Abstract: According to an aspect of the present disclosure, there is provided a substrate treating apparatus comprising: a vessel part having a substrate treatment region formed therein and including a supply port through which a treating fluid is supplied to the substrate treatment region and an exhaust port through which the treating fluid is exhausted from the substrate treatment region; a fluid supply unit configured to supply the treating fluid to the substrate treatment region; an exhaust unit configured to exhaust the treating fluid from the vessel part. The exhaust unit comprises: a main line connected to the exhaust port; an extension line branched from at least one of first and second nodes of the main line and including at least one of a first orifice or a first check valve to control an exhaust speed; and an auxiliary line branched from a third node of the main line, where an orifice and a check valve are not formed.

Abstract: A bitline sense amplifier including: an amplifier which is connected between a first sensing bitline and a second sensing bitline, and detects and amplifies a voltage difference between a first bitline and a second bitline in response to a first control signal and a second control signal; and an equalizer which is connected between a first supply line through which the first control signal is supplied and a second supply line through which the second control signal is supplied, and pre-charges the first bitline and the second bitline with a precharge voltage in response to an equalizing control signal, wherein the equalizer includes an equalizing enable transistor in which a source terminal is connected to the first supply line and performs equalizing in response to the equalizing control signal.

Abstract: Proposed are a wafer heating apparatus and a wafer processing apparatus using the same. More particularly, proposed are a wafer heating apparatus having an improved structure to enable efficient cooling of a terminal block, and a wafer processing apparatus using the same. A wafer heating apparatus for heating a wafer according to one embodiment includes a heater disposed below the wafer and configured to serve as a heat source, a cooling plate disposed below the heater and configured to provide cool air, and a terminal block configured to supply power to the heater and having a lower end portion in contact with the cooling plate.

Abstract: An apparatus and method for absorbing and recovering carbon dioxide from flue gas using ammonia water as an absorbent, including an absorption column and a circulation cooler connected to the absorption column so that a high-temperature absorbent is recovered from the absorption column, cooled to a preset temperature, and then supplied again into the absorption column, in order to dissipate absorptive heat generated when carbon dioxide is absorbed from the flue gas.

Abstract: An apparatus and method for absorbing and recovering carbon dioxide from flue gas using ammonia water as an absorbent, including an absorption column and a circulation cooler connected to the absorption column so that a high-temperature absorbent is recovered from the absorption column, cooled to a preset temperature, and then supplied again into the absorption column, in order to dissipate absorptive heat generated when carbon dioxide is absorbed from the flue gas.