Abstract: Methods and apparatus for controlling manufacturing equipment are provided herein. In some embodiments, a manufacturing system may include an integrated controller having one or more inputs to receive input values corresponding to operating information of at least one of a process tool, a mass flow controller or at least one sub-fab auxiliary system, wherein the integrated controller is configured to receive the input values, determine that an error condition is matched based on the received input values, and control the at least one sub-fab auxiliary system to operate at a fail-safe operating mode responsive to the determined error condition.

Abstract: Methods and apparatus for controlling manufacturing equipment are provided herein. In some embodiments, a manufacturing system may include an integrated controller having one or more inputs to receive input values corresponding to operating information of at least one of a process tool, a mass flow controller or at least one sub-fab auxiliary system, wherein the integrated controller is configured to receive the input values, determine that an error condition is matched based on the received input values, and control the at least one sub-fab auxiliary system to operate at a fail-safe operating mode responsive to the determined error condition.

Abstract: Methods and apparatus for controlling manufacturing equipment are provided herein. In some embodiments, a manufacturing system may include an integrated controller having one or more inputs to receive input values corresponding to operating information of at least one of a process tool, a mass flow controller or at least one sub-fab auxiliary system, wherein the integrated controller is configured to receive the input values, determine that an error condition is matched based on the received input values, and control the at least one sub-fab auxiliary system to operate at a fail-safe operating mode responsive to the determined error condition.

Abstract: Methods and apparatus for enhanced control over electronic device manufacturing systems are provided herein. In some embodiments, the integrated sub-fab system may employ Ethernet and/or RS232 Serial communications through an open platform of apparatus to achieve a reduced carbon footprint during electronic device manufacturing. For this example, the system could include a process tool set and controller linked by sensors or software interconnect with one or more sub-fab or local factory auxiliary systems that can be operated in one or more states of energy consumption. These one or more auxiliary systems can be switched between different levels of energy consumption, as required by the process, via the controller. For many auxiliary components or systems the integrated sub-fab system utilizes existing signal outputs, for others they may employ secondary sensors or monitors.

Abstract: Methods and apparatus for controlling a processing system are provided herein. In some embodiments, a method of controlling a processing system may include operating a vacuum pump coupled to a process chamber at a first baseline pump idle speed selected to maintain the process chamber at a pressure equal to a first baseline pump idle pressure; monitoring the pressure in the process chamber while operating the vacuum pump at the first baseline pump idle speed; and determining whether the first baseline pump idle pressure can be maintained in the process chamber when the vacuum pump is operating at the first baseline pump idle speed.

Abstract: Methods and apparatus for enhanced control, monitoring and recording of incoming chemical and power use, and emissions of electronic device manufacturing systems are provided. In some embodiments, integrated sub-fab system systems may monitor the energy usage of the sub-fab equipment. The tool can enter many different depths of energy savings modes such as idle (shallow energy savings where production equipment can recover to normal production with no quality or throughput impact in seconds), sleep (deeper energy savings where production equipment can recover in minutes), or hibernate (where production equipment may require hours to recover not to have impact on quality, or throughput) for the system. In some embodiments, the system may monitor and display all gas emissions in a sub-fab as well as the Semi S23 method reporting of CO2 equivalent emission. The system may monitor effluent process gases and energy use from the process tool and sub-fab equipment.

Abstract: A method for abating effluent from an electronic device manufacturing process is provided, including abating the effluent in a thermal abatement tool to form abated effluent; determining whether the abated effluent contains one or more chemical species of interest; and changing one or more operating parameters of the thermal abatement tool based upon the determination. Numerous other embodiments are provided.

Abstract: Methods and apparatus for controlling manufacturing equipment are provided herein. In some embodiments, a manufacturing system may include an integrated controller having one or more inputs to receive input values corresponding to operating information of at least one of a process tool, a mass flow controller or at least one sub-fab auxiliary system, wherein the integrated controller is configured to receive the input values, determine that an error condition is matched based on the received input values, and control the at least one sub-fab auxiliary system to operate at a fail-safe operating mode responsive to the determined error condition.

Abstract: A method for operating one or more electronic device manufacturing systems is provided, including the steps 1) performing a series of electronic device manufacturing process steps with a process tool, wherein the process tool produces effluent as a byproduct of performing the series of process steps; 2) abating the effluent with an abatement tool; 3) supplying an abatement resource to the abatement tool from a first abatement resource supply; 4) changing an abatement resource supply from the first abatement resource supply to a second abatement resource supply, wherein changing the abatement resource supply comprises: i) interrupting a flow of the abatement resource from the first abatement resource supply; and ii) beginning a flow of the abatement resource from the second abatement resource supply; and 5) continuing to perform the series of process steps with the process tool, while changing, and after changing, the abatement resource supply.

