Patents by Inventor Young-Jae Shin
Young-Jae Shin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11982462Abstract: An air conditioner includes a cabinet including an inlet port and a frame including an outlet port and coupled to the cabinet. A heat exchanger is disposed between the cabinet and the frame to exchange heat with air introduced into the inlet port and discharged to the outlet port. A blocking member is configured to connect the frame and the heat exchanger to prevent air heat-exchanged with the heat exchanger from leaking into the cabinet. This structure inhibits dew from being generated on the cabinet.Type: GrantFiled: October 8, 2019Date of Patent: May 14, 2024Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Chang-Woo Jung, Sung Jae Kim, Jin-Gyun Kim, Young Tae Song, Hae Gyun Shin, Chang Sik Lee, Seo Young Cho, Sung Hyun Chun
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Publication number: 20240153435Abstract: A display driving circuit is provided. The display driving circuit includes a timing controller configured to output image data and a source control signal, a first source driver circuit configured to output first source data of the image data by activating a plurality of first data lines in accordance with the source control signal, the first data lines having a first output spreading time, a second source driver circuit configured to output second source data of the image data by activating a plurality of second data lines in accordance with the source control signal, the second data lines having a second output spreading time, and a third source driver circuit configured to output third source data of the image data by activating a plurality of third data lines in accordance with the source control signal, the third data lines having a third output spreading time, wherein the first output spreading time, the second output spreading time and the third output spreading time do not overlap.Type: ApplicationFiled: September 27, 2023Publication date: May 9, 2024Applicant: Samsung Electronics Co., Ltd.Inventors: Jun-Hong PARK, Oh Jae KWON, Suk Ki MIN, Taek Kyun SHIN, Doo-Hee LIM, Young Ho CHOI
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Publication number: 20240110892Abstract: An apparatus for automatically inspecting the welding state of a battery module is configured to inspect welding states of welding parts of a plurality of leads for electrical connection based on a deep penetration inspection using application of eddy current to the welding parts of the leads.Type: ApplicationFiled: March 30, 2023Publication date: April 4, 2024Inventors: Yong Bae Park, Joon Dong Oh, Young Kwon Kim, Ho Jae Shin, Baek Young Choi
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Publication number: 20240101803Abstract: Disclosed are a thermoplastic elastomeric composition for vehicle mounts which has improved surface energy and compression set while solving reduction in wear strength, by blending EPDM rubber, polypropylene, silicon, and poly(styrene-ethylene-butadiene-styrene) (SEBS) in appropriate amounts, and a molded article including the same.Type: ApplicationFiled: May 2, 2023Publication date: March 28, 2024Inventors: Sang Hyun Lee, Young Chul Shin, Ji Hye Park, Ki Hyun Cho, Han Sang Lee, Kyoung Min Hong, Ki Jae Kim
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Publication number: 20240074065Abstract: A reprint apparatus may include: a defect checking unit configured to check a defective portion in a solder resist layer of a circuit board; a material filling unit positioned above the circuit board to fill the defective portion with a filling material; and a curing unit configured to cure the material filled in the defective portion. The defect checking unit may be configured to calculate a volume of the defective portion, and the material filling unit may be configured to calculate a discharge amount of the filling material based on the calculated volume of the defective portion, and then discharge the filling material by the discharge amount.Type: ApplicationFiled: February 17, 2023Publication date: February 29, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Do Jae YOO, Yong Gil NAMGUNG, Jong Hoon SHIN, Sang Soon CHOI, Young Chul AN
