Abstract: A package substrate and a method for manufacturing the same are disclosed. The method for manufacturing a package substrate in accordance with an aspect of the present invention includes: forming a first open hole corresponding to a shape of a bonding pad in a first photo resist; laminating a second photo resist on the first photo resist and forming a second open hole corresponding to shapes of a soldering pad, a circuit pattern layer and the bonding pad in the second photo resist; and forming a pattern plating layer up to a predetermined height in the first open hole and the second open hole.

Abstract: A method for deciding a position of a terminal connecting a Bluetooth system inside a vehicle includes measuring, by each of a plurality of Bluetooth antennas equipped inside the vehicle, a strength of received power of the terminal. A distance of the terminal is determined from each of the plurality of Bluetooth antennas based on the measured strength of received power. The position of the terminal equipped inside the vehicle is determined based on the distance.

Abstract: Disclosed herein are a coreless board for a semiconductor package and a method of manufacturing the same. The coreless board for the semiconductor package includes: a support; a build-up layer formed on the support; an external connection terminal formed on the build-up layer; and a solder resist layer formed on the build-up layer so as to expose the external connection terminal.

Abstract: Disclosed herein are a printed circuit board and a manufacturing method thereof capable of improving poor inter-layer conduction by increasing inter-layer insulating property and rigidity. The manufacturing method of a printed circuit board includes: laminating a copper foil layer on upper and lower surfaces of an insulating layer; coating an insulating material on a surface of the copper foil layer; forming a circuit layer by etching the copper foil layer; laminating an insulator on the copper foil layer so as to enclose the insulating material and the circuit layer; forming a via in the insulator so as to be communicated with the circuit layer; and forming a circuit pattern on the insulator.

Abstract: There is provided a capacitor sensor capable of controlling sensitivity, wherein the capacitor sensor measures the magnitude and direction of a shear force applied to the sensor, as well as the magnitude of a normal force applied on the surface of the sensor, and consists of a single cell including a pattern electrode capable of varying its shape to control the sensitivity of the sensor.

Abstract: Disclosed herein are a method for surface-treating a printed circuit board and a printed circuit board including a surface treatment layer. The method includes: plasma-treating a surface of a printed circuit board; treating the plasma-treated substrate with an organic solderability preserve; performing heat treatment on the substrate treated with the organic solderability preserve; printing a solder paste on the substrate subjected to the heat treatment; reflowing the solder paste printed substrate to fix the solder paste; and deflux washing the resulting substrate. According to the present invention, the discoloration problem due to oxidation of copper can be solved by performing heat treatment under predetermined conditions after treatment with an organic solderability preserve. Therefore, the present invention can meet various multi-reflow processes, as compared with products of the related art.

Abstract: Disclosed herein are an apparatus for removing particles from a printed circuit board and a method for removing particles from a printed circuit board. The apparatus includes: a vibration generating unit vibrating a printed circuit board; a vacuum sucking unit formed over the printed circuit board and removing the particles from the printed circuit board; and a controlling unit controlling the vibration generating unit and the vacuum sucking unit.

Abstract: Provided are a polymer and a polymer actuator including the polymer. The polymer is cross-linked by a cross-linking agent. When the polymer is used in the polymer actuator, the polymer actuator shows a high strain and may be stably operated at high temperatures.

Abstract: Provided is a biodegradable thermoplastic resin composition including a cellulose derivative and surface-treated natural fiber. More particularly, in preparation of the biodegradable thermoplastic resin composition including the cellulose derivative and the natural fiber, a surface of the natural fiber is treated with alkali and/or sized, thereby increasing a density of the natural fiber, and an interfacial adhesion between the cellulose derivative and the natural fiber to improve a mechanical strength of the biodegradable thermoplastic resin composition. Furthermore, as the cheap natural fiber is used as a reinforcer, the production cost can be reduced.

Abstract: A method of forming a biosensor electrode for HER2 detection is provided. The method includes providing a metal electrode, forming a metal electrode/3-mercaptopropionic acid (MPA) by depositing MPA on the metal electrode, forming a metal electrode/MPA/n-hydroxy-succinimide (NHS) by ester-bonding between NHS and the MPA on the metal electrode/MPA, and forming a metal electrode/MPA/aptamer by amide-bonding between an HER2 specific aptamer having an amino terminus and the MPA of the metal electrode/MPA/NHS.

