Abstract: An encapsulant composition for an optical device; comprises an ethylene/alpha-olefin copolymer having high volume resistance and light transmittance. An encapsulant film for an optical device using the same is also provided.

Abstract: An apparatus and method for cutting a LCD panel is provided. The apparatus comprises a first scribing unit for forming first scribing lines and second scribing lines for dividing LCD panels on a substrate having a plurality of LCD panels. The apparatus also has a first flipping unit for flipping the substrate, a first breaking unit having a breaking bar for striking the flipped substrate along the first scribing lines to form a crack on the substrate, and a plurality of breaking rollers for pressing the flipped substrate along the second scribing lines to form a crack on the substrate. A breaking process of an LCD panel may be performed without rotating the substrate by using the breaking bar and the breaking rollers. Also, the breaking process may be performed without damaging image display regions of LCD panels where different sized LCD panels are on the substrate.

Abstract: A semiconductor package and a method of producing the same has a substrate. A first semiconductor chip is coupled to a surface of the substrate. The first semiconductor chip has a first and second surfaces which are substantially flat in nature. An adhesive layer is coupled to the second surface of the first semiconductor chip. A second semiconductor chip having first and second surfaces which are substantially flat in nature is further provided. An insulator is coupled to the first surface of the second semiconductor chip for preventing shorting of wirebonds. The second semiconductor chip is coupled to the adhesive layer by the insulator coupled to the first surface thereof.

Abstract: A semiconductor package and a method of producing the same has a substrate. A first semiconductor chip is coupled to a surface of the substrate. The first semiconductor chip has a first and second surfaces which are substantially flat in nature. An adhesive layer is coupled to the second surface of the first semiconductor chip. A second semiconductor chip having first and second surfaces which are substantially flat in nature is further provided. An insulator is coupled to the first surface of the second semiconductor chip for preventing shorting of wirebonds. The second semiconductor chip is coupled to the adhesive layer by the insulator coupled to the first surface thereof.

Abstract: A semiconductor package and a method of producing the same has a substrate. A first semiconductor chip is coupled to a surface of the substrate. The first semiconductor chip has a first and second surfaces which are substantially flat in nature. An adhesive layer is coupled to the second surface of the first semiconductor chip. A second semiconductor chip having first and second surfaces which are substantially flat in nature is further provided. An insulator is coupled to the first surface of the second semiconductor chip for preventing shorting of wirebonds. The second semiconductor chip is coupled to the adhesive layer by the insulator coupled to the first surface thereof.

Abstract: A transmitter and a transmitting method of a wireless communication system are provided. The transmitter transmits RF signals using an outphasing scheme of converting one analog IF NC-EMS into two analog C-EMSs. In the transmitter, a baseband processor generates a baseband digital modulated I-signal and a baseband digital modulated Q-signal. A signal converter converts the baseband digital modulated I-signal and the baseband digital modulated Q-signal into a baseband analog modulated I-signal and a baseband analog modulated Q-signal. An IF processor up-converts the baseband analog modulated I-signal and the baseband analog modulated Q-signal to generate one analog IF NC-EMS. A signal component separator separates the analog IF NC-EMS into a first analog IF C-EMS and a second analog IF C-EMS. An RF processor up-converts the first analog IF C-EMS and the second analog IF C-EMS to generate a first analog RF C-EMS and a second analog RF C-EMS.

Abstract: A transmitter and a transmitting method of a wireless communication system are provided. The transmitter transmits RF signals using an outphasing scheme of converting one analog IF NC-EMS into two analog C-EMSs. In the transmitter, a baseband processor generates a baseband digital modulated I-signal and a baseband digital modulated Q-signal. An IF processor up-converts the baseband digital modulated I-signal and the baseband digital modulated Q-signal to generate one digital IF NC-EMS. A signal component separator separates the digital IF NC-EMS into a first digital IF C-EMS and a second digital IF C-EMS. An RF processor up-converts the first digital IF C-EMS and the second digital IF C-EMS to generate a first analog RF C-EMS and a second analog RF C-EMS. A power amplifier amplifies powers of the first and second analog RF C-EMSs. An RF combiner combines the first and second analog RF C-EMSs having the amplified powers to generate one combined analog RF C-EMS.

