Abstract: A light-emitting device includes a semiconductor epitaxial structure that has a first surface and a second surface opposite to the first surface, and that includes a first semiconductor layer, an active layer, and a second semiconductor layer sequentially disposed in such order in a direction from the first surface to the second surface. The active layer includes well layers and barrier layers that are alternately stacked. The active layer has an upper surface that is adjacent to the second semiconductor layer, and a lower surface that is opposite to the upper surface. The first semiconductor layer is doped with an n-type dopant, which has a first concentration of 5E17/cm3 at a first point in the first semiconductor layer. The first point of the first semiconductor layer and the lower surface of the active layer have a first distance therebetween. The first distance ranges from 150 nm to 500 nm.

Abstract: A sensor package structure includes a substrate, a sensor chip and a ring-shaped solder mask frame those are disposed on the substrate, a ring-shaped support disposed on a top side of the annular solder mask frame, and a light permeable member that is disposed on the ring-shaped support. The sensor chip is electrically coupled to the substrate. A top surface of the sensor chip has a sensing region, and the sensing region is spaced apart from an outer lateral side of the sensor chip by a distance less than 300 ?m. The ring-shaped solder mask frame surrounds and contacts the outer lateral side of the sensor chip. The light permeable member, the ring-shaped support, and the sensor chip jointly define an enclosed space.

Abstract: An imaging lens assembly includes a plurality of optical elements and an accommodating assembly, wherein the accommodating assembly is for containing the optical elements. The accommodating assembly includes a conical-shaped light blocking sheet and a lens barrel. The conical-shaped light blocking sheet includes an out-side portion and a conical portion, and the conical portion is connected to the out-side portion. The conical portion includes a conical structure tapered from the out-side portion toward one of an object-side and an image-side along the optical axis. The lens barrel is disposed on one side of the conical portion. The optical elements include a most object-side optical element, a most image-side optical element and at least one optical element. The conical structure of the conical-shaped light blocking sheet is physically contacted with only one of the lens barrel, the most object-side optical element and the most image-side optical element.

Abstract: A light-emitting device includes an epitaxial structure having a first surface and a second surface that is opposite to the first surface. The epitaxial structure includes, along a first direction from the first surface to the surface, a first-type semiconductor layer, an active layer, and a second-type semiconductor layer including a capping layer. The capping layer includes at least Ni number of sub-layers arranged in the first direction, where N1?2. Each of the sub-layers of the capping layer contains a material represented by Aly1Ga1-y1InP, where 0<y1?1. The capping layer has an Al content which increases and then remains constant along the first direction. A light-emitting apparatus includes the light-emitting device is also provided.

Abstract: A sensor package structure includes a substrate, a sensor chip and a ring-shaped solder mask frame those are disposed on the substrate, a ring-shaped support disposed on a top side of the annular solder mask frame, and a light permeable member that is disposed on the ring-shaped support. The sensor chip is electrically coupled to the substrate. A top surface of the sensor chip has a sensing region, and the sensing region is spaced apart from an outer lateral side of the sensor chip by a distance less than 300 ?m. The ring-shaped solder mask frame surrounds and contacts the outer lateral side of the sensor chip. The light permeable member, the ring-shaped support, and the sensor chip jointly define an enclosed space.

Abstract: A ghost key preventing circuit includes plural driving lines, plural sensing lines, plural key switches, plural bias resistors and a controller. The plural driving lines and the plural sensing lines are collaboratively formed as a matrix circuit. The plural key switches are included in the matrix circuit. The plural bias resistors are connected with the corresponding sensing lines. When the key switch of a specified switch circuit is turned on, a divided voltage is generated and outputted from the specified switch circuit. The controller judges whether the key switch of the specified switch circuit is normally turned on or the key switch is a ghost key according to the divided voltage.

Abstract: An antenna module is disposed to an electronic device includes a fixed member, a rotating component, a reflector, a director, and an antenna unit. The electronic device includes a first body and a second body. The first body has a first surface and a second surface. The fixed member is disposed to the first body fixedly. The rotating component is connected to the fixed member rotatably. The reflector and the director are disposed to the rotating component. The antenna unit is disposed to the first body and between the reflector and the director. When the first body and the second body rotate relative to each other, the reflector is located between the antenna unit and one of the first surface and the second surface, and the director is located between the antenna unit and another one of the first surface and the second surface.

Abstract: Methods of forming line-end extensions and devices having line-end extensions are provided. In some embodiments, a method includes forming a patterned photoresist on a first region of a hard mask layer. A line-end extension region is formed in the hard mask layer. The line-end extension region extends laterally outward from an end of the first region of the hard mask layer. The line-end extension region may be formed by changing a physical property of the hard mask layer at the line-end extension region.

Abstract: An input switching circuit dynamically connects, based on an input mapping table, input streams to inputs of a wavefront pre-transform circuit. An output switching circuit dynamically connects, based on an output mapping table, output data at outputs of the wavefront pre-transform circuit to transport streams. A controller controls, based on a wiping command, at least one of the input and output switching circuits to alter at least one of the input and output mapping tables such that the at least one of the input and output switching circuits is disabled for connection. A first subset of the transport streams operates in a foreground mode available to a user and is transported for storage in remote storage sites at a network and a second subset of the transport streams operates in a background mode available to an administrator and is not transported for storage in the remote storage sites.

