Abstract: A sheet sticking apparatus 10 includes a first case 20 for accommodating a table 11 for supporting a semiconductor wafer W, a second case 21 for forming a decompression chamber C with the first case 20, and feeding means 15 for feeding an adhesive sheet S to a position where the adhesive sheet S faces the semiconductor wafer W. The second case 21 includes a bulkhead 30 for forming a pressure adjusting chamber C1 in a state where a single decompression chamber C is formed, the pressure adjusting chamber C1 being capable of controlling the pressure therein independently of the decompression chamber C, wherein the adhesive sheet S is stuck to the semiconductor wafer W under decompression by setting the decompression chamber C in a decompression state and relatively increasing the pressure in the pressure adjusting chamber C1.

Abstract: A UV irradiating portion 12 is provided with multiple UV light emitting diodes 21 arranged on a base plate 20 which is in a position corresponding to a semiconductor wafer attached with a protective sheet S through a UV curable adhesive layer 18 as an irradiation receiving body. The light emitting diodes 21 are arranged at intervals of substantially equal spaces along the direction substantially perpendicular to the relative movement direction with a wafer W. And, the light emitting diodes 21 in each row are arranged to have substantially the same peak wavelength, while the peak wavelengths of the light emitting diodes 21 in the adjacent rows are arranged to be not necessarily the same.