Patents by Inventor Youichi Hosono

Youichi Hosono has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Solid printed substrate and electronic circuit package using the same
    Patent number: 5639990
    Abstract: The present invention relates to a solid printed substrate to be used for mounting electronic parts and a method of manufacturing the same. A metal base substrate having a plurality of copper foil layers stacked thereon is employed placing a thermoplastic polyimide sheet between each copper foil. The metal base substrate with a circuit pattern prepared on each copper foil layer is processed by bending or deep drawing into a box-shaped work which has an opening surface. The opening surface is processed so as to have a substantially equal area with that of the bottom of the substrate and have a collar portion on the periphery thereof. On the collar portion, leads to be used for connection with other wiring substrate are formed by patterning on copper foil layers.
    Type: Grant
    Filed: January 26, 1994
    Date of Patent: June 17, 1997
    Assignee: Mitsui Toatsu Chemicals, Inc.
    Inventors: Kunio Nishihara, Youichi Hosono, Kunihiro Nagamine, Takashi Kayama, Takayuki Ishikawa