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Patent number: 8025830Abstract: A UV nanoimprint lithography process and its apparatus that are able to repeatedly fabricates nanostructures on a substrate (wafer, UV-transparent plate) by using a stamp that is as large as or smaller than the substrate in size are provided. The apparatus includes a substrate chuck for mounting the substrate; a stamp made of UV-transparent materials and having more than two element stamps, wherein nanostructures are formed on the surface of each element stamp; a stamp chuck for mounting the stamp; a UV lamp unit for providing UV light to cure resist applied between the element stamps and the substrate; a moving unit for moving the substrate chuck or the stamp chuck to press the resist with the element stamps and substrate; and a pressure supply unit for applying pressurized gas to some selected regions of the substrate to help complete some incompletely filled element stamps.Type: GrantFiled: November 27, 2009Date of Patent: September 27, 2011Assignee: Korea Institute of Machinery & MaterialsInventors: Jun-Ho Jeong, HyonKee Sohn, Young-Suk Sim, Young-Jae Shin, Eung-Sug Lee, Kyung-Hyun Whang
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Publication number: 20100072672Abstract: A UV nanoimprint lithography process and its apparatus that are able to repeatedly fabricates nanostructures on a substrate (wafer, UV-transparent plate) by using a stamp that is as large as or smaller than the substrate in size are provided. The apparatus includes a substrate chuck for mounting the substrate; a stamp made of UV-transparent materials and having more than two element stamps, wherein nanostructures are formed on the surface of each element stamp; a stamp chuck for mounting the stamp; a UV lamp unit for providing UV light to cure resist applied between the element stamps and the substrate; a moving unit for moving the substrate chuck or the stamp chuck to press the resist with the element stamps and substrate; and a pressure supply unit for applying pressurized gas to some selected regions of the substrate to help complete some incompletely filled element stamps.Type: ApplicationFiled: November 27, 2009Publication date: March 25, 2010Inventors: Jun-Ho JEONG, HyonKee Sohn, Young-Suk Sim, Young-Jae Shin, Eung-Sug Lee, Kyung-Hyun Whang
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Patent number: 7645133Abstract: A UV nanoimprint lithography process and its apparatus that are able to repeatedly fabricates nanostructures on a substrate (wafer, UV-transparent plate) by using a stamp that is as large as or smaller than the substrate in size are provided. The apparatus includes a substrate chuck for mounting the substrate; a stamp made of UV-transparent materials and having more than two element stamps, wherein nanostructures are formed on the surface of each element stamp; a stamp chuck for mounting the stamp; a UV lamp unit for providing UV light to cure resist applied between the element stamps and the substrate; a moving unit for moving the substrate chuck or the stamp chuck to press the resist with the element stamps and substrate; and a pressure supply unit for applying pressurized gas to some selected regions of the substrate to help complete some incompletely filled element stamps.Type: GrantFiled: February 24, 2005Date of Patent: January 12, 2010Assignee: Korea Institute of Machinery & MaterialsInventors: Jun-Ho Jeong, HyonKee Sohn, Young-Suk Sim, Young-Jae Shin, Eung-Sug Lee, Kyung-Hyun Whang
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Patent number: 7442316Abstract: A microcontact printing method using an imprinted nanostructure is provided, wherein the microcontact printing is introduced to a nanoimprint lithography process to pattern a self-assembled monolayer (SAM). The method includes forming a nanostructure on a substrate by using the nanoimprint lithography process; and patterning the nanostructure with the microcontact printing method. The operation of patterning includes: depositing a metal thin film on the nanostructure; contacting a plate with the nanostructure to selectively print the SAM on the nanostructure, wherein the SAM is inked on the plate and the metal thin film is deposited on the nanostructure; selectively removing the metal thin film by using the SAM as a mask; removing the SAM from the nanostructure; and patterning the substrate by using the remaining metal thin film on the nanostructure as a mask.Type: GrantFiled: February 23, 2005Date of Patent: October 28, 2008Assignee: Korea Institute of Machinery & MaterialsInventors: Jun-Ho Jeong, HyonKee Sohn, Young-Suk Sim, Young-Jae Shin, Eung-Sug Lee, Kyung-Hyun Whang
