Abstract: Disclosed is a heat exchanger core comprising a multiplicity of flat plate parts (3) formed by alternately folding back a single belt-like metal plate in zigzag at a first fold-back edge (1) and at a second fold-back edge (2); a plurality of element parts formed by joining peripheral edges (4) of a pair of adjoining flat plate parts (3) which are integrally coupled to each other at the first fold-back edge (1), adjoining element parts (5) being integrally coupled at a certain interval to each other at the second fold-back edge (2); and a pair of ports (6) and (7) for a first fluid formed at positions apart from each other at the peripheral edge of each element part (5), wherein a second fluid flows along the outer surface side of each element part (5).

Abstract: An image reading method and apparatus are provided to make it possible to reduce the time required for reading of a film image, and to reduce wear of a magnetic head and damage to a film which are caused by conveying of the film. There are provided a reading device which reads film images sequentially recorded on an elongated photographic film, a magnetically recorded data reading device which reads magnetically recorded data magnetically recorded on the photographic film, a conveying device for conveying the photographic film, and control device for controlling the reading device to carry out the preliminary reading of each of film images recorded on the photographic film while controlling the conveying device to convey the photographic film in a predetermined direction, and for controlling the magnetically recorded data reading device to read the first magnetically recorded date concurrently with the preliminary reading of the film images by the reading means.

Abstract: A component mounting apparatus has an ultrasonic vibration generating apparatus which supplies ultrasonic vibration making a lead-free solder with no lead which is provided between an electronic component and a circuit board melted to the electronic component. The lead-free solder is melted by the ultrasonic vibration and then connects the electronic component on the circuit board. Accordingly, the ultrasonic vibration generating apparatus can heat only the lead-free solder partially, the electronic component and the circuit board can be joined without applying thermal influence to a whole of the electronic component and circuit board.

Abstract: A heat exchanger is provided with a casing (5) in which a heat exchanger core (3) is received. The core (3) is provided with a pair of inlet/outlet convex portions (1) in its opposite end portions. These pipes (1) pass through the casing (5) to project outward.

Abstract: In a “stacked” type heat exchanger having a stack of elements through the interior of which a first fluid flows and having a core support arranged at the end of the stack in the stacked direction, the core support includes slits that extend from its edges up to the central portion, the slits capable of slightly deforming when subjected to a thermal stress. It is thus possible to reduce the thermal stress which may be applied to both the core support and the elements when there arises a difference of thermal expansion therebetween.

Abstract: By a manufacturing method including a process of supplying a connection-releasable connecting material (4) onto a surface of a plurality of chip parts (3) and a process of connecting the plurality of chip parts (3) by the connecting material (4), there is formed a chip assembly (1) comprised of the plurality of chip parts (3) connected with each other by means of the releasable connecting material (4). Further provided is a method of preparing the chip assembly (1), a process of releasing connection achieved by the connecting material (4) between a target chip part and an adjacent chip part, and a process of mounting the target chip part separated through releasing of the connection onto a board and soldering the same, thereby providing chip parts capable of easily coping with an increase of operation speed of chip parts on the process of mounting line, achieving an improved space efficiency, and suppressing waste of resources.

Abstract: In a printing apparatus and method, printing material is printed on to-be-printed circuit boards in a predetermined pattern and a printing state of the material is inspected. The apparatus includes the following devices. A board supporting device has a rotary body supporting a plurality of board-fixed tables to which the boards are secured, and turns the rotary body together with the board-fixed tables intermittently at predetermined angular intervals so as to stop the board-fixed tables at each of a fixing, recognizing, printing, and inspecting position. A board feed device feeds the boards to the board-fixed tables arranged at the fixing position. A board discharge device discharges the boards from the board-fixed tables arranged at the fixing position. A recognizing device recognizes fixed positions of the boards relative to the board-fixed tables at the recognizing position. A printing device prints the printing material on the boards at the printing position.