Abstract: Methods and apparatus for controlling a processing system are provided herein. In some embodiments, a method of controlling a processing system may include operating a vacuum pump coupled to a process chamber at a first baseline pump idle speed selected to maintain the process chamber at a pressure equal to a first baseline pump idle pressure; monitoring the pressure in the process chamber while operating the vacuum pump at the first baseline pump idle speed; and determining whether the first baseline pump idle pressure can be maintained in the process chamber when the vacuum pump is operating at the first baseline pump idle speed.

Abstract: A flame sensor apparatus for use with a flame heated thermal abatement reactor is provided, including a flame sensor adapted to sense a flame within the thermal abatement reactor; and a shutter adapted to selectively block the transmission of radiation from the flame to the flame sensor.

Abstract: An abatement system is provided which includes 1) an abatement unit adapted to abate effluent; and 2) an ambient air supply system. The ambient air supply system includes an air moving device, wherein the ambient air supply system is adapted to supply ambient air to the abatement unit for use as an oxidant. Numerous other aspects are provided.

Abstract: Methods and apparatus for enhanced control, monitoring and recording of incoming chemical and power use, and emissions of electronic device manufacturing systems are provided. In some embodiments, integrated sub-fab system systems may monitor the energy usage of the sub-fab equipment. The tool can enter many different depths of energy savings modes such as idle (shallow energy savings where production equipment can recover to normal production with no quality or throughput impact in seconds), sleep (deeper energy savings where production equipment can recover in minutes), or hibernate (where production equipment may require hours to recover not to have impact on quality, or throughput) for the system. In some embodiments, the system may monitor and display all gas emissions in a sub-fab as well as the Semi S23 method reporting of CO2 equivalent emission. The system may monitor effluent process gases and energy use from the process tool and sub-fab equipment.

Abstract: Methods and apparatus for enhanced control over electronic device manufacturing systems are provided herein. In some embodiments, an integrated sub-fab system in accordance with the present invention may be provided with fixed or real time power factor management, correction, reporting, and tabulation. Such a system could also be used by any industry consuming significant levels of power. The integrated sub-fab system power management could be extended to other parts of the factory where high levels of power are used.

Abstract: Methods and apparatus for enhanced control over electronic device manufacturing systems are provided herein. In some embodiments, the integrated sub-fab system may employ Ethernet and/or RS232 Serial communications through an open platform of apparatus to achieve a reduced carbon footprint during electronic device manufacturing. For this example, the system could include a process tool set and controller linked by sensors or software interconnect with one or more sub-fab or local factory auxiliary systems that can be operated in one or more states of energy consumption. These one or more auxiliary systems can be switched between different levels of energy consumption, as required by the process, via the controller. For many auxiliary components or systems the integrated sub-fab system utilizes existing signal outputs, for others they may employ secondary sensors or monitors.

Abstract: The present invention relates to a thermal reactor apparatus used to treat industrial effluent fluids, for example waste effluent produced in semiconductor and liquid crystal display manufacturing processes. Specifically, the present invention relates to improved monitoring and control features for the thermal reactor apparatus, including a flame sensing device, an intrinsically safe flammable gas sensing device, and a sequential mode of operation having built-in safety redundancy. The improved monitoring and control features ensure the safe and efficient abatement of waste effluent within the thermal reactor apparatus.

Abstract: Methods and apparatus for efficiently operating an electronic device manufacturing system are provided. In one aspect, an electronic device manufacturing system is provided, including: a process tool; a process tool controller linked to the process tool, wherein the process tool controller is adapted to control the process tool; a first sub-fab auxiliary system linked to the process tool controller; wherein the first sub-fab auxiliary system is adapted to operate in a first operating mode and a second operating mode; and wherein the process tool controller is adapted to cause the first sub-fab auxiliary system to change from the first operating mode to the second operating mode.

Abstract: An abatement system is provided, including an abatement unit adapted to abate effluent using ambient air; and an ambient air delivery system in fluid communication with the abatement unit and adapted to deliver ambient air to the abatement unit; wherein the ambient air delivery system allows sufficient ambient air to flow into the abatement unit to abate the effluent without compressed air. Numerous other aspects are provided.

Abstract: A method of operating an electronic device manufacturing thermal abatement system is provided, including: flowing a gaseous effluent through an inlet into a thermal abatement reaction chamber; abating the effluent; flowing the abated effluent through an outlet out of the thermal abatement reaction chamber; using a pressure sensor to measure an inlet pressure; using the same pressure sensor to measure an outlet pressure; wherein the pressure sensor sequentially measures the inlet pressure and the outlet pressure; determining the difference between the inlet pressure and the outlet pressure; and if the difference between the inlet pressure and the outlet pressure exceeds a pre-determined pressure, diverting the flow of effluent away from the inlet. Numerous other aspects are provided.

Abstract: A method for abating effluent from an electronic device manufacturing process is provided, including abating the effluent in a thermal abatement tool to form abated effluent; determining whether the abated effluent contains one or more chemical species of interest; and changing one or more operating parameters of the thermal abatement tool based upon the determination. Numerous other embodiments are provided.