Patents by Inventor Youichi Ueda
Youichi Ueda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6595907Abstract: A heat roller for a fixing device included in an image forming apparatus has an insulation layer and a conductive layer sequentially formed on the inner periphery thereof. To form each of the insulation layer and conductive layer, a spray gun is inserted into the heat roller. Subsequently, paint, which is a liquid for forming the insulation layer or the conductive layer, is fed under pressure to the spray gun. The paint is radially jetted via the holes of the spray gun and evenly deposits on the inner surface of the heat roller. In this condition, the spray gun is moved in a preselected direction in order to coat the entire inner periphery of the heat roller. After the insulation layer has been formed and then sintered, the conductive layer is formed on the insulation layer and then sintered. The two layers can be formed in a short period of time and provides the heat roller with high quality at low cost. A method of producing the heat roller is also disclosed.Type: GrantFiled: November 6, 2000Date of Patent: July 22, 2003Assignees: Ricoh Company, Ltd., Origin Electric Company, Limited, Tohoku Ricoh Co., Ltd.Inventors: Chuji Ishikawa, Takayuki Kuga, Yasuhiro Genjima, Haruo Ninomiya, Youichi Ueda, Kazunori Kon
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Patent number: 6469109Abstract: An epoxy resin composition is disclosed as containing, as essential components, an epoxy resin, an aryl ester compound obtained from a polyhydric phenol representedd by a formula (4) with a carbonyl compound represented by a general formula (2) and a cure accelerator. When cured, the resulting product has low dielectric constant and a low dielectric loss tangent. A copper-clad laminate formed using the described composition has a low dielectric constant and a low dielectric loss tangent. The copper-clad laminate exhibits excellent adhesiveness characteristics and is suitable for use in multilayer printed wiring boards in high speed operations, particularly in the high frequency region.Type: GrantFiled: June 30, 1997Date of Patent: October 22, 2002Assignee: Sumitomo Chemical Company, LimitedInventors: Youichi Ueda, Yasuhiro Endo, Mitsuhiro Shibata, Kaori Yamasaki
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Publication number: 20020010288Abstract: An aryl ester compound composed of a polyhydric phenol in which at least one OH group has been esterified with an organic acid or its derivatives having 1 to 20 carbon atoms, said polyhydric phenol being the condensation product of a phenolic compound represented by the general formula: 1Type: ApplicationFiled: June 30, 1997Publication date: January 24, 2002Inventors: YOUICHI UEDA, YASUHIRO ENDO, MITSUHIRO SHIBATA, KAORI YAMASAKI
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Patent number: 6223243Abstract: An access control apparatus, method, and recording medium for storing a program, provides equal input/output (IO) opportunities to auxiliary memory units for all users by attaching priority information for each user to user-entered IO commands. The prioritized IO commands are stored in an IO queue corresponding to a particular one of the auxiliary memory units, and physical IO is performed on each of the auxiliary memory units in the sequence of priority information attached to the prioritized IO commands in each IO queue irrespective of who the entrant users are.Type: GrantFiled: June 5, 1998Date of Patent: April 24, 2001Assignee: NEC CorporationInventors: Youichi Ueda, Sukeyoshi Nakashima
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Patent number: 5916683Abstract: A copper clad laminate is disclosed as being obtained by thermoforming a prepreg and a copper foil. As disclosed, the pre-preg (uncured) includes a substrate impregnated with an epoxy resin, an aryl ester compound and a curing agent. The copper-clad laminate has a low dielectric constant and a low dielectric loss tangent. It is suitable for a multilayer printed wiring board for high speed operation, especially at high-frequency region.Type: GrantFiled: November 4, 1997Date of Patent: June 29, 1999Assignee: Sumitomo Chemical Company, Ltd.Inventors: Youichi Ueda, Yasuhiro Endo, Mitsuhiro Shibata, Kaori Yamasaki
