Patents by Inventor You-Hoan Jung

You-Hoan Jung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9009418
    Abstract: A multimedia platform is discussed, which includes a first stacking unit including a first substrate and a multimedia processor, wherein the first substrate and the multimedia processor are stacked on the first stacking unit, a pattern and a via hole are formed on the first substrate, and the multimedia processor is mounted on top of the first substrate; a second stacking unit including a second substrate and a plurality of storage devices, wherein the second substrate and the plurality of storage devices are stacked on the second stacking unit, a pattern and a via hole being formed on the second substrate, and the plurality of storage devices are mounted on top of the second substrate; and at least one solder ball arranged on the first stacking unit, the at least one solder ball allowing the first substrate to be coupled to the second substrate.
    Type: Grant
    Filed: July 15, 2011
    Date of Patent: April 14, 2015
    Assignee: Mtekvision Co., Ltd.
    Inventors: You-Hoan Jung, Jong-Sik Jeong
  • Patent number: 8185702
    Abstract: A device comprising a multimedia platform with a plurality of memories and a method of sharing a non-volatile memory. The multimedia platform in accordance with an embodiment of the present invention can have a non-volatile memory, a multimedia processor setting a route in accordance with a route selection signal received from the main processor such that the main processor accesses the non-volatile memory or the display unit, a first volatile memory which is a temporary memory device of the main processor, and a second volatile memory which is a temporary memory of the multimedia processor. With the present invention, the portable terminal can be made smaller by putting a memory chip and a multimedia platform in a single chip by use of the POP (package on package) technology.
    Type: Grant
    Filed: September 4, 2006
    Date of Patent: May 22, 2012
    Assignee: Mtekvision Co., Ltd.
    Inventors: You-Hoan Jung, Jong-Sik Jeong
  • Publication number: 20110271081
    Abstract: A multimedia platform is discussed, which includes a first stacking unit including a first substrate and a multimedia processor, wherein the first substrate and the multimedia processor are stacked on the first stacking unit, a pattern and a via hole are formed on the first substrate, and the multimedia processor is mounted on top of the first substrate; a second stacking unit including a second substrate and a plurality of storage devices, wherein the second substrate and the plurality of storage devices are stacked on the second stacking unit, a pattern and a via hole being formed on the second substrate, and the plurality of storage devices are mounted on top of the second substrate; and at least one solder ball arranged on the first stacking unit, the at least one solder ball allowing the first substrate to be coupled to the second substrate.
    Type: Application
    Filed: July 15, 2011
    Publication date: November 3, 2011
    Inventors: You-Hoan Jung, Jong-Sik Jeong
  • Publication number: 20080288711
    Abstract: A device comprising a multimedia platform with a plurality of memories and a method of sharing a non-volatile memory. The multimedia platform in accordance with an embodiment of the present invention can have a non-volatile memory, a multimedia processor setting a route in accordance with a route selection signal received from the main processor such that the main processor accesses the non-volatile memory or the display unit, a first volatile memory which is a temporary memory device of the main processor, and a second volatile memory which is a temporary memory of the multimedia processor. With the present invention, the portable terminal can be made smaller by putting a memory chip and a multimedia platform in a single chip by use of the POP (package on package) technology.
    Type: Application
    Filed: September 4, 2006
    Publication date: November 20, 2008
    Applicant: MTEKVISION CO., LTD.
    Inventors: You-Hoan Jung, Jong-Sik Jeong