Patents by Inventor Yousui Nemoto

Yousui Nemoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5204025
    Abstract: A conductive paste composition is described, which comprises an epoxy resin having a diglycidylamino group, a resol type phenol curing agent, and copper powder. The paste composition exhibits excellent moisture resistance and adhesion and provides a cured film of high conductivity level.
    Type: Grant
    Filed: April 8, 1991
    Date of Patent: April 20, 1993
    Assignee: Mitsubishi Petrochemical Co., Ltd.
    Inventors: Kimiko Yamada, Katuyosi Yada, Hiromu Inoue, Yousui Nemoto
  • Patent number: 5160783
    Abstract: An epoxy resin-impregnated glass cloth sheet having an adhesive layer provided on at least one side of the surface thereof, characterized in that (A) said epoxy resin-impregnated glass cloth sheet is formed by impregnating glass cloth with a curable epoxy resin composition and curing it, said curable epoxy resin composition comprising an epoxy resin represented by the following structural formula (I), a brominated epoxy resin and a curing agent for epoxy resin in such an amount that the content of the epoxy resin represented by the following structural formula (I) is 5 to 50% by weight based on the amount of the entire epoxy resins and the content of bromine atom is 14 to 30% by weight based on the combined amount of the entire epoxy resins and the curing agent for epoxy resin; and (B) said adhesive layer is composed of a curable epoxy resin composition comprising an epoxy resin represented by the following structural formula (I), a brominated epoxy resin, an acrylonitrile/butadiene copolymer having carboxyl
    Type: Grant
    Filed: December 19, 1990
    Date of Patent: November 3, 1992
    Assignee: Mitsubishi Petrochemical Co., Ltd.
    Inventors: Yousui Nemoto, Akiyoshi Itoh, Toshimi Kohmura, Yasuhiro Horiba
  • Patent number: 4334035
    Abstract: An unsaturated polyester resin composition comprising (A) an unsaturated polyester alkyd prepared by condensing all or at least 30 mol% of 1,2-butanediol as a polyhydric alcohol component, all or part of phthalic anhydride as a saturated polybasic acid component, and an unsaturated polybasic acid component, and (B) an unsaturated monomer copolymerizable with component (A), the amount of component (B) being 20 to 55 parts by weight based on 100 parts by weight of component (A) is disclosed. The thus-formed unsaturated polyester resin composition is of low viscosity and is easy in filling with glass fibers, pigments, inorganic fillers, etc. Further, it has such advantages that the smell of the unsaturated monomer is low and that the influence against human beings due to evaporation of the unsaturated monomer can be reduced.
    Type: Grant
    Filed: March 19, 1981
    Date of Patent: June 8, 1982
    Assignee: Mitsubishi Petrochemical Co., Ltd.
    Inventors: Taketoshi Fujita, Yasuyuki Ohgi, Yousui Nemoto