Patents by Inventor Yu-Chen Chou
Yu-Chen Chou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240196074Abstract: This disclosure provides a lens assembly that has an optical path and includes a lens element and a light-blocking membrane layer. The lens element has an optical portion, and the optical path passes through the optical portion. The light-blocking membrane layer is coated on the lens element and adjacent to the optical portion. The light-blocking membrane layer has a distal side and a proximal side that is located closer to the optical portion than the distal side. The proximal side includes two extension structures and a recessed structure. Each of the extension structures extends along a direction away from the distal side, and the extension structures are not overlapped with each other in a direction in parallel with the optical path. The recessed structure is connected to the extension structures and recessed along a direction towards the distal side.Type: ApplicationFiled: January 26, 2024Publication date: June 13, 2024Applicant: LARGAN PRECISION CO., LTD.Inventors: Jyun-Jia CHENG, Yu Chen LAI, Ming-Ta CHOU, Cheng-Feng LIN, Chen-Yi HUANG
-
Patent number: 12007619Abstract: An imaging lens system has an optical axis and an image surface through which the optical axis passes. The imaging lens system includes a plastic lens barrel surrounding the optical axis. The plastic lens barrel includes an image-side portion and an object-side aperture through which the optical axis passes, and the image-side portion is located between the image surface and the object-side aperture. The image-side portion includes a protrusive structure surrounding the optical axis and extending towards the image surface. The protrusive structure has an inner surface facing the optical axis, an outer surface disposed opposite to the inner surface and located farther away from the optical axis than the inner surface and a reflection-reducing surface extending towards the image surface and connected to and located between the inner surface and the outer surface. The protrusive structure includes a reflection-reducing structure disposed on the reflection-reducing surface.Type: GrantFiled: June 30, 2023Date of Patent: June 11, 2024Assignee: LARGAN PRECISION CO., LTD.Inventors: Yu Chen Lai, Ming-Ta Chou, Cheng-Feng Lin
-
Patent number: 12007617Abstract: An imaging lens system has an optical axis. The imaging lens system includes a plurality of optical elements, a lens barrel, an optical mark structure and a curable liquid. The optical elements are arranged along the optical axis. The lens barrel surrounds the optical axis, and at least one of the optical elements is accommodated in the lens barrel. The optical mark structure is disposed on the lens barrel, and the optical mark structure includes a plurality of optical mark units arranged side by side along a circumference direction that surrounds the optical axis. The curable liquid is disposed on the optical mark structure. The curable liquid is in physical contact with at least one of the optical mark units, and one of the optical elements adjacent to the optical mark structure is fixed to the lens barrel while the curable liquid is cured.Type: GrantFiled: February 17, 2021Date of Patent: June 11, 2024Assignee: LARGAN PRECISION CO., LTDInventors: Yu Chen Lai, Ming-Ta Chou, Liang Chieh Weng, Ming-Shun Chang
-
Patent number: 12007589Abstract: An imaging lens system includes a lens element and an aperture element surrounding an imaging optical path and forming an aperture. The aperture element includes a first conical surface, a second conical surface and a contact surface. The first and second conical surfaces surround the imaging optical path. The contact surface is perpendicular to the imaging optical path and contacts the lens element. When the imaging lens system is in a first environment condition, the first conical surface is in contact with the lens element, the second conical surface is spaced apart from the lens element, and the aperture is aligned with the optically effective region. When the imaging lens system is in a second environment condition, the second conical surface is in contact with the lens element, the first conical surface is spaced apart from the lens element, and the aperture is aligned with the optically effective region.Type: GrantFiled: July 7, 2021Date of Patent: June 11, 2024Assignee: LARGAN PRECISION CO., LTD.Inventors: Chun-Hua Tsai, Yu Chen Lai, Ming-Ta Chou
-
