Patents by Inventor Young Mok Doo
Young Mok Doo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230318480Abstract: Disclosed embodiments include alignment apparatuses for circuit boards, inverter assemblies, and methods for fabricating an assembly with a circuit board placed on an alignment apparatus. An illustrative apparatus includes an electrically insulative substrate having a first substantially planar surface and a second substantially planar surface forming an opposing side of the first substantially planar surface. The second substantially planar surface defines therein self-aligning features that are configured to align at least one power module pin with the electrically insulative substrate. The first substantially planar surface has at least one alignment feature configured to align a printed circuit board with the electrically insulative substrate. The apparatus also includes a routing feature coupled to the electrically insulative substrate. The routing feature is configured to route at least one low voltage conductor.Type: ApplicationFiled: June 7, 2023Publication date: October 5, 2023Inventors: Young Mok Doo, Juan Lopez, Shawn Merritt
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Patent number: 11705825Abstract: Disclosed embodiments include alignment apparatuses for circuit boards, inverter assemblies, and methods for fabricating an assembly with a circuit board placed on an alignment apparatus. An illustrative apparatus includes an electrically insulative substrate having a first substantially planar surface and a second substantially planar surface forming an opposing side of the first substantially planar surface. The second substantially planar surface defines therein self-aligning features that are configured to align at least one power module pin with the electrically insulative substrate. The first substantially planar surface has at least one alignment feature configured to align a printed circuit board with the electrically insulative substrate. The apparatus also includes a routing feature coupled to the electrically insulative substrate. The routing feature is configured to route at least one low voltage conductor.Type: GrantFiled: July 31, 2020Date of Patent: July 18, 2023Assignee: Rivian IP Holdings, LLCInventors: Young Mok Doo, Juan Lopez, Shawn Merritt
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Publication number: 20220038021Abstract: Disclosed embodiments include alignment apparatuses for circuit boards, inverter assemblies, and methods for fabricating an assembly with a circuit board placed on an alignment apparatus. An illustrative apparatus includes an electrically insulative substrate having a first substantially planar surface and a second substantially planar surface forming an opposing side of the first substantially planar surface. The second substantially planar surface defines therein self-aligning features that are configured to align at least one power module pin with the electrically insulative substrate. The first substantially planar surface has at least one alignment feature configured to align a printed circuit board with the electrically insulative substrate. The apparatus also includes a routing feature coupled to the electrically insulative substrate. The routing feature is configured to route at least one low voltage conductor.Type: ApplicationFiled: July 31, 2020Publication date: February 3, 2022Inventors: Young Mok Doo, Juan Lopez, Shawn Merritt
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Patent number: 11218080Abstract: Power inverter assemblies are provided herein for use with motor vehicles. An inverter assembly may have a symmetrical structure configured to convert DC input power to AC output power. The inverter assembly may include a housing enclosing a symmetrical DC input portion, a symmetrical AC output portion, a DC link capacitor, and a gate drive portion having a pair of power modules. The symmetrical DC input portion can include a DC input bus bar sub-assembly to which the DC link capacitor is coupled, and a second DC bus bar sub-assembly that may electrically couple the DC link capacitor with the power modules. The symmetrical AC output portion may include a three phase output AC bus bar sub-assembly to which the power modules can be electrically coupled. A cooling sub-assembly may be provided for cooling the power modules with fluid transfer using a coolant.Type: GrantFiled: August 31, 2015Date of Patent: January 4, 2022Assignee: Faraday & Future Inc.Inventors: Young Mok Doo, Steven E. Schulz, Silva Hiti
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Patent number: 10326378Abstract: Power inverter assemblies are provided herein for use with motor vehicles. An inverter assembly may have a symmetrical structure configured to convert DC input power to AC output power. The inverter assembly may include a housing enclosing a symmetrical DC input portion, a symmetrical AC output portion, a DC link capacitor, and a gate drive portion having a pair of power modules. The symmetrical DC input portion can include a DC input bus bar sub-assembly to which the DC link capacitor is coupled, and a second DC bus bar sub-assembly that may electrically couple the DC link capacitor with the power modules. The symmetrical AC output portion may include a three phase output AC bus bar sub-assembly to which the power modules can be electrically coupled. A cooling sub-assembly may be provided for cooling the power modules with fluid transfer using a coolant.Type: GrantFiled: November 25, 2015Date of Patent: June 18, 2019Assignee: FARADAY & FUTURE INC.Inventors: Young Mok Doo, Steven E. Schulz, Silva Hiti
