Patents by Inventor Young-Joon Son

Young-Joon Son has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240150191
    Abstract: In a method for recovering lithium hydroxide from a lithium secondary battery, cathode powder is prepared from a cathode of the lithium secondary battery. A cathode active material mixture is prepared by mixing the cathode powder with a calcium compound. The cathode active material mixture is reduced to form a preliminary precursor mixture. A lithium precursor is recovered from the preliminary precursor mixture. Therefore, a lithium precursor can be obtained with high purity without a complicated leaching process or an additional process, which result from a wet-based acid solution process.
    Type: Application
    Filed: March 3, 2022
    Publication date: May 9, 2024
    Inventors: Young Bin SEO, Ji Yun PARK, Sung Real SON, Sang Ick LEE, Suk Joon HONG, Ji Min KIM
  • Patent number: 11973203
    Abstract: A battery pack is provided including at least one rechargeable secondary battery; a battery frame having a battery accommodation portion configured to accommodate the at least one secondary battery; a packaging member provided in the form of an adhesion sheet having an adhesive surface formed at one surface thereof, the packaging member including a body portion fixedly adhered to an upper portion of the secondary battery accommodated in the battery frame and a fixing portion bent and extended downward from the body portion and having the adhesive surface fixedly adhered to an outer surface of an outermost edge of the battery frame; and an anti-noise member attached to at least one portion of the adhesive surface of the packaging member.
    Type: Grant
    Filed: July 24, 2019
    Date of Patent: April 30, 2024
    Assignee: LG ENERGY SOLUTION, LTD.
    Inventors: Hyuk-Joon Son, Young-Su Son, Young-Kyu Lee, Jae-Young Jang
  • Patent number: 11963358
    Abstract: A semiconductor memory includes metallic lines on a substrate and including an uppermost metallic line, a semiconductor conduction line on the uppermost metallic line, a vertical structure penetrating the semiconductor conduction line and metallic lines, and including a vertical structure that includes an upper channel film, a first lower channel film, and an upper connection channel film connecting the upper channel film and the first lower channel film between a bottom of the semiconductor conduction line and a bottom of the uppermost metallic line, and a first cutting line through the metallic lines and the semiconductor conduction line, and including a first upper cutting line through the semiconductor conduction line, and a first lower cutting line through the plurality of metallic lines, a width of the first upper cutting line being greater than a width of an extension line of a sidewall of the first lower cutting line.
    Type: Grant
    Filed: February 1, 2023
    Date of Patent: April 16, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hyo Joon Ryu, Young Hwan Son, Seo-Goo Kang, Jung Hoon Jun, Kohji Kanamori, Jee Hoon Han
  • Publication number: 20230291091
    Abstract: An antenna substrate according to the embodiment includes a substrate; an antenna pattern layer on the substrate; a first insulating layer including a resin and an inorganic filler on the substrate and the antenna pattern layer; and a second insulating layer including a resin and an inorganic filler on the first insulating layer, and wherein the second insulating layer has a higher dielectric constant and thickness than the first insulating layer.
    Type: Application
    Filed: September 28, 2021
    Publication date: September 14, 2023
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Young Joon SON, Han Phil RHYU, Dong Uk LIM
  • Publication number: 20230209163
    Abstract: A substrate for an image sensor according to an embodiment includes an insulating layer; and a conductive pattern portion disposed on the insulating layer, wherein the insulating layer comprises: a first insulating part; and a second insulating part surrounding the first insulating part and spaced apart from the first insulating part with an open region therebetween, wherein the conductive pattern portion comprises a first lead pattern part disposed on the first insulating part; a second lead pattern part disposed on the second insulating part; and an extension pattern part disposed on the open region of the insulating layer to connect the first lead pattern part with the second lead pattern part and including a bent portion.
    Type: Application
    Filed: February 28, 2023
    Publication date: June 29, 2023
    Inventors: Duck Hoon PARK, Jee Heum PAIK, Young Joon SON
  • Patent number: 11622064
    Abstract: A substrate for an image sensor according to an embodiment includes an insulating layer; and a conductive pattern portion disposed on the insulating layer, wherein the insulating layer comprises: a first insulating part; and a second insulating part surrounding the first insulating part and spaced apart from the first insulating part with an open region therebetween, wherein the conductive pattern portion comprises a first lead pattern part disposed on the first insulating part; a second lead pattern part disposed on the second insulating part; and an extension pattern part disposed on the open region of the insulating layer to connect the first lead pattern part with the second lead pattern part and including a bent portion.
    Type: Grant
    Filed: November 14, 2019
    Date of Patent: April 4, 2023
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Duck Hoon Park, Jee Heum Paik, Young Joon Son
  • Publication number: 20220286591
    Abstract: A sensor driving device and a camera module are provided. According to an aspect of the present invention, the sensor driving device comprises: a first substrate including a first opening; a housing disposed on the first substrate; a support member disposed at the first opening; an image sensor mounted on the support member; a connector electrically connecting the first substrate and the support member and elastically supporting the support member; a base connected to the support member; a first driver disposed in the housing; and a second driver disposed on the base and facing the first driver.