Abstract: The present invention provides a reflow apparatus and method effective to make constant the internal gas flow direction in a heating section within a reflow furnace. A circulating gas path is formed in a heating unit which collects and causes the gas to flow from a sirocco fan, up the rear side of the heating unit and then down towards a circuit board moving along a transfer path at the front side of the heating unit. Moreover, a plurality of straightening plates are arranged above the transfer path of the heating unit so as to guide the hot gas, which is flowing forwardly downwardly toward the circuit board moving along the transfer path. A blow-down nozzle is provided and includes a plurality of plates aligned in rows in the transferring direction of the circuit boards. The plates have an inverse U-shaped cross section. The blow-down nozzle is arranged below the straightening plates to cause the vertical hot gas flows to flow uniformly over the whole surface of the circuit board.

Abstract: A reactor circulating pump system comprises a pump and a power supply apparatus for driving the pump. In the power supply apparatus, an AC/DC converter and a DC/AC converter provided with an AC voltage/frequency adjuster are connected in series between an in-plant AC bus and a reactor circulating pump, a DC voltage adjuster, a superconducting energy storage apparatus and an excitation power supply source are connected to the input side of the DC/AC converter. A controller is incorporated in the power supply apparatus so as to receive a signal indicating instantaneous power failure or power breakdown on the in-plant AC bus, or reactor trip, and change an AC voltage supplied to the reactor circulating pump with a ratio of AC voltage and frequency kept constant for controlling a pump delivery rate to have a predetermined value, while holding an output voltage from the superconducting energy storage apparatus at a predetermined value.

Abstract: A clean space system prevents pollution of clean surroundings in a processing space. Pollution is avoided which could otherwise occur when a worker comes in contact with the processing space while carrying out processes and operations in the clean surroundings. The apparatus includes a clean processing space, in which the processes and operations are carried out, and a preparing space coupled with an opening for work in the processing space. The preparing space is used by the worker prior to entering the processing space. In the preparing space, the worker performs preliminary actions such as changing his clothes and cleaning himself using an air shower to remove particles from his body.

Abstract: The present invention provides a reflow apparatus and method effective to make constant the internal gas flow direction in a heating section within a reflow furnace. A circulating gas path is formed in a heating unit which collects and causes the gas to flow from a sirocco fan, up the rear side of the heating unit and then down towards a circuit board moving along a transfer path at the front side of the heating unit. Moreover, a plurality of straightening plates are arranged above the transfer path of the heating unit so as to guide the hot gas, which is flowing forwardly downwardly toward the circuit board moving along the transfer path. A blow-down nozzle is provided and includes a plurality of plates aligned in rows in the transferring direction of the circuit boards. The plates have an inverse U-shaped cross section. The blow-down nozzle is arranged below the straightening plates to cause the vertical hot gas flows to flow uniformly over the whole surface of the circuit board.

Abstract: The present invention provides a reflow apparatus and method effective to make constant the internal gas flow direction in a heating section within a reflow furnace. A circulating gas path is formed in a heating unit which collects and causes the gas to flow from a sirocco fan, up the rear side of the heating unit and then down towards a circuit board moving along a transfer path at the front side of the heating unit. Moreover, a plurality of straightening plates are arranged above the transfer path of the heating unit so as to guide the hot gas, which is flowing forwardly downwardly toward the circuit board moving along the transfer path. A blow-down nozzle is provided and includes a plurality of plates aligned in rows in the transferring direction of the circuit boards. The plates have an inverse U-shaped cross section. The blow-down nozzle is arranged below the straightening plates to cause the vertical hot gas flows to flow uniformly over the whole surface of the circuit board.

Abstract: The traverse apparatus of the subject invention is provided at the end of the main base 24 with a control box 38 having electromagnetic valves 57, 58, relief valves 59, 60, and manifold 61; and, one or more connectors 54 affixed at one end to sliding base 28 and at the other end to a separate sliding base 70. By these elements, the main body having cylinder 32 is separated from the rail guides 22, 23, the work of replacing a worn cylinder 32 is made easy, conveyance can be expedited, and the head mounting bases for attaching working heads can be increased readily.

