Abstract: A cover structure for a light source includes a frame having an inner space, a driver, and an oxygen discharger. The frame is combined with the light source such that an object disposed in the inner space is covered by the frame, and the inner space is sealed by the combined frame and light source to provide a closed space between the frame and the light source enclosing the object. The driver combines the frame and the light source by moving the frame toward the light source such that the frame contacts the light source. The oxygen discharger creates a low-oxygen state in the closed space by discharging oxygen from the closed space.

Abstract: A cover structure for a light source includes a frame having an inner space, a driver, and an oxygen discharger. The frame is combined with the light source such that an object disposed in the inner space is covered by the frame, and the inner space is sealed by the combined frame and light source to provide a closed space between the frame and the light source enclosing the object. The driver combines the frame and the light source by moving the frame toward the light source such that the frame contacts the light source. The oxygen discharger creates a low-oxygen state in the closed space by discharging oxygen from the closed space.

Abstract: Provided are an apparatus, method for separating a chip and a method for fabricating the apparatus. An apparatus for separating a chip, according to example embodiments, may include a suction holder. The suction holder may include an upper surface with at least one suction hole to suction and fix an adhesive tape to which a plurality of semiconductor chips may be attached. The apparatus for separating a chip may also include a rotatable plunger in the suction holder. The rotatable plunger may include an upper end configured to pass through the at least one suction hole and to project over the suction holder upon rotation of the rotatable plunger. The apparatus for separating a chip may also include a vertically movable plunger lifter. The vertically movable plunger lifter may be configured to rotate the rotatable plunger by contacting and raising a lower end of the rotatable plunger.

Abstract: A bonding apparatus for a semiconductor package determines whether a bottom of a bonding head is contaminated, and may include a contamination detecting unit for a bonding head attached to a body to apply pressure to the semiconductor package. The contamination detecting unit is below the bonding head to detect contamination on the bottom of the bonding head, a bonding block, and a bonding stage.

Abstract: Die-bonding equipment and a method for detecting adhesive dotting on a substrate are disclosed. A dotted adhesive pattern illustrating an actually dotted state of the adhesive on a substrate is overlap-photographed with a standard pattern illustrating proper dotting pattern. The overlap-photographed pattern is compared with a standard overlap pattern. According to the compared result, whether the adhesive is properly dotted on the substrate is decided. When the adhesive is not properly dotted, an alarm signal is generated.