    Type: Application
    Filed: August 21, 2020
    Publication date: September 8, 2022
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Eun Sung SEO, Young Joon SON, Jung Seok OH
  • Publication number: 20220190015
    Abstract: An image sensor substrate according to an embodiment includes: an insulating layer including a first open region; and a first lead pattern part disposed on the insulating layer, wherein the first lead pattern part includes: a first pattern part disposed on the insulating layer; a connection portion extending from the first pattern part; and a second pattern part connected to the first pattern part through the connection portion, wherein the second pattern part and the connection portion are disposed to fly on a region not overlapped with the insulating layer in a vertical direction.
    Type: Application
    Filed: March 3, 2020
    Publication date: June 16, 2022
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Jung Shik BAIK, Eun Sung SEO, Young Joon SON, Jee Heum PAIK, Hae Sik KIM
  • Publication number: 20220102417
    Abstract: An image sensor substrate according to an embodiment includes: an insulating layer; and a conductive pattern part disposed on the insulating layer, wherein the insulating layer includes: a first insulating part: and a second insulating part disposed surrounding a periphery of the first insulating part and spaced apart from the first insulating part with a first open region interposed therebetween, and the conductive pattern part includes: a first conductive pattern part disposed on the first insulating part; a second conductive pattern part disposed on the second insulating part; and an extension pattern part disposed on the first open region and interconnecting the first and second conductive pattern parts, wherein the extension pattern part includes a bent portion disposed on a corner region of the first open region.
    Type: Application
    Filed: February 6, 2020
    Publication date: March 31, 2022
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Duck Hoon PARK, Jee Heum PAIK, Young Joon SON
  • Publication number: 20220014654
    Abstract: A substrate for an image sensor according to an embodiment includes an insulating layer; and a conductive pattern portion disposed on the insulating layer, wherein the insulating layer comprises: a first insulating part; and a second insulating part surrounding the first insulating part and spaced apart from the first insulating part with an open region therebetween, wherein the conductive pattern portion comprises a first lead pattern part disposed on the first insulating part; a second lead pattern part disposed on the second insulating part; and an extension pattern part disposed on the open region of the insulating layer to connect the first lead pattern part with the second lead pattern part and including a bent portion.
    Type: Application
    Filed: November 14, 2019
    Publication date: January 13, 2022
    Inventors: Duck Hoon PARK, Jee Heum PAIK, Young Joon SON
  • Publication number: 20150296624
    Abstract: A printed circuit board for mounting a chip includes: a core layer including a chip mounting cavity; a chip mounted into the chip mounting cavity; a first insulating material layer filled in a space between the chip mounting cavity and the chip; and a second insulating material layer laminated on one surface of the core layer.
    Type: Application
    Filed: May 9, 2013
    Publication date: October 15, 2015
    Inventors: Yun Ho An, Won Suk Jung, Ran Kim, Sung Soo Park, Young Joon Son, Sang Myung Lee, Woo Young Lee, Joon Wook Han
  • Publication number: 20030139296
    Abstract: The present invention relates to an agent for controlling plant diseases containing vitamin B1, or salts or derivatives thereof as an active ingredient, which exhibits excellent disease controlling effects by rapid induction of defense-related genes in plants infected with pathogens.
    Type: Application
    Filed: September 24, 2002
    Publication date: July 24, 2003
    Inventors: Yong-Hwan Lee, Il-Pyung Ahn, Nam-Soo Jwa, Soon-Ok Kim, Chan-Ho Park, Sook-Young Park, Young-Joon Son, Dal-Soo Kim, Sam-Jae Chun, Yeon-Mi Lee, Yun-Kyung Cho, Cheol-Yong Bae
  • Patent number: 5841355
    Abstract: The optimum electrolyte level sensing method and the automatic topping up apparatus for storage wet cell are disclosed. The difference in the conductivities between the distilled water and the electrolyte is utilized. An injection outlet portion (15), an adjust ring (14), and two wires are used to detect the optimum electrolyte level to supply distilled water to storage cells. The feedback control to maintain the constant optimum electrolyte level of storage cells is carried out by a single microprocessor.
    Type: Grant
    Filed: December 19, 1996
    Date of Patent: November 24, 1998
    Assignee: Korea Atomic Energy Research Institute
    Inventors: Sang-Min Bae, Young-Joon Son, Jae-Won Lee
  • Patent number: 5813838
    Abstract: The optimum electrolyte level sensing method and the automatic topping up apparatus for storage wet cell are disclosed. The difference in the conductivities between the distilled water and the electrolyte is utilized. An injection outlet portion(15), an adjust ring(14), and two wires are used to detect the optimum electrolyte level to supply distilled water to storage cells. The feedback control to maintain the constant optimum electrolyte level of storage cells is carried out by a single microprocessor.
    Type: Grant
    Filed: November 2, 1995
    Date of Patent: September 29, 1998
    Assignee: Korea Atomic Energy Research Institute
    Inventors: Sang-Min Bae, Young-Joon Son, Jae-Won Lee