Abstract: Implementations relate generally to devices for measuring an analyte in a host. Implementations may provide reduced sizes for wearable devices including a transcutaneous analyte sensor for analyte measurement.

Abstract: Implementations relate generally to devices for measuring an analyte in a host. Implementations may provide reduced sizes for wearable devices including a transcutaneous analyte sensor for analyte measurement.

Abstract: Implementations relate generally to devices for measuring an analyte in a host. Implementations may provide reduced sizes for wearable devices including a transcutaneous analyte sensor for analyte measurement.

Abstract: The present disclosure discloses a distance measuring device for a vehicle. The distance measuring device for the vehicle of the present disclosure includes a fixing portion to be mounted on an outer surface of the vehicle; and a sensor portion which is installed in the fixing portion, irradiates a radio wave to the outside of the vehicle, receives the radio wave from the outside of the vehicle, measures a distance between an object of the outside of the vehicle and the vehicle, or detects the object.

Abstract: Provided is a semiconductor package including a first bump pad on a first substrate, a second bump pad on a second substrate, a core material for reverse reflow between the first bump pad and the second bump pad, and a solder member forming a solder layer on the core material for reverse reflow. The solder member is in contact with the first bump pad and the second bump pad. Each of a first diameter of the first bump pad and a second diameter of the second bump pad is at least about 1.1 times greater than a third diameter of the core material for reverse reflow. The core material for reverse reflow includes a core, a first metal layer directly coated on the core, and a second metal layer directly coated on the first metal layer.

Abstract: A lead-free solder alloy includes bismuth (Bi), content of which is equal to or greater than 56 wt % and equal to or less than 57.5 wt %, indium (In), content of which is equal to or greater than 0.05 wt % and equal to or less than 1.0 wt %, and the balance of tin (Sn) and another unavoidable impurity. The lead-free solder alloy of the disclosure may enable bonding with improved ductility and thermal shock reliability while not having a large melting point change compared to an Sn-58Bi alloy.

Abstract: The present embodiments relate generally to apparatuses, systems, and methods for deploying a medical device to skin of a host. The apparatuses, systems, and methods may be directed to removing a liner for a medical device so that the medical device may couple to the skin of the host. The medical device may comprise an on-skin wearable medical device.

Abstract: The present embodiments relate generally to apparatuses, systems, and methods for deploying a medical device to skin of a host. The apparatuses, systems, and methods may be directed to removing a liner for a medical device so that the medical device may couple to the skin of the host. The medical device may comprise an on-skin wearable medical device.

Abstract: The present embodiments relate generally to apparatuses, systems, and methods for deploying a medical device to skin of a host. The apparatuses, systems, and methods may be directed to removing a liner for a medical device so that the medical device may couple to the skin of the host. The medical device may comprise an on-skin wearable medical device.

Abstract: The present invention relates to an ethylene/alpha-olefin copolymer having excellent volume resistance and light transmittance, and a method for preparing the same.

Abstract: The present invention relates to a food order service system, and objects of the present invention is to provide a food order service system in which a consumer can order and pay for a small amount of cooked or processed food easily and quickly, thereby allowing people to save a cooking time, and food expense caused by leftovers can be reduced.

Abstract: The present embodiments relate generally to applicators of on-skin sensor assemblies for measuring an analyte in a host, as well as their method of use and manufacture. In some aspects, an applicator for applying an on-skin sensor assembly to a skin of a host is provided. The applicator includes an applicator housing, a needle carrier assembly comprising an insertion element configured to insert a sensor of the on-skin sensor assembly into the skin of the host, a holder releasably coupled to the needle carrier assembly and configured to guide the on-skin sensor assembly while coupled to the needle carrier assembly, and a drive assembly configured to drive the insertion element from a proximal starting position to a distal insertion position, and from the distal insertion position to a proximal retraction position.