Abstract: Provided are a polymer and a polymer actuator including the polymer. The polymer is cross-linked by a cross-linking agent. When the polymer is used in the polymer actuator, the polymer actuator shows a high strain and may be stably operated at high temperatures.

Abstract: A method of forming a biosensor electrode for lipopolysaccharide (LPS) detection includes providing a metal electrode, forming a metal electrode/3-mercaptopropionic acid (MPA) by depositing MPA on the metal electrode, forming a metal electrode/MPA/n-hydroxy-succinimide (NHS) by ester-bonding NHS and the MPA on the metal electrode/MPA, forming a metal electrode/MPA/nitrilotriacetic acid (NTA) by amide-bonding NTA-C4—NH2 and the MPA of the metal electrode/MPA/NHS, and forming a metal electrode/MPA/NTA/Cu by coordinate-bonding Cu2+ and the NTA of the metal electrode/MPA/NTA.

Abstract: Disclosed herein is a pure tone test apparatus including: a stage including a support supporting a pure tone test target; a support plate mounted on one side of the stage and having a guide mounted on a front surface thereof; an acoustic detection unit movably mounted on the guide and being engaged with the support to detect noise generated from the target; a control unit connected with the guide, the acoustic detection unit, and the support to control a pure tone test; and a display unit displaying a pure tone test result detected by the control of the control unit.

Abstract: A solid electrolyte polymer including a cross-linked polyvinylidene fluoride (PVDF)-based polymer, and a polymer actuator including the cross-linked PVDF-based polymer and an electrolytic material.

Abstract: Provided is a method of forming a uniform graphene layer on a substrate (metal- or conductive-polymer-coated, ITO) by doping expanded graphite using various kinds of dopants (Lewis acid) to grant a positive charge thereto, dispersing the doped expanded graphite in an organic solvent using ultrasonic waves to obtain a solution in which the graphene is dispersed in the organic solvent, and electrically applying a negative voltage to the solution.

Abstract: There is provided a capacitor sensor capable of controlling sensitivity, wherein the capacitor sensor measures the magnitude and direction of a shear force applied to the sensor, as well as the magnitude of a normal force applied on the surface of the sensor, and consists of a single cell including a pattern electrode capable of varying its shape to control the sensitivity of the sensor.

Abstract: Disclosed herein are a method for surface-treating a printed circuit board and a printed circuit board including a surface treatment layer. The method includes: plasma-treating a surface of a printed circuit board; treating the plasma-treated substrate with an organic solderability preserve; performing heat treatment on the substrate treated with the organic solderability preserve; printing a solder paste on the substrate subjected to the heat treatment; reflowing the solder paste printed substrate to fix the solder paste; and deflux washing the resulting substrate. According to the present invention, the discoloration problem due to oxidation of copper can be solved by performing heat treatment under predetermined conditions after treatment with an organic solderability preserve. Therefore, the present invention can meet various multi-reflow processes, as compared with products of the related art.

Abstract: Disclosed herein is a method for manufacturing a printed circuit board, the method including: preparing a base substrate having a connection pad; forming a surface treatment layer on the connection pad; refrigeration-treating the base substrate having the connection pad on which the surface treatment layer is formed; and printing a solder paste on the connection pad of the refrigeration-treated base substrate.

Abstract: A composite electrode and a method for manufacturing the same are disclosed. By using a composite electrode that includes a porous support made of ceramic or metal and a conductive polymer or a metal oxide formed on a surface of the porous support, a capacitor or secondary cell that provides increased charge/discharge capacity and increased energy/output density, as well as high-temperature stability and high reliability, can be manufactured.

Abstract: A supercapacitor and a manufacturing method thereof are disclosed. With manufacturing method of Supercapacitor including: arranging a plurality of filters to be spaced at a designated interval apart, forming a first plating layer connecting one end of the filter, forming a second plating layer lengthened along the filter from the first plating layer, polymerizing to form a conductive polymer layer between the second plating layer, and removing the filter, capacitance (C), power (kw) and energy (E) can be increased as the space for absorbing electrons is widened, by making the surface area of an electrode wider than the a general film.