Patents by Inventor Youko Maekawa

Youko Maekawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5808878
    Abstract: A circuit substrate which is formed by fixing a wiring pattern on an insulated substrate has a shielding member for absorbing or reflecting radio waves formed on a first electronic component electrically connected. A shielding layer for absorbing or reflecting radio waves is formed on the circuit substrate. And, a second electronic component is disposed between the first electronic component and the shielding layer.
    Type: Grant
    Filed: February 29, 1996
    Date of Patent: September 15, 1998
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Yasuhito Saito, Youko Maekawa, Shimpei Yoshioka