Patents by Inventor Younghyeok Kim

Younghyeok Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of operating audio subsystem for USB module, system-on-chip performing the same and method of operating system-on-chip using the same
    Patent number: 11803499
    Abstract: In a method of operating an audio subsystem and a universal serial bus (USB) module, the audio subsystem receives a reference clock signal from the USB module. A USB direct memory access (UDMA) block included in the audio subsystem performs an automatic restart every predetermined period in synchronization with the reference clock signal. The UDMA block transmits data having a predetermined size to the USB module by performing a direct memory access (DMA) operation whenever the automatic restart is performed.
    Type: Grant
    Filed: August 8, 2022
    Date of Patent: October 31, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Younghyeok Kim, Hana Yang
  • METHOD OF OPERATING AUDIO SUBSYSTEM FOR USB MODULE, SYSTEM-ON-CHIP PERFORMING THE SAME AND METHOD OF OPERATING SYSTEM-ON-CHIP USING THE SAME
    Publication number: 20220374375
    Abstract: In a method of operating an audio subsystem and a universal serial bus (USB) module, the audio subsystem receives a reference clock signal from the USB module. A USB direct memory access (UDMA) block included in the audio subsystem performs an automatic restart every predetermined period in synchronization with the reference clock signal. The UDMA block transmits data having a predetermined size to the USB module by performing a direct memory access (DMA) operation whenever the automatic restart is performed.
    Type: Application
    Filed: August 8, 2022
    Publication date: November 24, 2022
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Younghyeok KIM, Hana YANG
  • Method of operating audio subsystem for USB module, system-on-chip performing the same and method of operating system-on-chip using the same
    Patent number: 11409680
    Abstract: In a method of operating an audio subsystem and a universal serial bus (USB) module, the audio subsystem receives a reference clock signal from the USB module. A USB direct memory access (UDMA) block included in the audio subsystem performs an automatic restart every predetermined period in synchronization with the reference clock signal. The UDMA block transmits data having a predetermined size to the USB module by performing a direct memory access (DMA) operation whenever the automatic restart is performed.
    Type: Grant
    Filed: September 30, 2020
    Date of Patent: August 9, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Younghyeok Kim, Hana Yang
  • METHOD OF OPERATING AUDIO SUBSYSTEM FOR USB MODULE, SYSTEM-ON-CHIP PERFORMING THE SAME AND METHOD OF OPERATING SYSTEM-ON-CHIP USING THE SAME
    Publication number: 20210303497
    Abstract: In a method of operating an audio subsystem and a universal serial bus (USB) module, the audio subsystem receives a reference clock signal from the USB module. A USB direct memory access (UDMA) block included in the audio subsystem performs an automatic restart every predetermined period in synchronization with the reference clock signal. The UDMA block transmits data having a predetermined size to the USB module by performing a direct memory access (DMA) operation whenever the automatic restart is performed.
    Type: Application
    Filed: September 30, 2020
    Publication date: September 30, 2021
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Younghyeok KIM, Hana YANG
  • Method of preparing antimicrobial 3D-printing filament
    Patent number: 9523160
    Abstract: Disclosed is a method of preparing an antimicrobial 3D-printing filament, comprising: providing a first mixture comprising a plastic resin and at least one antimicrobial agent selected from the group consisting of an inorganic antimicrobial agent, an organic antimicrobial agent, a metal antimicrobial agent, an ammonium salt antimicrobial agent, a guanidine antimicrobial agent, a copper compound antimicrobial agent, a sustained-release polymer antimicrobial agent, and a natural antimicrobial agent; providing a master batch by extruding the first mixture; and preparing an antimicrobial filament by excluding a second mixture containing the master batch and the plastic resin.
    Type: Grant
    Filed: December 24, 2014
    Date of Patent: December 20, 2016
    Assignee: BNK CO., LTD.
    Inventors: Sungjin Kim, Younghyeok Kim, Hyeongju Kim, Youngsoo Kim
  • METHOD OF PREPARING ANTIMICROBIAL 3D-PRINTING FILAMENT
    Publication number: 20160069001
    Abstract: Disclosed is a method of preparing an antimicrobial 3D-printing filament, comprising: providing a first mixture comprising a plastic resin and at least one antimicrobial agent selected from the group consisting of an inorganic antimicrobial agent, an organic antimicrobial agent, a metal antimicrobial agent, an ammonium salt antimicrobial agent, a guanidine antimicrobial agent, a copper compound antimicrobial agent, a sustained-release polymer antimicrobial agent, and a natural antimicrobial agent; providing a master batch by extruding the first mixture; and preparing an antimicrobial filament by excluding a second mixture containing the master batch and the plastic resin.
    Type: Application
    Filed: December 24, 2014
    Publication date: March 10, 2016
    Inventors: Sungjin KIM, Younghyeok Kim, Hyeongju Kim, Youngsoo Kim