Abstract: A structure for isolating thermal interface material includes an isolating element and a heat dissipating element. The isolating element is hollow to encompass a heat generating element. With compression of the heat dissipating element on the heat generating element, thermal interface material between them is limited to flow within the closed room between the isolation element and heat generating element. The heat dissipating element further has a bump exactly contacting the heat generating element and a little smaller than the hollow portion of the isolating element. Therefore, the thermal interface material would not overflow while changing from solid phase to a gel or a liquid phase caused by raising temperature of the heat generating element, and the contamination or short circuits can be prevented.

Abstract: A cool air-supplying device for a computer system. The computer system includes a computer apparatus and the computer apparatus includes a housing. The cool air-supplying device includes a casing connected to the housing of the computer system. The casing has an intake vent for receiving air and an outlet vent for outputting air. The cool air-supplying device further includes a thermoelectric cooler for cooling refrigerantwithin a heat pipe, the heat pipe installed inside the casing for transferring refrigerant cooled by the thermoelectric cooler to the outlet vent. A first fan installed at one end of the heat pipe transfers air cooled by the heat pipe to the housing of the computer system via the outlet vent.

Abstract: A cool air-supplying device for a computer system. The computer system includes a computer apparatus and the computer apparatus includes a housing. The cool air-supplying device includes a casing connected to the housing of the computer system. The casing has an intake vent for receiving air and an outlet vent for outputting air. The cool air-supplying device further includes a thermoelectric cooler for cooling refrigerantwithin a heat pipe, the heat pipe installed inside the casing for transferring refrigerant cooled by the thermoelectric cooler to the outlet vent. A first fan installed at one end of the heat pipe transfers air cooled by the heat pipe to the housing of the computer system via the outlet vent.

Abstract: The present invention provides a heat dissipation apparatus for a notebook computer with a low flow resistance design. The notebook computer has a CPU, a heat dissipation apparatus, an air inlet, and an air outlet. The heat dissipation apparatus includes a heat sink, at least a fan, a conduction block, and a heat pipe. The heat sink is used to transmit heat. The conduction block is closely contacted to an upper surface of the CPU in the notebook computer for absorbing the heat from CPU. The heat pipe is connected to the conduction block and the heat sink. The heat pipe is configured for transmitting heat in the conduction block to the heat sink. Then, the heat transferred to the heat sink is carried away by air flow generated by the fan. In the invention, the air flow directions passing through the air inlet and the air outlet are parallel to each other. The air flow resistance is substantially reduced to accelerate the heat dissipation.

Abstract: The present invention provides a heat dissipation apparatus for a notebook computer with a low flow resistance design. The notebook computer has a CPU, a heat dissipation apparatus, an air inlet, and an air outlet. The heat dissipation apparatus includes a heat sink, at least a fan, a conduction block, and a heat pipe. The heat sink is used to transmit heat. The conduction block is closely contacted to an upper surface of the CPU in the notebook computer for absorbing the heat from CPU. The heat pipe is connected to the conduction block and the heat sink. The heat pipe is configured for transmitting heat in the conduction block to the heat sink. Then, the heat transferred to the heat sink is carried away by air flow generated by the fan. In the invention, the air flow directions passing through the air inlet and the air outlet are parallel to each other. The air flow resistance is substantially reduced to accelerate the heat dissipation.