Patents by Inventor Young-chai KWON

Young-chai KWON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR PACKAGE WITH THROUGH SILICON VIA AND RELATED METHOD OF FABRICATION
    Publication number: 20080284041
    Abstract: In a semiconductor package, an electrode has a first part extending through a semiconductor substrate and a second part extending from the first part through a compositional layer to reach a conductive pad.
    Type: Application
    Filed: March 11, 2008
    Publication date: November 20, 2008
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyung-sun JANG, Un-byoung KANG, Woon-seong KWON, Young-chai KWON, Chung-sun LEE, Dong-ho LEE