Abstract: A clean space having a desired total volume is formed by coupling unit room bodies in sequence. Alterations in the configuration of clarifying and air-conditioning facilities are carried out easily and quickly, even if the structure and disposition of the clean space are altered. Each of the unit room bodies includes an air-circulator such as a fan unit and a dust catcher such as an air-filter. Each of the unit room bodies also includes an air conditioner-setting space shut off from the clean space in the interior of the unit room body.

Abstract: A computer system and method executing a reset method when an adaptor module is faulty is provided. The system comprises processor modules (1), adaptor modules (2), a system bus (3) connecting the processor modules (1) and the adaptor modules (2), devices (4) and lines connected to the adaptor module (2). When the adaptor module (2) is faulty and enters a special status, the method comprises a step of issuing an instruction by which the processor module (1) resets the adaptor module (2), and another step in that when the processor module (1) detects the special status of the adaptor module (2), the adaptor module (2) starts to operate by various predetermined operations. By using the above method, even when the adaptor module (2) has entered a non-operational status, the adaptor module (2) is initialized and a reset capable of restarting the system can be carried out.

Abstract: A semiconductor integrated circuit of the present invention features that a voltage is stably applied to a cell for high-speed operation and the number of lengthy wirings which run around a cell row is reduced without increasing a chip area, so that line efficiency can be improved. Since a power source line 16 and a ground line 17, each having a wide line running width, are formed on a top line layer above a cell 1 so as to cover nearly the whole surface of the cell 1, electrical resistance of the power source line 16 and the ground line 17 is reduced and then the voltage applied to the cell for high-speed operation is stabilized and such design is enabled without increasing the chip area. In addition, since penetrating lines 18 and 19 are formed on the lower line layer on a border between the cells, the number of lengthy lines which run around the cell row can be reduced by using the penetrating lines 18 and 19 as connecting between cells, so that line efficiency can be improved.

Abstract: There is provided a semiconductor integrated circuit device in which a unit circuit element row is formed by connecting unit circuit elements in a second direction, whose first length in a first direction crossing the second direction is predetermined and second length in the second direction can be varied, and a plurality of unit circuit element rows are connected to each other by connecting lines. The semiconductor integrated circuit device includes a first unit circuit element arranged apart from the nearest connecting line along the first direction by a first reference distance and a second unit circuit element projected in the first direction and arranged apart from the nearest connecting line by a second reference distance which is shorter than the first reference distance, whose second length in the second direction is reduced in comparison with the first length of the first unit circuit element.

Abstract: A photoconductor for electrophotography comprises a novel organic compound as a charge transporting substance. The organic compounds is represented by the following general formula: ##STR1## wherein, each of R.sub.1 to R.sub.4 stands for a hydrogen atom, a halogen atom, an alkoxy group, or an alkyl group, an aryl group, an alkenyl group, an aralkyl group, a thienyl group, each of which may have a substituent(s).

Abstract: A photosensitive member for electrophotography have a photosensitive layer 20 provided on an electroconductive substrate 1 and, containing a compound selected from among derivatives of thiophene, diphenylthiophene or oxadiazole. When the surface of the photosensitive member was positively charged and then irradiated with white light, the half decay exposure amount with which the surface potential is decreased to half is 5 to 10 lux.multidot.sec. The photosensitive member is capable of being used in semiconductor laser printers.

Abstract: A photosensitive member for electrophotography have a photosensitive layer 20 provided on an electroconductive substrate 1 and, containing a compound selected from among derivatives of thiophene, diphenylthiophene or oxadiazole. When the surface of the photosensitive member was positively charged and then irradiated with white light, the half decay exposure amount with which the surface potential is decreased to half is 5 to 10 lux.cndot.sec. The photosensitive member is capable of being used in semiconductor laser printers.