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Patent number: 5864737Abstract: An apparatus which forms a discharge electric field in order to discharge an object. The apparatus includes an electrode member facing and separated by a preselected gap from the object, and a power source which applies a discharge voltage to the electrode member to thereby cause discharge to occur between the object and the electrode member. Further, the electrode member at the gap includes a material selected in association with the gap so that a functional relationship between the discharge voltage and a discharge current caused by the discharge voltage is a continuous function.Type: GrantFiled: September 27, 1996Date of Patent: January 26, 1999Assignee: Ricoh Company, Ltd.Inventors: Makoto Obu, Seiichi Miyakawa, Kunio Hibi, Kozoh Sudoh, Hidenori Kanno, Youichi Ueda, Toshio Inada, Yusuke Takeda, Sadayuki Iwai
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Patent number: 5734008Abstract: The polyimide film of this invention is formed from a polyimide, which is prepared by reacting a diamino compound represented by the general formula (1): ##STR1## wherein X represents a hydrocarbon group having 1 to 20 carbon atoms or a sulfur atom; R represents each independently a halogen atom, a hydrocarbon group having 1 to 6 carbon atoms or a halogen-containing hydrocarbon group having 1 to 6 carbon atoms; a represents each independently an integer of 0 to 4;with a tetracarboxylic dianhydride represented by the general formula (2) ##STR2## wherein Y represents a tetravalent organic group having 2 or more carbon atoms.The polyimide film obtained can be applied favorably to a flexible printed circuit board without adhesion layer, a protective coating for electronic parts and electric wires, or a heat resistant adhesive.Type: GrantFiled: October 23, 1995Date of Patent: March 31, 1998Assignee: Sumitomo Chemical Company, LimitedInventors: Mika Shirasaki, Youichi Ueda, Mitsuhiro Shibata
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Patent number: 5726257Abstract: An aryl ester compound composed of a polyhydric phenol in which at least one OH group has been esterified with an organic acid or its derivatives having 1 to 20 carbon atoms, said polyhydric phenol being the condensation product of a phenolic compound represented by the general formula: ##STR1## with a carbonyl compound represented by the general formula: ##STR2## which aryl ester compound can give, when used as a curing agent for an epoxy resin, a cured product having a low dielectric constant and a low dielectric loss tangent; an epoxy resin composition comprising as the essential components an epoxy resin, said aryl ester compound and a cure accelerator; and a copper-clad laminate using the epoxy resin composition. The copper-clad laminate has a low dielectric constant and a low dielectric loss tangent and is excellent in adhesiveness as compared with conventional ones, and hence, is suitable for multilayer printed wiring board for high speed operation, especially at high-frequency region.Type: GrantFiled: August 28, 1995Date of Patent: March 10, 1998Assignee: Sumitomo Chemical Company, Ltd.Inventors: Youichi Ueda, Yasuhiro Endo, Mitsuhiro Shibata, Kaori Yamasaki
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Patent number: 5399715Abstract: The polyamino oligomers of this invention are obtained by reacting diisopropenylbenzenes or bis(.alpha.-hydroxyisopropyl)benzenes and anilines in the presence of an acid catalyst and characterized by the recurring unit having an indane skeleton. These polyamino oligomers can be used as curing agent for laminate resins. Also, they can be reacted with maleic anhydride to prepare polymaleimide compounds of this invention.The polymaleimide compounds of this invention are low in melting point (or softening point) and, in combination with a substance producing three-dimensional crosslinkage such as triallyl isocyanurate, aromatic diamine, etc., can provide thermosetting resin compositions suited for producing copper-clad laminates. The copper-clad laminates obtained from the thermosetting resin compositions of this invention are low in dielectric constant, heat-resistant and also low in water absorptivity, so that they are useful for multi-layer printed boards.Type: GrantFiled: June 2, 1993Date of Patent: March 21, 1995Assignee: Sumitomo Chemical Company, LimitedInventors: Shigeki Naitoh, Yasuhiro Endo, Youichi Ueda, Kunimasa Kamio