Abstract: The present embodiments relate generally to applicators of on-skin sensor assemblies for measuring an analyte in a host, as well as their method of use and manufacture. In some aspects, an applicator for applying an on-skin sensor assembly to a skin of a host is provided. The applicator includes an applicator housing, a needle carrier assembly comprising an insertion element configured to insert a sensor of the on-skin sensor assembly into the skin of the host, a holder releasably coupled to the needle carrier assembly and configured to guide the on-skin sensor assembly while coupled to the needle carrier assembly, and a drive assembly configured to drive the insertion element from a proximal starting position to a distal insertion position, and from the distal insertion position to a proximal retraction position.

Abstract: Applicators for applying an on-skin assembly to skin of a host and methods of their use and/or manufacture are provided. An applicator includes an insertion assembly configured to insert at least a portion of the on-skin assembly into the skin of the host, a housing configured to house the insertion assembly, the housing comprising an aperture through which the on-skin assembly can pass, an actuation member configured to, upon activation, cause the insertion assembly to insert at least the portion of the on-skin assembly into the skin of the host, and a sealing element configured to provide a sterile barrier and a vapor barrier between an internal environment of the housing and an external environment of the housing.

Abstract: The present invention relates to a composition for an encapsulant film including an ethylene/alpha-olefin copolymer having high volume resistance and light transmittance, and an encapsulant film using the same.

Abstract: An ethylene/alpha-olefin copolymer and method for preparing the same is disclosed herein. In some embodiments, an ethylene/alpha-olefin copolymer satisfying the following conditions, (a) a density of 0.85 to 0.89 g/cc, (b) a molecular weight distribution of 1.8 to 2.3, (c) a melt index (MI2.16) of 1 to 100 dg/min, and (d) a full width at half maximum (FWHM) of a crystallization peak of 15 or more. The ethylene/alpha-olefin copolymer has high volume resistance and light transmittance.

Abstract: Applicators for applying an on-skin assembly to skin of a host and methods of their use and/or manufacture are provided. An applicator includes an insertion assembly configured to insert at least a portion of the on-skin assembly into the skin of the host, a housing configured to house the insertion assembly, the housing comprising an aperture through which the on-skin assembly can pass, an actuation member configured to, upon activation, cause the insertion assembly to insert at least the portion of the on-skin assembly into the skin of the host, and a sealing element configured to provide a sterile barrier and a vapor barrier between an internal environment of the housing and an external environment of the housing.

Abstract: Provided is a special optical fiber for measuring a 3D curved shape, and a system for measuring the 3D curved shape by using a special optical fiber. The special optical fiber comprises: an optical fiber core for transmitting an optical signal; an inner cladding covering the optical fiber core; and an outer cladding covering the inner cladding. In particular, the refractive index (n1) of the optical fiber core, the refractive index (n2) of the inner cladding, and the refractive index (n3) of the outer cladding are set in a relationship of n1?n3>n2. The inner cladding covering the optical fiber core has a cut portion in the longitudinal direction. The optical fiber core is exposed through the cut portion. In addition, the cut portion is filled with a material having the same refractive index as the optical fiber core or the outer cladding.

Abstract: The present embodiments relate generally to applicators of on-skin sensor assemblies for measuring an analyte in a host, as well as their method of use and manufacture. In some aspects, an applicator for applying an on-skin sensor assembly to a skin of a host is provided. The applicator includes an applicator housing, a needle carrier assembly comprising an insertion element configured to insert a sensor of the on-skin sensor assembly into the skin of the host, a holder releasably coupled to the needle carrier assembly and configured to guide the on-skin sensor assembly while coupled to the needle carrier assembly, and a drive assembly configured to drive the insertion element from a proximal starting position to a distal insertion position, and from the distal insertion position to a proximal retraction position.

Abstract: The present embodiments relate generally to applicators of on-skin sensor assemblies for measuring an analyte in a host, as well as their method of use and manufacture. In some aspects, an applicator for applying an on-skin sensor assembly to a skin of a host is provided. The applicator includes an applicator housing, a needle carrier assembly comprising an insertion element configured to insert a sensor of the on-skin sensor assembly into the skin of the host, a holder releasably coupled to the needle carrier assembly and configured to guide the on-skin sensor assembly while coupled to the needle carrier assembly, and a drive assembly configured to drive the insertion element from a proximal starting position to a distal insertion position, and from the distal insertion position to a proximal retraction position.