Patents by Inventor Young-Kyun Sun
Young-Kyun Sun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7481351Abstract: A controller may receive a wire disconnection signal from a wire bonding monitoring system and operate a wire clamp to clamp a disconnected wire. A series of operations, which may include a wire drawing operation, a wire tail forming operation and a ball forming operation, may be automatically performed. A sensor may measure the length of the wire drawn through the capillary and the location of a ball that may be formed at a wire tail. An auxiliary clamp may be installed between the wire clamp and the capillary for drawing the wire using sensor information.Type: GrantFiled: August 30, 2004Date of Patent: January 27, 2009Assignee: Samsung Electronics Co., Ltd.Inventors: Tae-Hyun Kim, Youn-Sung Ko, Young-Kyun Sun, Dae-Soo Kim, Kook-Jin Oh, Sang-Woo Lee, Dong-Bin Kim
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Publication number: 20070170569Abstract: Provided are in-line semiconductor chip packaging apparatuses that include a buffer assembly in which a reversing unit rotates a lead frame 180° between die attaching and/or wire bonding operations and methods of manufacturing an integrated circuit chip package using such an in-line integrated circuit chip packaging apparatus. Between packaging process operations, the lead frame, which includes first and second surfaces may be rotated, thereby reversing the orientation of the first and second surfaces. The apparatuses will include one or more processing units for attaching semiconductor chips to the leadframe, or a previously mounted semiconductor chip, or for forming wire bonds between the attached semiconductor chip(s) and the corresponding lead fingers of the lead frame, attached to and/or separated by an in-line buffer assembly that includes a reversing unit.Type: ApplicationFiled: March 30, 2007Publication date: July 26, 2007Inventors: Tae-Hyun Kim, Young-Kyun Sun, Hyun-Ho Kim, Jung-Hwan Woo
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Patent number: 7215008Abstract: Provided are in-line semiconductor chip packaging apparatuses that include a buffer assembly in which a reversing unit rotates a lead frame 180° between die attaching and/or wire bonding operations and methods of manufacturing an integrated circuit chip package using such an in-line integrated circuit chip packaging apparatus. Between packaging process operations, the lead frame, which includes first and second surfaces may be rotated, thereby reversing the orientation of the first and second surfaces. The apparatuses will include one or more processing units for attaching semiconductor chips to the leadframe, or a previously mounted semiconductor chip, or for forming wire bonds between the attached semiconductor chip(s) and the corresponding lead fingers of the lead frame, attached to and/or separated by an in-line buffer assembly that includes a reversing unit.Type: GrantFiled: June 24, 2004Date of Patent: May 8, 2007Assignee: Samsung Electronics Co., Ltd.Inventors: Tae-Hyun Kim, Young-Kyun Sun, Hyun-Ho Kim, Jung-Hwan Woo
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Patent number: 7074646Abstract: An in-line die attaching and curing apparatus for a multi-chip package (MCP) comprises at least one die attaching apparatus and at least one snap-cure apparatus. In one embodiment, the die attaching apparatus comprises a loader, an index rail, a transfer gripper, a wafer loader, a chip alignment table, an adhesive applying device and an apparatus for placing a device on a chip mounting area. The die attaching apparatus further comprises a UV radiation device and a vision camera. The adhesive curing apparatus comprises a frame providing unit being provided with the chip mounting frame from the index rail, a plurality of heating zones, each having a heating means, the heating means operable to raise and/or lower the temperature condition of the heating zones, a frame discharging unit discharging the chip mounting frame, and frame transfer means transferring the chip mounting frame from the frame providing unit to the frame discharging unit through the heating zones.Type: GrantFiled: December 22, 2004Date of Patent: July 11, 2006Assignee: Samsung Electronics Co., Ltd.Inventors: Hyun-Ho Kim, Young-Kyun Sun, Kyoung-Bok Cho, Sung-Bok Hong
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Publication number: 20050133563Abstract: A controller may receive a wire disconnection signal from a wire bonding monitoring system and operate a wire clamp to clamp a disconnected wire. A series of operations, which may include a wire drawing operation, a wire tail forming operation and a ball forming operation, may be automatically performed. A sensor may measure the length of the wire drawn through the capillary and the location of a ball that may be formed at a wire tail. An auxiliary clamp may be installed between the wire clamp and the capillary for drawing the wire using sensor information.Type: ApplicationFiled: August 30, 2004Publication date: June 23, 2005Inventors: Tae-Hyun Kim, Youn-Sung Ko, Young-Kyun Sun, Dae-Soo Kim, Kook-Jin Oh, Sang-Woo Lee, Dong-Bin Kim
