Patents by Inventor Yousuke Oyama

Yousuke Oyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Filling method and filling apparatus of powder-particle material in compression molding
    Patent number: 7866352
    Abstract: Powder-particle material in compression molding is transferred using air suction power and filled thinly, evenly and rapidly in a female mold. An adsorption pad 21 which is held so as to be freely movable in the vertical direction is provided at a movable cylinder 7, which can move in the horizontal direction in a space between a metal supply hopper 2 and a female mold 34 and rotate 180°, and powder particle material is laid in a scraped manner at the adsorption pad 21, adsorbed by actuating a vacuum pump 14, transferred to the female mold 34 in this state, turned around and caused to fall into the mold by terminating adsorption.
    Type: Grant
    Filed: December 16, 2005
    Date of Patent: January 11, 2011
    Assignee: Matsui Mfg. Co., Ltd.
    Inventors: Harumoto Kimura, Kazunari Hanaoka, Yousuke Oyama, Riichi Nakano
  • Filling Method and Filling Apparatus of Powder-Particle Material in Compression Molding
    Publication number: 20080217802
    Abstract: Powder-particle material in compression molding is transferred using air suction power and filled thinly, evenly and rapidly in a female mold. An adsorption pad 21 which is held so as to be freely movable in the vertical direction is provided at a movable cylinder 7, which can move in the horizontal direction in a space between a metal supply hopper 2 and a female mold 34 and rotate 180°, and powder particle material is laid in a scraped manner at the adsorption pad 21, adsorbed by actuating a vacuum pump 14, transferred to the female mold 34 in this state, turned around and caused to fall into the mold by terminating adsorption.
    Type: Application
    Filed: December 16, 2005
    Publication date: September 11, 2008
    Applicants: MATSUI MFG.CO., LTD., KABUSHIKI KAISHA MEIKI SEISAKUSHO
    Inventors: Harumoto Kimura, Kazunari Hanaoka, Yousuke Oyama, Riichi Nakano