Abstract: A soldering device adaptable to dipping method for preventing neighboring leads (L) from being mixed in molten lead (Pb) even though spaces between leads (L) of parts mounted to a PCB substrate (P) are relatively narrow, the device having a lead tub where molten lead is filled up to an upper end thereof and maintained at a predetermined temperature, the device comprising a receiving plate disposed at an upper surface of the lead tub and formed with a receiving unit for soldered parts of PCB substrate to contact the molten lead, a fixing unit mounted at the receiving plate for the PCB substrate to be accommodated with, detached from and fixed to the receiving unit, and an elevation arranged to elevate the receiving plate horizontally and slantingly.

Abstract: A leadless alloy for soldering containing 0.1 to 5.0% bismuth, 0.1 to 5.0% silver, 0.1 to 3.0% antimony, 0.1 to 5.5% copper, 0.001 to 0.01% phosphorus, 0.01 to 0.1% germanium and 81.4 to 99.6% tin by weight.