Abstract: A digital intermediate frequency transmitter for a wireless communication is disclosed. In accordance with the present invention, an improvement of a modulation quality such as an EVM, a linearity and a power consumption is possible, and a main characteristic of a wireless communication transmitter may be embodied at a low cost through an integration such that a high frequency 90° phase shifter, a voltage controlled oscillator having a 2× frequency or higher and a high frequency I/Q local oscillated signals are not required and a side-band signal may be effectively removed.

Abstract: The present invention relates to an I/Q modulator using a current-mixing method used for a direct conversion wireless communication transmitter. In accordance with the present invention, an EVM of a wireless communication system, a linearity and a power consumption are improved by converting a D/A converted signal to a current level and then performing a frequency modulation.

Abstract: A semiconductor package and a method of producing the same has a substrate. A first semiconductor chip is coupled to a surface of the substrate. The first semiconductor chip has a first and second surfaces which are substantially flat in nature. An adhesive layer is coupled to the second surface of the first semiconductor chip. A second semiconductor chip having first and second surfaces which are substantially flat in nature is further provided. An insulator is coupled to the first surface of the second semiconductor chip for preventing shorting of wirebonds. The second semiconductor chip is coupled to the adhesive layer by the insulator coupled to the first surface thereof.

Abstract: A transmitter and a transmitting method of a wireless communication system are provided. The transmitter transmits RF signals using an outphasing scheme of converting one analog IF NC-EMS into two analog C-EMSs. In the transmitter, a baseband processor generates a baseband digital modulated I-signal and a baseband digital modulated Q-signal. An IF processor up-converts the baseband digital modulated I-signal and the baseband digital modulated Q-signal to generate one digital IF NC-EMS. A signal component separator separates the digital IF NC-EMS into a first digital IF C-EMS and a second digital IF C-EMS. An RF processor up-converts the first digital IF C-EMS and the second digital IF C-EMS to generate a first analog RF C-EMS and a second analog RF C-EMS. A power amplifier amplifies powers of the first and second analog RF C-EMSs. An RF combiner combines the first and second analog RF C-EMSs having the amplified powers to generate one combined analog RF C-EMS.

Abstract: A transmitter and a transmitting method of a wireless communication system are provided. The transmitter transmits RF signals using an outphasing scheme of converting one analog IF NC-EMS into two analog C-EMSs. In the transmitter, a baseband processor generates a baseband digital modulated I-signal and a baseband digital modulated Q-signal. A signal converter converts the baseband digital modulated I-signal and the baseband digital modulated Q-signal into a baseband analog modulated I-signal and a baseband analog modulated Q-signal. An IF processor up-converts the baseband analog modulated I-signal and the baseband analog modulated Q-signal to generate one analog IF NC-EMS. A signal component separator separates the analog IF NC-EMS into a first analog IF C-EMS and a second analog IF C-EMS. An RF processor up-converts the first analog IF C-EMS and the second analog IF C-EMS to generate a first analog RF C-EMS and a second analog RF C-EMS.

Abstract: Disclosed is a stacking structure of semiconductor chips and semiconductor package using it, capable of achieving an electric insulation even if a conductive wire makes contact with a lower surface of an upper semiconductor chip, while reducing a total thickness thereof and preventing damage.

Abstract: A digital intermediate frequency transmitter for a wireless communication is disclosed. In accordance with the present invention, an improvement of a modulation quality such as an EVM, a linearity and a power consumption is possible, and a main characteristic of a wireless communication transmitter may be embodied at a low cost through an integration such that a high frequency 90° phase shifter, a voltage controlled oscillator having a 2× frequency or higher and a high frequency I/Q local oscillated signals are not required and a side-band signal may be effectively removed.