Patent number: 11994736Abstract: An imaging lens assembly has an optical axis and includes an annular structure located on an object side of the imaging lens assembly and surrounds the optical axis. The annular structure is located on an object side of the imaging lens assembly, surrounds the optical axis, and includes a first through hole, a second through hole, a first frustum surface, a second frustum surface and a third frustum surface. The first through hole is disposed on an object side of the annular structure, and the second through hole is disposed on an image side of the first through hole. The first frustum surface is disposed on the image side of the first through hole. The second frustum surface is disposed on an object side of the second through hole. The third frustum surface is disposed on an image side of the second through hole.Type: GrantFiled: January 8, 2021Date of Patent: May 28, 2024Assignee: LARGAN PRECISION CO., LTD.Inventors: Yu-Chen Lai, Ming-Ta Chou, Cheng-Feng Lin, Ming-Shun Chang
-
Patent number: 11971601Abstract: An imaging lens assembly includes a plurality of optical elements and an accommodating assembly, wherein the accommodating assembly is for containing the optical elements. The accommodating assembly includes a conical-shaped light blocking sheet and a lens barrel. The conical-shaped light blocking sheet includes an out-side portion and a conical portion, and the conical portion is connected to the out-side portion. The conical portion includes a conical structure tapered from the out-side portion toward one of an object-side and an image-side along the optical axis. The lens barrel is disposed on one side of the conical portion. The optical elements include a most object-side optical element, a most image-side optical element and at least one optical element. The conical structure of the conical-shaped light blocking sheet is physically contacted with only one of the lens barrel, the most object-side optical element and the most image-side optical element.Type: GrantFiled: June 18, 2021Date of Patent: April 30, 2024Assignee: LARGAN PRECISION CO., LTD.Inventors: Yu-Chen Lai, Chih-Wei Cheng, Ming-Ta Chou, Ming-Shun Chang
-
Publication number: 20240121718Abstract: Some of the present implementations provide a method for a user equipment (UE) for receiving a power saving signal. The method receives, from a base station, a power saving signal comprising a minimum applicable K0 (K0min) that indicates a minimum scheduling offset restriction between a physical downlink control channel (PDCCH) and a physical downlink shared channel (PDSCH). The method determines an application delay based on a predefined value. The method then applies the minimum scheduling offset restriction after the application delay.Type: ApplicationFiled: October 23, 2023Publication date: April 11, 2024Inventors: Yu-Hsin Cheng, Chie-Ming Chou, Wan-Chen Lin, Tsung-Hua Tsai
-
Publication number: 20240110208Abstract: A gene editing system of Candida viswanathii includes a Candida viswanathii, a first gene editing fragment and a second gene editing fragment. The first gene editing fragment successively includes a first homology arm and a screening gene. The second gene editing fragment is connected to a C-terminus of the first gene editing fragment and includes a second homology arm, a Cas9 expression cassette and a sgRNA cassette. The Cas9 expression cassette successively includes a Cas9 promoter, a Cas9 gene and three nuclear localization sequences. The sgRNA cassette successively includes a sgRNA promoter, a first ribozyme, a targeting sequence, a scaffold and a second ribozyme. The first gene editing fragment and the second gene editing fragment are constructed as a linear fragment for gene editing of a chromosome of the Candida viswanathii.Type: ApplicationFiled: March 24, 2023Publication date: April 4, 2024Inventors: Yu-Chen HU, Nam Ngoc PHAM, June-Yen CHOU, Hsing-Yun WANG, Vincent Jianan LIU
-
Patent number: 11950431Abstract: A magnetic tunnel junction (MTJ) device includes two magnetic tunnel junction elements and a magnetic shielding layer. The two magnetic tunnel junction elements are arranged side by side. The magnetic shielding layer is disposed between the magnetic tunnel junction elements. A method of forming said magnetic tunnel junction (MTJ) device includes the following steps. An interlayer including a magnetic shielding layer is formed. The interlayer is etched to form recesses in the interlayer. The magnetic tunnel junction elements fill in the recesses. Or, a method of forming said magnetic tunnel junction (MTJ) device includes the following steps. A magnetic tunnel junction layer is formed. The magnetic tunnel junction layer is patterned to form magnetic tunnel junction elements. An interlayer including a magnetic shielding layer is formed between the magnetic tunnel junction elements.Type: GrantFiled: December 2, 2022Date of Patent: April 2, 2024Assignee: UNITED MICROELECTRONICS CORP.Inventors: Wei Chen, Hui-Lin Wang, Yu-Ru Yang, Chin-Fu Lin, Yi-Syun Chou, Chun-Yao Yang