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Patent number: 10135355Abstract: Power inverter assemblies are provided herein for use with motor vehicles. An inverter assembly may have a symmetrical structure configured to convert DC input power to AC output power. The inverter assembly may include a housing enclosing a symmetrical DC input portion, a symmetrical AC output portion, a DC link capacitor, and a gate drive portion having a pair of power modules. The symmetrical DC input portion can include a DC input bus bar sub-assembly to which the DC link capacitor is coupled, and a second DC bus bar sub-assembly that may electrically couple the DC link capacitor with the power modules. The symmetrical AC output portion may include a three phase output AC bus bar sub-assembly to which the power modules can be electrically coupled. A cooling sub-assembly may be provided for cooling the power modules with fluid transfer using a coolant.Type: GrantFiled: August 31, 2015Date of Patent: November 20, 2018Assignee: FARADAY&FUTURE INC.Inventors: Young Mok Doo, Steven E. Schulz, Silva Hiti
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Patent number: 9810722Abstract: A three-phase current sensor for measuring currents running in three conductors of a three-phase conductor system includes at least a first magnetic measuring device. The magnetic measuring device includes a magnetic circuit provided with at least two gaps and a magnetic field sensor arranged in each gap of the magnetic circuit. The magnetic field sensors are positioned on both sides of a cavity sized to receive one of the three conductors. The gaps and thus the magnetic field sensors are positioned such that stray magnetic flux from an adjacent conductor has substantially equal amplitude passing through each of the sensors.Type: GrantFiled: September 23, 2015Date of Patent: November 7, 2017Assignee: FARADAY & FUTURE INC.Inventors: Steven E. Schulz, Young Mok Doo, Silva Hiti, Richard Michael Breese
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Patent number: 9784768Abstract: A three-phase current sensor for measuring currents running in three conductors of a three-phase conductor system includes at least a first magnetic measuring device. The magnetic measuring device includes a magnetic circuit provided with at least two gaps and a magnetic field sensor arranged in each gap of the magnetic circuit. The magnetic field sensors are positioned on both sides of a cavity sized to receive one of the three conductors. The gaps and thus the magnetic field sensors are positioned such that stray magnetic flux from an adjacent conductor has substantially equal amplitude passing through each of the sensors.Type: GrantFiled: March 30, 2016Date of Patent: October 10, 2017Assignee: FARADAY & FUTURE INC.Inventors: Steven E. Schulz, Young Mok Doo, Silva Hiti, Richard Michael Breese
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Publication number: 20170082661Abstract: A three-phase current sensor for measuring currents running in three conductors of a three-phase conductor system includes at least a first magnetic measuring device. The magnetic measuring device includes a magnetic circuit provided with at least two gaps and a magnetic field sensor arranged in each gap of the magnetic circuit. The magnetic field sensors are positioned on both sides of a cavity sized to receive one of the three conductors. The gaps and thus the magnetic field sensors are positioned such that stray magnetic flux from an adjacent conductor has substantially equal amplitude passing through each of the sensors.Type: ApplicationFiled: March 30, 2016Publication date: March 23, 2017Inventors: Steven E. Schulz, Young Mok Doo, Silva Hiti, Richard Michael Breese
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Publication number: 20170082660Abstract: A three-phase current sensor for measuring currents running in three conductors of a three-phase conductor system includes at least a first magnetic measuring device. The magnetic measuring device includes a magnetic circuit provided with at least two gaps and a magnetic field sensor arranged in each gap of the magnetic circuit. The magnetic field sensors are positioned on both sides of a cavity sized to receive one of the three conductors. The gaps and thus the magnetic field sensors are positioned such that stray magnetic flux from an adjacent conductor has substantially equal amplitude passing through each of the sensors.Type: ApplicationFiled: September 23, 2015Publication date: March 23, 2017Inventors: Steven E. Schulz, Young Mok Doo, Silva Hiti, Richard Michael Breese
