Patents by Inventor Youhei TATEISHI

Youhei TATEISHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10721823
    Abstract: Method of manufacturing laminate body by: curing thermosetting resin composition on a support; laminating the curable resin onto a substrate; heating the laminate; forming a via hole in the cured resin layer; peeling the supporting body from the cured composite; performing a second heating of the cured composite; removing resin residue in the via hole of the cured composite; and forming a conductor layer on an inner wall surface of the via hole by electroless plating or a combination of electroless plating and electrolytic plating.
    Type: Grant
    Filed: September 29, 2015
    Date of Patent: July 21, 2020
    Assignee: INTEL CORPORATION
    Inventors: Makoto Fujimura, Youhei Tateishi
  • Patent number: 10716222
    Abstract: Method of manufacturing laminate body by: curing thermosetting resin composition on a support; laminating the curable resin onto a substrate; heating the laminate; forming a via hole in the cured resin layer; peeling the supporting body from the cured composite; performing a second heating of the cured composite; removing resin residue in the via hole of the cured composite; and forming a conductor layer on an inner wall surface of the via hole.
    Type: Grant
    Filed: September 29, 2015
    Date of Patent: July 14, 2020
    Assignee: INTEL CORPORATION
    Inventors: Makoto Fujimura, Youhei Tateishi
  • Publication number: 20170359908
    Abstract: Problem: To provide a method for manufacturing a laminate body with excellent heat resistance (solder heat resistance, for example), in which a small diameter via hole can be formed.
    Type: Application
    Filed: September 29, 2015
    Publication date: December 14, 2017
    Inventors: Makoto FUJIMURA, Youhei TATEISHI
  • Publication number: 20170359907
    Abstract: To provide a method for manufacturing a laminate body with excellent heat resistance (solder heat resistance, for example) and excellent conduction reliability in which a small diameter via hole can be formed.
    Type: Application
    Filed: September 29, 2015
    Publication date: December 14, 2017
    Inventors: Makoto FUJIMURA, Youhei TATEISHI