Abstract: A power electronic capacitor module for vehicle that may reduce the number of solderings by inserting and thereby mounting a capacitor between a single pair of bus bars and thereby may simplify an assembly process. The power electronic capacitor module for vehicle may include a single pair of bus bars disposed to be separate from each other and each having an external electrode support member; an insulating support frame formed to expose the external electrode support member and wrap around a single pair of bus bars and thereby support the bus bars; and a capacitor element having a single pair of external electrodes and inserted between a single pair of bus bars to thereby be supported by the bus bars or the external electrode support members and electrically connect the external electrodes to the external electrode support members.

Abstract: Provided is a package type multilayer thin film capacitor for a high capacitance, including: a capacitance block 110; a pair of clamp members 120 and 130 being installed on one side and another side of the capacitance block 110, respectively; a pair of lead members 140 and 150 being installed on the clam members 120 and 130, respectively; and a molding member 160 filling in the capacitance block 110 to partially expose each of the pair of lead members 140 and 150. The capacitance block may be configured by adhering at least two of a ceramic sintered member 111, a metal capacitance member 112, and a thin film capacitance member 113 using an insulating adhesive member and thereby disposing the at least two members in a multilayered form. Accordingly, capacitance may increase and mechanical strength may be enhanced.

Abstract: Provided is a package type multi-layer thin film capacitor for large capacitance, including: a ceramic sintered body formed with slots on one side and another side thereof, respectively; a plurality of first internal electrode layers formed within the ceramic sintered body; a plurality of second internal electrode layers formed within the ceramic sintered body to be positioned between the plurality of first internal electrode layers; a pair of first main connection electrode members inserted into the slots to be connected to the first internal electrode layers or the second internal electrode layers, respectively; a pair of first main lead members inserted into the slots and to be connected to the first main connection electrode members, respectively; and a sealing member sealing the ceramic sintered body to partially expose each of the pair of first main lead members.

Abstract: A direct current (DC) link capacitor module includes a printed circuit board (PCB) formed by sequentially disposing a first electrode substrate, an insulation substrate, a second electrode substrate, a third electrode substrate; a plurality of DC link capacitors connected in parallel to each of the first electrode substrate and the second electrode substrate; a plurality of first Y-capacitors connected in series to each of the first electrode substrate and the third electrode substrate, and connected in parallel to the DC link capacitors; and a plurality of second Y-capacitors connected in series to each of the first electrode substrate and the third electrode substrate, and connected in parallel to the first Y-capacitors, thereby achieving a miniaturization and facilitating a fabrication by connecting the plurality of DC link capacitors using the PCB.

Abstract: Provided is a package type multilayer thin film capacitor for a high capacitance, including: a capacitance block 110; a pair of clamp members 120 and 130 being installed on one side and another side of the capacitance block 110, respectively; a pair of lead members 140 and 150 being installed on the clam members 120 and 130, respectively; and a molding member 160 filling in the capacitance block 110 to partially expose each of the pair of lead members 140 and 150. The capacitance block may be configured by adhering at least two of a ceramic sintered member 111, a metal capacitance member 112, and a thin film capacitance member 113 using an insulating adhesive member and thereby disposing the at least two members in a multilayered form. Accordingly, capacitance may increase and mechanical strength may be enhanced.

Abstract: Provided is a package type multi-layer thin film capacitor for large capacitance, including: a ceramic sintered body formed with slots on one side and another side thereof, respectively; a plurality of first internal electrode layers formed within the ceramic sintered body; a plurality of second internal electrode layers formed within the ceramic sintered body to be positioned between the plurality of first internal electrode layers; a pair of first main connection electrode members inserted into the slots to be connected to the first internal electrode layers or the second internal electrode layers, respectively; a pair of first main lead members inserted into the slots and to be connected to the first main connection electrode members, respectively; and a sealing member sealing the ceramic sintered body to partially expose each of the pair of first main lead members.