-
Patent number: 11943785Abstract: A method for PDCCH monitoring performed by a UE is provided. The method includes performing the PDCCH monitoring in a first group associated with at least one first PDCCH monitoring configuration; receiving, from a base station, DCI comprising an indicator; performing the PDCCH monitoring in a second group associated with at least one second PDCCH monitoring configuration; and stopping the PDCCH monitoring in the first group after receiving the indicator.Type: GrantFiled: October 26, 2021Date of Patent: March 26, 2024Assignee: FG Innovation Company LimitedInventors: Wan-Chen Lin, Chie-Ming Chou, Tsung-Hua Tsai, Yu-Hsin Cheng
-
Patent number: 11924534Abstract: This disclosure provides a lens assembly that has an optical path and includes a lens element and a light-blocking membrane layer. The lens element has an optical portion, and the optical path passes through the optical portion. The light-blocking membrane layer is coated on the lens element and adjacent to the optical portion. The light-blocking membrane layer has a distal side and a proximal side that is located closer to the optical portion than the distal side. The proximal side includes two extension structures and a recessed structure. Each of the extension structures extends along a direction away from the distal side, and the extension structures are not overlapped with each other in a direction in parallel with the optical path. The recessed structure is connected to the extension structures and recessed along a direction towards the distal side.Type: GrantFiled: November 10, 2021Date of Patent: March 5, 2024Assignee: LARGAN PRECISION CO., LTD.Inventors: Jyun-Jia Cheng, Yu Chen Lai, Ming-Ta Chou, Cheng-Feng Lin, Chen-Yi Huang
-
Publication number: 20200374507Abstract: A stereo image display apparatus includes a display device, a lens array layer and a shielding unit. The lens array layer is disposed adjacent to a display surface of the display device, and the lens array layer includes a plurality of lenses. The shielding unit is disposed between the display device and the lens array layer, or is disposed on the display device, or is disposed on the lens array layer. The shielding unit includes a plurality of light transmitting regions and at least one light shielding region, the light shielding region is located at a periphery of the light transmitting regions, the light transmitting regions respectively correspond in position to the lenses, and the lens array layer is configured to reconstruct an un-reconstructed image displayed by the display surface as an integral image to produce a stereo image.Type: ApplicationFiled: May 20, 2019Publication date: November 26, 2020Inventors: CHUN-HSIANG YANG, YI-PAI HUANG, CHIH-HUNG TING, KAI-CHIEH CHANG, JUI-YI WU, WEI-AN CHEN, Yu-Chen Chou
-
Publication number: 20190195468Abstract: A reflection film including a reflection film substrate and a wavelength conversion layer is provided. The wavelength conversion layer is disposed on the reflection film substrate. The wavelength conversion layer includes a wavelength conversion material, a plurality of nanoparticles and a base material. Since the reflection film of the invention includes the wavelength conversion material and the plurality of nanoparticles, the backlight brightness and the color saturation of the display using the reflection film of the invention are improved.Type: ApplicationFiled: March 8, 2018Publication date: June 27, 2019Applicant: Chunghwa Picture Tubes, LTD.Inventors: Wen-Jiunn Hsieh, Yu-Chen Chou
-
Publication number: 20170203691Abstract: The vehicle of no blind spot contains a vehicle body, a number of monitoring devices along the vehicle body's circumference, a number of display devices inside the vehicle electrically connected to at least a corresponding monitoring device. The display device contains a flexible screen. By presenting views around the front, center, and rear pillars, the driver's blind spot problem is resolved and driving safety is enhanced.Type: ApplicationFiled: January 20, 2016Publication date: July 20, 2017Inventors: Yu-Chen Chou, Po-Jen Tsai
-
Patent number: 7064428Abstract: A wafer-level package structure, applicable to a flip-chip arrangement on a carrier, which comprises a plurality of contact points, is described. This wafer-level package structure is mainly formed with a chip and a conductive layer. The conductive layer is arranged on the bonding pads of the chip as contact points. The conductive layer can further be arranged at a region outside the bonding pads on the chip as a heat sink to enhance the heat dissipation ability of the package.Type: GrantFiled: December 19, 2002Date of Patent: June 20, 2006Assignee: Advanced Semiconductor Engineering, Inc.Inventors: Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su, Chao-Fu Weng, Yung-Chi Lee, Yu-Chen Chou, Tsung-Hua Wu, Su Tao