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Patent number: 6943117Abstract: A UV nanoimprint lithography process for forming nanostructures on a substrate. The process includes depositing a resist on a substrate; contacting a stamp having formed thereon nanostructures at areas corresponding to where nanostructures on the substrate are to be formed to an upper surface of the resist, and applying a predetermined pressure to the stamp in a direction toward the substrate, the contacting and applying being performed at room temperature and at low pressure; irradiating ultraviolet rays onto the resist; separating the stamp from the resist; and etching an upper surface of the substrate on which the resist is deposited. The stamp is an elementwise embossed stamp that comprises at least two element stamps, and grooves formed between adjacent element stamps and having a depth that is greater than a depth of the nanostructures formed on the element stamps.Type: GrantFiled: June 19, 2003Date of Patent: September 13, 2005Assignee: Korea Institute of Machinery & MaterialsInventors: Jun-Ho Jeong, HyonKee Sohn, Young-Suk Sim, Young-Jae Shin, Eung-Sug Lee, Kyung-Hyun Whang
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Publication number: 20050186405Abstract: A microcontact printing method using an imprinted nanostructure is provided, wherein the microcontact printing is introduced to a nanoimprint lithography process to pattern a self-assembled monolayer (SAM) The method includes forming a nanostructure on a substrate by using the nanoimprint lithography process; and patterning the nanostructure with the microcontact printing method. The operation of patterning includes: depositing a metal thin film on the nanostructure; contacting a plate with the nanostructure to selectively print the SAM on the nanostructure, wherein the SAM is inked on the plate and the metal thin film is deposited on the nanostructure; selectively removing the metal thin film by using the SAM as a mask; removing the SAM from the nanostructure; and patterning the substrate by using the remaining metal thin film on the nanostructure as a mask.Type: ApplicationFiled: February 23, 2005Publication date: August 25, 2005Inventors: Jun-Ho Jeong, HyonKee Sohn, Young-Suk Sim, Young-Jae Shin, Eung-Sug Lee, Kyung-Hyun Whang
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Publication number: 20050184436Abstract: A UV nanoimprint lithography process and its apparatus that are able to repeatedly fabricates nanostructures on a substrate (wafer, UV-transparent plate) by using a stamp that is as large as or smaller than the substrate in size are provided. The apparatus includes a substrate chuck for mounting the substrate; a stamp made of UV-transparent materials and having more than two element stamps, wherein nanostructures are formed on the surface of each element stamp; a stamp chuck for mounting the stamp; a UV lamp unit for providing UV light to cure resist applied between the element stamps and the substrate; a moving unit for moving the substrate chuck or the stamp chuck to press the resist with the element stamps and substrate; and a pressure supply unit for applying pressurized gas to some selected regions of the substrate to help complete some incompletely filled element stamps.Type: ApplicationFiled: February 24, 2005Publication date: August 25, 2005Inventors: Jun-Ho Jeong, HyonKee Sohn, Yong-Suk Sim, Young-Jae Shin, Eung-Sug Lee, Kyung-Hyun Whang
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Publication number: 20040192041Abstract: A UV nanoimprint lithography process for forming nanostructures on a substrate. The process includes depositing a resist on a substrate; contacting a stamp having formed thereon nanostructures at areas corresponding to where nanostructures on the substrate are to be formed to an upper surface of the resist, and applying a predetermined pressure to the stamp in a direction toward the substrate, the contacting and applying being performed at room temperature and at low pressure; irradiating ultraviolet rays onto the resist; separating the stamp from the resist; and etching an upper surface of the substrate on which the resist is deposited. The stamp is an elementwise embossed stamp that comprises at least two element stamps, and grooves formed between adjacent element stamps and having a depth that is greater than a depth of the nanostructures formed on the element stamps.Type: ApplicationFiled: June 19, 2003Publication date: September 30, 2004Inventors: Jun-Ho Jeong, HyonKee Sohn, Young-Suk Sim, Young-Jae Shin, Eung-Sug Lee, Kyung-Hyun Whang