Abstract: A substrate analysis apparatus is provided. The substrate analysis includes: an interlayer conveying module configured to transport a first FOUP; an exchange module which is connected to the interlayer conveying module, and configured to transfer a wafer from the first FOUP to a second FOUP; a pre-processing module configured to form a test wafer piece using the wafer inside the second FOUP; an analysis module configured to analyze the test wafer piece; and a transfer rail configured to transport the second FOUP containing the wafer and a tray containing the test wafer piece. The wafer includes a first identifier indicating information corresponding to the wafer, the test wafer piece includes a second identifier indicating information generated by the pre-processing module which corresponds to the test wafer piece, and the analysis module is configured to analyze the first identifier and the second identifier in connection with each other.

Abstract: A padlock seal includes a main body including a first and second cavity. The first and second cavities are separated by a divider member that defines a wall in the first and second cavities. The divider member includes at least one catch formed on each wall of the cavities, and each of the at least one catches in each cavity is formed perpendicular with respect to the first and second cavities. A locking wire includes a pressing member and a pair of coupling members coupled to opposing ends of the pressing member. The coupling members each have a flexible hook portion for interfacing with said at least one catch in a corresponding cavity of the main body.