin layer located at the ridge line is about 11.7 ?m or more.

Abstract: A multilayer ceramic capacitor includes a multilayer body including dielectric layers, inner electrodes and outer electrodes that are connected to the inner electrodes and disposed on a first end surface and a second end surface of the multilayer body. The outer electrodes each include a resin electrode layer containing a thermosetting resin and a metal component and a plating layer in contact with the resin electrode layer. The metal component of the resin electrode layer contains Ni. The plating layer is a Sn plating layer.

Abstract: A multilayer ceramic capacitor includes a laminate and an outer electrode. The laminate includes a plurality of laminated ceramic layers and a plurality of internal electrode layers. The internal electrode layers are respectively laminated on the ceramic layers. The outer electrode is provided on each end surface of the laminate. Each outer electrode includes a metal layer. The metal layer includes at least a Pd layer, an Ni layer, and an Sn layer laminated from a portion adjacent to or in a vicinity of the laminate in order of the Pd layer, the Ni layer, and the Sn layer. The metal layer is located at an outermost surface of the outer electrode. A thickness of the Ni layer is greater than or equal to about 0.4.

Abstract: A conductive resin paste that includes a conductive component and a resin component, where the conductive component includes at least Ag and Cu, and the proportion of the Ag to the total amount of the Ag and Cu included in the conductive component falls within the range of 11.6 mass % to 28.8 mass %. As the conductive component, an Ag-coated Cu powder is used which has a Cu powder with a surface at least partially coated with Ag.

Abstract: A multilayer ceramic capacitor includes a laminate and first and second external electrodes that each include first and second underlying electrode layers, first and second conductive resin layers, and first and second plating layers. The first underlying electrode layer includes a portion not covered with the first conductive resin layer on an end surface of the laminate, and the first plating layer is disposed on a surface of the portion of the first underlying electrode layer. The second underlying electrode layer includes a portion not covered with the second conductive resin layer on an end surface of the laminate, and the second plating layer is disposed on a surface of the portion of the second underlying electrode layer.

Abstract: A multilayer ceramic capacitor includes a laminated body, and an external electrode on both end surfaces of the laminated body. The external electrode includes a base electrode layer, a conductive resin layer on the base electrode layer, and a plating layer on the conductive resin layer. The amount of a curvature radius along a boundary portion between the base electrode layer and the conductive resin layer the boundary between the base electrode layer and the conductive resin layer at the ridge line of the laminated body is about 296.6 ?m or more, the long side length in terms of flattened powder value is about 10.3 ?m or more, the solid content concentration of PVC in the conductive resin layer is about 45 vol % or higher and about 60 vol % or lower, and the thickness of the conductive resin layer located at the ridge line is about 11.7 ?m or more.

Abstract: An external electrode includes an underlying electrode layer on an end surface of a ceramic body and connected to an internal electrode, an external electrode layer located outside the underlying electrode layer, and an intermediate electrode layer including at least a portion between the underlying electrode layer and the external electrode layer. The intermediate electrode layer includes a conductive resin, and the underlying electrode layer and the external electrode layer include a material lower in electrical resistivity than the conductive resin. The intermediate electrode layer entirely or substantially entirely covers the end surfaces and extends from the end surfaces to portions, respectively, of one main surface, and the underlying electrode layer is partially exposed from the intermediate electrode layer to include an exposed surface and is in surface-contact with the external electrode layer at the exposed surface.

Abstract: A multilayer ceramic capacitor includes a multilayer body including dielectric layers, inner electrodes and outer electrodes that are connected to the inner electrodes and disposed on a first end surface and a second end surface of the multilayer body. The outer electrodes each include a resin electrode layer containing a thermosetting resin and a metal component and a plating layer in contact with the resin electrode layer. The metal component of the resin electrode layer contains Ni. The plating layer is a Sn plating layer.

Abstract: A report creation system according to one embodiment creates a report indicative of a condition of a cooperative service in which a plurality of services are made to cooperate, the plurality of services being provided by a plurality of service providing apparatuses including at least one service providing apparatus in another company. The report creation creates the report, based on the first log information and the error occurrence information collected by each of the information collection apparatuses, and second log information of each of the services collected from each of the service providing apparatuses.

Abstract: A multilayer-ceramic-capacitor mounting structure includes a circuit board and a multilayer ceramic capacitor. First and second external electrodes include first and second conductive resin layers on surfaces of first and second base electrode layers, respectively. The circuit board includes a copper plate on a surface of a core, disposed as a wiring pattern, and including a predetermined thickness, and signal electrodes disposed on a surface of the copper plate. The first and second external electrodes are each electrically connected to the signal electrodes of the copper plate.

Abstract: In a multilayer ceramic capacitor, outer electrodes include base electrode layers including a conductive metal and a glass component on a ceramic multilayer body, conductive resin layers including a thermosetting resin and a metal component on the base electrode layers such that exposed portions of the base electrode layers are exposed at least at one corner on one end surface side of the ceramic multilayer body and at least at one corner on the other end surface side thereof, and plating layers on the conductive resin layers and the exposed portions of the base electrode layers. The exposed portions of the base electrode layers are in direct contact with the plating layers at least at one corner on the one end surface side of the ceramic multilayer body and at least at one corner on the other end surface side thereof.

Abstract: A multilayer ceramic capacitor includes a laminate and first and second external electrodes that each include first and second underlying electrode layers, first and second conductive resin layers, and first and second plating layers. The first underlying electrode layer includes a portion not covered with the first conductive resin layer on an end surface of the laminate, and the first plating layer is disposed on a surface of the portion of the first underlying electrode layer. The second underlying electrode layer includes a portion not covered with the second conductive resin layer on an end surface of the laminate, and the second plating layer is disposed on a surface of the portion of the second underlying electrode layer.

Abstract: An external electrode includes an underlying electrode layer on an end surface of a ceramic body and connected to an internal electrode, an external electrode layer located outside the underlying electrode layer, and an intermediate electrode layer including at least a portion between the underlying electrode layer and the external electrode layer. The intermediate electrode layer includes a conductive resin, and the underlying electrode layer and the external electrode layer include a material lower in electrical resistivity than the conductive resin. The intermediate electrode layer entirely or substantially entirely covers the end surfaces and extends from the end surfaces to portions, respectively, of one main surface, and the underlying electrode layer is partially exposed from the intermediate electrode layer to include an exposed surface and is in surface-contact with the external electrode layer at the exposed surface.

Abstract: A multilayer-ceramic-capacitor mounting structure includes a circuit board and a multilayer ceramic capacitor. First and second external electrodes include first and second conductive resin layers on surfaces of first and second base electrode layers, respectively. The circuit board includes a copper plate on a surface of a core, disposed as a wiring pattern, and including a predetermined thickness, and signal electrodes disposed on a surface of the copper plate. The first and second external electrodes are each electrically connected to the signal electrodes of the copper plate.

Abstract: In a multilayer ceramic capacitor, outer electrodes include base electrode layers including a conductive metal and a glass component on a ceramic multilayer body, conductive resin layers including a thermosetting resin and a metal component on the base electrode layers such that exposed portions of the base electrode layers are exposed at least at one corner on one end surface side of the ceramic multilayer body and at least at one corner on the other end surface side thereof, and plating layers on the conductive resin layers and the exposed portions of the base electrode layers. The exposed portions of the base electrode layers are in direct contact with the plating layers at least at one corner on the one end surface side of the ceramic multilayer body and at least at one corner on the other end surface side thereof.