Abstract: A method for manufacturing a package substrate for mounting a semiconductor device including: a first laminate preparing step of preparing a first laminate including a resin layer, a bonding layer that is provided on at least one surface side of the resin layer and includes peeling means, and a first metal layer provided on the bonding layer; a first wiring forming step of forming a first wiring conductor in the first laminate by etching the first metal layer; a second laminate forming step of forming a second laminate by laminating an insulating resin layer and a second metal layer in this order on a surface of the first laminate, the surface being provided with the first wiring conductor; a second wiring forming step of forming a second wiring conductor on the insulating resin layer by forming a non-through hole in the insulating resin layer.

Abstract: A method for manufacturing a package substrate for mounting a semiconductor device including: a first laminate preparing step of preparing a first laminate including a resin layer, a bonding layer that is provided on at least one surface side of the resin layer and includes peeling means, and a first metal layer provided on the bonding layer; a first wiring forming step of forming a first wiring conductor in the first laminate by etching the first metal layer; a second laminate forming step of forming a second laminate by laminating an insulating resin layer and a second metal layer in this order on a surface of the first laminate, the surface being provided with the first wiring conductor; a second wiring forming step of forming a second wiring conductor on the insulating resin layer by forming a non-through hole in the insulating resin layer.

Abstract: A method for manufacturing a package substrate for mounting a semiconductor device, including a substrate forming step (a) of forming a supporting substrate for circuit formation including a first insulating resin layer, a release layer including at least a silicon compound, and ultrathin copper foil having a thickness of 1 ?m to 5 ?m, in this order; a first wiring conductor forming step (b) of forming a first wiring conductor on the ultrathin copper foil of the supporting substrate for circuit formation by pattern copper electroplating; a lamination step (c) of disposing a second insulating resin layer so as to be in contact with the first wiring conductor, and heating and pressurizing the second insulating resin layer for lamination; a second wiring conductor forming step (d) of forming in the second insulating resin layer a non-through hole reaching the first wiring conductor and connecting an inner wall of the non-through hole.

Abstract: A method for manufacturing a package substrate for mounting a semiconductor device including: a first laminate preparing step of preparing a first laminate including a resin layer, a bonding layer that is provided on at least one surface side of the resin layer and includes peeling means, and a first metal layer provided on the bonding layer; a first wiring forming step of forming a first wiring conductor in the first laminate by etching the first metal layer; a second laminate forming step of forming a second laminate by laminating an insulating resin layer and a second metal layer in this order on a surface of the first laminate, the surface being provided with the first wiring conductor; a second wiring forming step of forming a second wiring conductor on the insulating resin layer by forming a non-through hole in the insulating resin layer.

Abstract: A method for manufacturing a package substrate for mounting a semiconductor device, including a substrate forming step (a) of forming a supporting substrate for circuit formation including a first insulating resin layer, a release layer including at least a silicon compound, and ultrathin copper foil having a thickness of 1 ?m to 5 ?m, in this order; a first wiring conductor forming step (b) of forming a first wiring conductor on the ultrathin copper foil of the supporting substrate for circuit formation by pattern copper electroplating; a lamination step (c) of disposing a second insulating resin layer so as to be in contact with the first wiring conductor, and heating and pressurizing the second insulating resin layer for lamination; a second wiring conductor forming step (d) of forming in the second insulating resin layer a non-through hole reaching the first wiring conductor and connecting an inner wall of the non-through hole.

Abstract: A fuel pump assembly is capable of improving follow-up ability of a push rod relative to an eccentric cam by increasing a spring force of a push rod spring, without increasing a size of the fuel pump assembly. The fuel pump assembly comprises a lower pump body and an upper pump body. A pump diaphragm clamped between the lower pump body and the upper pump body defines a pump chamber and an operation chamber. A diaphragm rod is integrally mounted on the pump diaphragm and is slidably supported on the lower pump body. The push rod is supported for movement along a longitudinal direction of the diaphragm rod. The push rod is movably supported within a push rod guide hole opened downwardly in the lower pump body and has a lower end extended downwardly from the lower pump body. The push rod spring is disposed within the push rod guide hole in compressed fashion and is arranged on the outer periphery of the diaphragm rod.

Abstract: A process is provided for the production of piroxicam tablets. According to the process, a solution of a water-soluble high-molecular substance is added to a mixture of piroxicam and lactose. The resultant mixture is granulated and then compressed into tablets.

Abstract: A heat exchanger according to the present invention is provided with bayonet tubes in its shell. One end of each of bayonet tube outer ducts is secured to and open at a tube sheet fixed at one end of the shell. One end of each of bayonet tube inner ducts is secured to and opened to a hot gas separation chamber. The other ends of inner and outer duct communicate with each other. A hot gas separation chamber is provided inside the tube side pressure drum which is attached to and in contact with the tube sheet. Such construction of a heat exchanger according to the invention as this prevents thermal stress from arising, rendering the design of economical and reliable heat exchangers possible.

Abstract: Tubes are positioned in a shell of a heat exchanger, hot fluid flowing through the tubes. An inlet of each of the tubes for hot fluid is opened to a separate section which is provided with a clearance from a thick tube sheet secured to the shell. An inlet and outlet port of each of the tubes are positioned alternately at the tube sheet. By the provision of the separate section and alternate positioning of inlets and outlets of tubes, thermal stress arising in the thick tube sheet is made very small.