Abstract: A new circuit board and process for making the board are disclosed. The process comprises (a) forming a circuit pattern and terminal pads (on a substrate) with electrically conductive composition comprising conductive powder and a light curable resin binder; (b) shielding the terminal pads; (c) curing the circuit pattern by exposing it to light; and (d) applying conductive particles to the unexposed terminal pads and adhering the particles thereto by exposing the terminal pad to light; and then (e) coating the terminal pads with an insulating adhesive. A new method for attaching other circuit boards or electronic parts is also disclosed. The method comprises first aligning a circuit board or electronic part with the coated terminal pad of the new circuit board. Secondly, heat is applied to the terminal pad to cure the terminal pads, and thus bond the board or part to that terminal pad.