-
Patent number: 6967153Abstract: A bump fabrication process for forming a bump over a wafer having a plurality of bonding pads thereon is provided. A patterned solder mask layer having a plurality of openings that exposes the respective bonding pads is formed over a wafer. The area of the opening in a the cross-sectional area through a the bottom-section as well as through a the top-section of the opening is smaller than the area of the opening in a the cross-sectional area through a the mid-section of the opening. Solder material is deposited into the opening and then a reflow process is conducted fusing the solder material together to form a spherical bump inside the opening. Finally, the solder mask layer is removed. In addition, a pre-formed bump may form on the bonding pad of the wafer prior to forming the patterned solder mask layer over the wafer having at least with an opening that exposes the pre-formed bump.Type: GrantFiled: February 10, 2003Date of Patent: November 22, 2005Assignee: Advanced Semiconductor Engineering, Inc.Inventors: Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su, Chao-Fu Weng, Yung-Chi Lee, Yu-Chen Chou, Tsung-Hua Wu, Su Tao
-
Patent number: 6927964Abstract: A semiconductor device with a capability can prevent a burnt fuse pad from re-electrical connection, wherein the semiconductor device includes a bump pad and a fuse pad over a wafer. The fuse pad includes the burnt fuse pad having a gap for electrical isolation. The semiconductor device comprises a dielectric layer, disposed substantially above the burnt fuse pad and filling the gap, and a bump structure, disposed on the bump pad. The foregoing semiconductor device can further comprise a passivation layer, which exposes the bump pad and a portion of the burnt fuse pad. Wherein, the dielectric layer is over the passivation layer, covers the exposed portion of the burnt fuse pad and fills the gap.Type: GrantFiled: August 15, 2003Date of Patent: August 9, 2005Assignee: Advanced Semiconductor Engineering, Inc.Inventors: Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su, Chao-Fu Weng, Yung-Chi Lee, Yu-Chen Chou, Tsung-Hua Wu, Su Tao
-
Publication number: 20050161812Abstract: A wafer-level package structure, applicable to a flip-chip type arrangement on a carrier having a plurality of contact points is described. This wafer-level package structure comprises a chip having a protective layer and a plurality of bonding pads and a conductive layer. The conductive layer is arranged on the bonding pads of the chip as contact points. The wafer-level package structure can further include a heat sink to enhance the heat dissipation ability of the package structure.Type: ApplicationFiled: April 14, 2005Publication date: July 28, 2005Inventors: Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shou Chen, Ching-Huei Su, Chao-Fu Weng, Yung-Chi Lee, Yu-Chen Chou, Tsung-Hua Wu, Su Tao
-
Patent number: 6877653Abstract: A method of modifying the tin to lead ratio of a tin-lead bump forms a patterned solder mask over a substrate that comprises a first tin-lead bump formed thereon, the patterned solder mask having an opening that exposes the tin-lead bump. A solder material including tin and lead is filled in the opening of the solder mask over the first tin-lead bump. The solder material has a tin to lead ratio that differs from that of the first tin-lead bump. The solder material is reflowed to fuse with the first tin-lead bump, which forms a second tin-lead bump. The tin to lead ratio of the second tin-lead bump is thereby different from that of the first tin-lead bump.Type: GrantFiled: January 17, 2003Date of Patent: April 12, 2005Assignee: Advanced Semiconductor Engineering, Inc.Inventors: Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su, Chao-Fu Weng, Yung-Chi Lee, Yu-Chen Chou, Tsung-Hua Wu, Su Tao
-
Patent number: 6861346Abstract: A solder ball fabricating process for forming solder balls over a wafer having an active layer is provided. A patterned solder mask layer is formed over the active surface of the wafer. The patterned solder mask layer has an opening that exposes a bonding pad on the wafer. Solder material is deposited into the opening over the bonding pad. A reflow process is conducted to form a pre-solder body. The aforementioned steps are repeated so that various solder materials are fused together to form a solder ball over the bonding pad.Type: GrantFiled: August 14, 2003Date of Patent: March 1, 2005Assignee: Advanced Semiconductor Engineering, Inc.Inventors: Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su, Chao-Fu Weng, Yung-Chi Lee, Yu-Chen Chou