Abstract: Methods of forming line-end extensions and devices having line-end extensions are provided. In some embodiments, a method includes forming a patterned photoresist on a first region of a hard mask layer. A line-end extension region is formed in the hard mask layer. The line-end extension region extends laterally outward from an end of the first region of the hard mask layer. The line-end extension region may be formed by changing a physical property of the hard mask layer at the line-end extension region.

Abstract: A method for forming a patterned mask layer is provided. The method includes forming a layer over a substrate. The method includes forming a first strip structure and a second strip structure over the layer. The method includes forming a spacer layer over the first strip structure, the second strip structure, and the layer. The method includes forming a third strip structure and a fourth strip structure between the first strip part and the second strip part. The connecting part is between the third strip structure and the fourth strip structure. The method includes removing the spacer layer. The first strip structure, the second strip structure, the third strip structure, and the fourth strip structure together form a patterned mask layer.

Abstract: A light path adjustment mechanism includes a bracket, a light valve, a carrier, a first axis, a second axis and an optical plate member. A surface normal of a surface of the light valve crosses the bracket to define an intersection closest to the surface of the light valve, and the bracket has an end point furthest from the intersection measured in the direction of the surface normal. A distance between the intersection and the surface measured in the direction of the surface normal is smaller than a distance between the intersection and the end point measured in the direction of the surface normal.

Abstract: A method for forming a semiconductor structure includes forming first mandrels over a target layer. The method for forming a semiconductor structure also includes forming a first opening to cut off one of the first mandrels. The method for forming a semiconductor structure also includes forming a spacer layer over the first mandrels. The method for forming a semiconductor structure also includes forming second mandrels over the spacer layer and between the first mandrels. The method for forming a semiconductor structure also includes forming a second opening to cut off one of the second mandrels. The method for forming a semiconductor structure also includes etching the spacer layer. The method for forming a semiconductor structure also includes etching the target layer.

Abstract: A light path adjustment mechanism includes a support, a carrier, an optical plate member, a permanent magnet and an electromagnet. The carrier is disposed in the support and connected to the support by a first elastic member and a second elastic member, the first elastic member and the second elastic member are configured to twist substantially about a first axial direction, and the optical plate member is disposed on the carrier. An attractive force or a repulsive force generated between the permanent magnet and the electromagnet acts in a direction substantially perpendicular to the first axial direction, and one end of the carrier is provided with the permanent magnet or the electromagnet.

Abstract: An optical path adjusting mechanism including a rotating base, an optical element, a coil, a first spring and a second spring is provided. The rotating base includes a first corner and a second corner opposite to the first corner. A first area and a second area are disposed along a line passing through the first corner and the second corner on the rotating base. The optical element is disposed on the rotating base. The coil is disposed around a periphery of the rotating base. One terminal of the first spring is connected to the first area of the rotating base. One terminal of the second spring is connected to the second area of the rotating base.

Abstract: A method for forming a semiconductor structure includes forming a hard mask layer over a target layer. The method also includes forming first mandrels over the hard mask layer. The method also includes forming a first opening in the first mandrels. The method also includes depositing a spacer layer over the hard mask layer and the first mandrels. The method also includes depositing a second mandrel material over the spacer layer. The method also includes planarizing the second mandrel material. The method also includes forming a second opening in the second mandrel material. The method also includes patterning and etching the second mandrel material to form second mandrels. The method also includes etching the spacer layer. The method also includes etching the hard mask layer and the target layer.

Abstract: A method for forming a patterned mask layer is provided. The method includes forming a first layer over a substrate. The method includes forming a first strip structure and a second strip structure over the first layer. The method includes forming a spacer layer conformally covering the first strip structure, the second strip structure, and the first layer. The method includes forming a block structure in the first trench. The method includes removing a first portion of the spacer layer, which is under the first trench and not covered by the block structure, and a second portion of the spacer layer, which is over the first strip structure and the second strip structure. The method includes forming a third strip structure in the second trench and the third trench. The method includes removing the block structure. The method includes removing the spacer layer.

Abstract: A light path adjustment mechanism includes a carrier, an optical plate member, a support, a base, a first pair of transmission mechanical pieces, and a second pair of transmission mechanical pieces. One side of the support is provided with a first actuator, and one side of the base is provided with a second actuator. The first pair of transmission mechanical pieces are connected between the base and the support, and the second pair of transmission mechanical pieces are connected between the carrier and the support. The first pair of transmission mechanical pieces are entirely disposed on only one side of the carrier.

Abstract: A method for forming a patterned mask layer is provided. The method includes forming a first layer over a substrate. The method includes forming a first strip structure and a second strip structure over the first layer. The method includes forming a spacer layer conformally covering the first strip structure, the second strip structure, and the first layer. The method includes forming a block structure in the first trench. The method includes removing a first portion of the spacer layer, which is under the first trench and not covered by the block structure, and a second portion of the spacer layer, which is over the first strip structure and the second strip structure. The method includes forming a third strip structure in the second trench and the third trench. The method includes removing the block structure. The method includes removing the spacer layer.

Abstract: A laser soldering system includes a laser source module, a polarization adjusting assembly, a temperature sensor, and a controller. The laser source module is configured to emit a laser beam. The polarization adjusting assembly includes a plurality of polarization elements and at least one stepping motor. The polarization elements are configured to split the laser beam into a Gaussian beam and a ring-shaped beam. The Gaussian beam illuminates the first element, and the ring-shaped beam is illuminates the second element. The stepping motor is configured to adjust a size of the ring-shaped beam. The temperature sensor is configured to monitor temperatures of the first element and a temperature of the second element. The controller is electrically connected to the temperature sensor, the laser source module, and the polarization adjusting assembly.