Abstract: Disclosed herein is a multi-band ZigBee transceiver for supporting IEEE 802.15.4 wireless communications. In the multi-band ZigBee transceiver, a Multi-Mode Modem (MMM) selects any one of a European version standard using 860 MHz band, a US version standard using 920 MHz band, and a worldwide version standard using 2.4 GHz ISM band among IEEE 802.15.4 standards. A frequency synthesizing unit variably adjusts a carrier frequency according to the transmission standard. A transmission unit receives a digital modulated signal, low-pass-filters the digital modulated signal with a bandwidth thereof being variably adjusted, and up-converts the filtered digital modulated signal into an RF modulated signal corresponding to the selected transmission channel.

Abstract: The present invention relates to an I/Q modulator using a current-mixing method used for a direct conversion wireless communication transmitter. In accordance with the present invention, an EVM of a wireless communication system, a linearity and a power consumption are improved by converting a D/A converted signal to a current level and then performing a frequency modulation.

Abstract: An apparatus and method for cutting a LCD panel is provided. The apparatus comprises a first scribing unit for forming first scribing lines and second scribing lines for dividing LCD panels on a substrate having a plurality of LCD panels. The apparatus also has a first flipping unit for flipping the substrate, a first breaking unit having a breaking bar for striking the flipped substrate along the first scribing lines to form a crack on the substrate, and a plurality of breaking rollers for pressing the flipped substrate along the second scribing lines to form a crack on the substrate. A breaking process of an LCD panel may be performed without rotating the substrate by using the breaking bar and the breaking rollers. Also, the breaking process may be performed without damaging image display regions of LCD panels where different sized LCD panels are on the substrate.

Abstract: A wire bonding method for electrically interconnecting stacked semiconductor chips is disclosed. A substrate (e.g., printed circuit board or metal leadframe) is provided. Metal circuit patterns are provided outside of a chip mounting region of the substrate, and metal transfer patterns are provided proximate to the chip mounting region. Stacked semiconductor are disposed in the chip mounting region. Conductive wires are bonded between respective pads of one stacked chip and respective transfer patterns, and other conductive wires are bonded between respective pads of the other stacked chip and the same respective transfer patterns, thereby electrically connecting respective pads of the two chips through a pair of bond wires and an intermediate transfer pattern. The transfer patterns are separate from circuit patterns of the substrate. At least one of the first and second chips is electrically connected to some of the circuit patterns for external connection.

Abstract: A semiconductor package including plural semiconductor chips, and a wire bonding step for electrically interconnecting the semiconductor chips, are disclosed. In an exemplary method, a substrate is provided. Conductive circuit patterns are provided outside of a chip mounting region of the substrate, and conductive transfer patterns are provided proximate to the chip mounting region. Chips are placed in the chip mounting region. Conductive wires are bonded between input/output pads of a first chip and respective transfer patterns, and other conductive wires are bonded between input/output pads of a second chip and the same transfer patterns, thereby electrically connecting respective input/output pads of the two chips through a pair of bond wires and an intermediate transfer pattern.

Abstract: A wire bonding method for electrically interconnecting stacked semiconductor chips is disclosed. A substrate (e.g., printed circuit board or metal leadframe) is provided. Metal circuit patterns are provided outside of a chip mounting region of the substrate, and metal transfer patterns are provided proximate to the chip mounting region. Stacked semiconductor are disposed in the chip mounting region. Conductive wires are bonded between respective pads of one stacked chip and respective transfer patterns, and other conductive wires are bonded between respective pads of the other stacked chip and the same respective transfer patterns, thereby electrically connecting respective pads of the two chips through a pair of bond wires and an intermediate transfer pattern. The transfer patterns are separate from circuit patterns of the substrate. At least one of the first and second chips is electrically connected to some of the circuit patterns for external connection.