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Patent number: 5329047Abstract: A thermosetting resin composition useful for a copper-clad laminate is provided, which comprise (A) an aromatic diamine compound represented by the following formula: ##STR1## wherein Ar is a divalent aromatic residue, and R.sub.1, R.sub.2, R.sub.3 and R.sub.4 each is an allyl group or a hydrogen atom but at least one of them is an allyl group, and (B) a polymaleimide compound having two or more maleimide groups in a molecule thereof.Type: GrantFiled: December 13, 1991Date of Patent: July 12, 1994Assignee: Sumitomo Chemical Co., Ltd.Inventors: Shigeki Naitoh, Yasuhisa Saito, Yasuhiro Hirano, Kazuo Takebe, Kunimasa Kamio, Youichi Ueda
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Patent number: 5109087Abstract: A thermosetting resin composition useful for a copper-clad laminate is provided, which comprise (A) an aromatic diamine compound represented by the following formula: ##STR1## wherein Ar is a divalent aromatic residue, and R.sub.1, R.sub.2, R.sub.3 and R.sub.4 each is an allyl group or a hydrogen atom but at least one of them is an allyl group, and (B) a polymaleimide compound having two or more maleimide groups in a molecule thereof.Type: GrantFiled: January 12, 1990Date of Patent: April 28, 1992Assignee: Sumitomo Chemical Company, LimitedInventors: Shigeki Naitoh, Yasuhisa Saito, Yasuhiro Hirano, Kazuo Takebe, Kunimasa Kamio, Youichi Ueda
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Patent number: 4960860Abstract: The present invention provides an improved epoxy resin composition comprising an epoxy resin and a novel imide compound represented by the formula ##STR1## wherein X represents an --NH.sub.2 group and/or --OH group, Ar.sub.1 and Ar.sub.2 independently represent an aromatic residue, R.sub.1 represents a hydrogen atom or an alkyl group having from 1 to 10 carbon atoms, R.sub.2 represent a hydrogen atom, an alkyl or alkoxy group having from 1 to 20 carbon atoms or hydroxyl group, and each of m and n represents a number of from 0 to 30.Type: GrantFiled: May 31, 1989Date of Patent: October 2, 1990Assignee: Sumitomo Chemical Co., Ltd.Inventors: Yasuhisa Saito, Kunimasa Kamio, Mitsuhiro Shibata, Katsuya Watanabe, Yutaka Shiomi, Youichi Ueda
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Patent number: 4888407Abstract: The present invention provides an improved epoxy resin composition comprising an epoxy resin and a novel imide compound represented by the formula ##STR1## wherein X represents an --NH.sub.2 group and/or --OH group, Ar.sub.1 and Ar.sub.2 independently represent an aromatic residue, R.sub.1 represents a hydrogen atom or an alkyl group having from 1 to 10 carbon atoms, R.sub.2 represents a hydrogen atom, an alkyl or alkoxy group having from 1 to 20 carbon atoms or hydroxyl group, and each of m and n represents a number of from 0 to 30.Type: GrantFiled: December 28, 1987Date of Patent: December 19, 1989Assignee: Sumitomo Chemical Co., Ltd.Inventors: Saito Yasuhisa, Kunimasa Kamio, Mitsuhiro Shibata, Katsuya Watanabe, Yutaka Shiomi, Youichi Ueda
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Patent number: 4849238Abstract: A foodstuff having improved taste quality comprising a taste-improving amount of a pepper extract, a piperine-containing fraction of pepper or one or more piperines.Type: GrantFiled: April 1, 1988Date of Patent: July 18, 1989Assignee: Ajinomoto Co., Inc.Inventors: Hidehiko Wakabayashi, Takako Tsubuku, Youichi Ueda, Ryuichi Miyajima
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Patent number: 4741914Abstract: A flavor enhancing seasoning is disclosed, which is prepared by blanching garlic, and extracting the blanched product with water. The extract produced may be deodorized and concentrated, to provide a seasoning additive that dramatically improves flavor fullness, depth and duration, and can be advantageously combined with flavor intensifiers such as MSG.Type: GrantFiled: April 4, 1986Date of Patent: May 3, 1988Assignee: Ajinomoto Co., Inc.Inventors: Akimitsu Kimizuka, Youichi Ueda, Makoto Sakaguchi, Ryuichi Miyajima