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Publication number: 20170064864Abstract: Power inverter assemblies are provided herein for use with motor vehicles. An inverter assembly may have a symmetrical structure configured to convert DC input power to AC output power. The inverter assembly may include a housing enclosing a symmetrical DC input portion, a symmetrical AC output portion, a DC link capacitor, and a gate drive portion having a pair of power modules. The symmetrical DC input portion can include a DC input bus bar sub-assembly to which the DC link capacitor is coupled, and a second DC bus bar sub-assembly that may electrically couple the DC link capacitor with the power modules. The symmetrical AC output portion may include a three phase output AC bus bar sub-assembly to which the power modules can be electrically coupled. A cooling sub-assembly may be provided for cooling the power modules with fluid transfer using a coolant.Type: ApplicationFiled: November 25, 2015Publication date: March 2, 2017Inventors: Young Mok Doo, Steven E. Schulz, Silva Hiti
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Publication number: 20170063066Abstract: Power inverter assemblies are provided herein for use with motor vehicles. An inverter assembly may have a symmetrical structure configured to convert DC input power to AC output power. The inverter assembly may include a housing enclosing a symmetrical DC input portion, a symmetrical AC output portion, a DC link capacitor, and a gate drive portion having a pair of power modules. The symmetrical DC input portion can include a DC input bus bar sub-assembly to which the DC link capacitor is coupled, and a second DC bus bar sub-assembly that may electrically couple the DC link capacitor with the power modules. The symmetrical AC output portion may include a three phase output AC bus bar sub-assembly to which the power modules can be electrically coupled. A cooling sub-assembly may be provided for cooling the power modules with fluid transfer using a coolant.Type: ApplicationFiled: August 31, 2015Publication date: March 2, 2017Inventors: Young Mok Doo, Steven E. Schulz, Silva Hiti
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Publication number: 20170063203Abstract: Power inverter assemblies provided herein may comprise: a conductive metal structure connecting the inverter assembly to a motor assembly, containing an inverter, physically protecting the inverter from an external environment, shielding at least some components of the inverter from electromagnetic interference, and providing an electrical ground to one or more components of the inverter; and the inverter comprising: a first DC link capacitor; a second DC link capacitor; a capacitor enclosure, the first DC link capacitor and the second DC link capacitor being potted on a sidewall of the capacitor enclosure; a plurality of power modules electrically coupled with the both the first DC link capacitor and the second DC link capacitor; and an AC bus bar assembly coupled to the plurality of power modules, the AC bus bar assembly providing output current produced by the plurality of power modules.Type: ApplicationFiled: February 3, 2016Publication date: March 2, 2017Inventor: Young Mok Doo
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Publication number: 20170063065Abstract: Power inverter assemblies are provided herein for use with motor vehicles. An inverter assembly may have a symmetrical structure configured to convert DC input power to AC output power. The inverter assembly may include a housing enclosing a symmetrical DC input portion, a symmetrical AC output portion, a DC link capacitor, and a gate drive portion having a pair of power modules. The symmetrical DC input portion can include a DC input bus bar sub-assembly to which the DC link capacitor is coupled, and a second DC bus bar sub-assembly that may electrically couple the DC link capacitor with the power modules. The symmetrical AC output portion may include a three phase output AC bus bar sub-assembly to which the power modules can be electrically coupled. A cooling sub-assembly may be provided for cooling the power modules with fluid transfer using a coolant.Type: ApplicationFiled: August 31, 2015Publication date: March 2, 2017Inventors: Young Mok Doo, Steven E. Schulz, Silva Hiti
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Patent number: 9241428Abstract: Power inverter assemblies are provided herein for use with motor vehicles. An inverter assembly may have a symmetrical structure configured to convert DC input power to AC output power. The inverter assembly may include a housing enclosing a symmetrical DC input portion, a symmetrical AC output portion, a DC link capacitor, and a gate drive portion having a pair of power modules. The symmetrical DC input portion can include a DC input bus bar sub-assembly to which the DC link capacitor is coupled, and a second DC bus bar sub-assembly that may electrically couple the DC link capacitor with the power modules. The symmetrical AC output portion may include a three phase output AC bus bar sub-assembly to which the power modules can be electrically coupled. A cooling sub-assembly may be provided for cooling the power modules with fluid transfer using a coolant.Type: GrantFiled: August 31, 2015Date of Patent: January 19, 2016Assignee: Faraday & Future Inc.Inventors: Young Mok Doo, Steven E. Schulz, Silva Hiti