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Publication number: 20050106778Abstract: An in-line die attaching and curing apparatus for a multi-chip package (MCP) comprises at least one die attaching apparatus and at least one snap-cure apparatus. In one embodiment, the die attaching apparatus comprises a loader, an index rail, a transfer gripper, a wafer loader, a chip alignment table, an adhesive applying device and an apparatus for placing a device on a chip mounting area. The die attaching apparatus further comprises a UV radiation device and a vision camera. The adhesive curing apparatus comprises a frame providing unit being provided with the chip mounting frame from the index rail, a plurality of heating zones, each having a heating means, the heating means operable to raise and/or lower the temperature condition of the heating zones, a frame discharging unit discharging the chip mounting frame, and frame transfer means transferring the chip mounting frame from the frame providing unit to the frame discharging unit through the heating zones.Type: ApplicationFiled: December 22, 2004Publication date: May 19, 2005Applicant: Samsung Electronics Co., Ltd.Inventors: Hyun-Ho Kim, Young-Kyun Sun, Kyoung-Bok Cho, Sung-Bok Hong
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Patent number: 6863109Abstract: An in-line die attaching and curing apparatus for a multi-chip package (MCP) comprises at least one die attaching apparatus and at least one snap-cure apparatus. In one embodiment, the die attaching apparatus comprises a loader, an index rail, a transfer gripper, a wafer loader, a chip alignment table, an adhesive applying device and an apparatus for placing a device on a chip mounting area. The die attaching apparatus further comprises a UV radiation device and a vision camera. The adhesive curing apparatus comprises a frame providing unit being provided with the chip mounting frame from the index rail, a plurality of heating zones, each having a heating means, the heating means operable to raise and/or lower the temperature condition of the heating zones, a frame discharging unit discharging the chip mounting frame, and frame transfer means transferring the chip mounting frame from the frame providing unit to the frame discharging unit through the heating zones.Type: GrantFiled: July 15, 2003Date of Patent: March 8, 2005Assignee: Samsung Electronics Co., Ltd.Inventors: Hyun-Ho Kim, Young-Kyun Sun, Kyoung-Bok Cho, Sung-Bok Hong
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Publication number: 20050012498Abstract: A semiconductor device test apparatus includes a main body and a stacker for stacking devices before and after a test. The stacker includes at least one user tray feeder predesignated with a function for stacking un-tested devices and at least one user tray sender predesignated with a function for stacking tested devices, the user tray functions being interchangeable during stacker operation.Type: ApplicationFiled: March 3, 2004Publication date: January 20, 2005Inventors: Soo-Chan Lee, Young-Kyun Sun, Hyun-Ho Kim, Byeong-Chun Lee, Jun-Ho Lee, Jong-Cheol Lee, Je-Hyoung Ryu, Tae-Gyu Kim, Soon-Kyu Yim
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Publication number: 20050006743Abstract: Provided are in-line semiconductor chip packaging apparatuses that include a buffer assembly in which a reversing unit rotates a lead frame 180° between die attaching and/or wire bonding operations and methods of manufacturing an integrated circuit chip package using such an in-line integrated circuit chip packaging apparatus. Between packaging process operations, the lead frame, which includes first and second surfaces may be rotated, thereby reversing the orientation of the first and second surfaces. The apparatuses will include one or more processing units for attaching semiconductor chips to the leadframe, or a previously mounted semiconductor chip, or for forming wire bonds between the attached semiconductor chip(s) and the corresponding lead fingers of the lead frame, attached to and/or separated by an in-line buffer assembly that includes a reversing unit.Type: ApplicationFiled: June 24, 2004Publication date: January 13, 2005Inventors: Tae-Hyun Kim, Young-Kyun Sun, Hyun-Ho Kim, Jung-Hwan Woo
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Publication number: 20040260423Abstract: The arrangement and method determine if an article requested in a retrieval request is destined for storage and retrieve the article prior to storage when it is determined that the article requested in a retrieval request is destined for storage.Type: ApplicationFiled: February 3, 2004Publication date: December 23, 2004Inventors: Sung-Yeol Lee, Young-Kyun Sun, Sang-Hoon Lee, No-Shin Park, Jae-Nam Lee
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Publication number: 20040108582Abstract: An in-line die attaching and curing apparatus for a multi-chip package (MCP) comprises at least one die attaching apparatus and at least one snap-cure apparatus. In one embodiment, the die attaching apparatus comprises a loader, an index rail, a transfer gripper, a wafer loader, a chip alignment table, an adhesive applying device and an apparatus for placing a device on a chip mounting area. The die attaching apparatus further comprises a UV radiation device and a vision camera. The adhesive curing apparatus comprises a frame providing unit being provided with the chip mounting frame from the index rail, a plurality of heating zones, each having a heating means, the heating means operable to raise and/or lower the temperature condition of the heating zones, a frame discharging unit discharging the chip mounting frame, and frame transfer means transferring the chip mounting frame from the frame providing unit to the frame discharging unit through the heating zones.Type: ApplicationFiled: July 15, 2003Publication date: June 10, 2004Applicant: Samsung Electronics Co., Ltd.Inventors: Hyun-Ho Kim, Young-Kyun Sun, Kyoung-Bok Cho, Sung-Bok Hong