Patents by Inventor Yu-Chen Hsin
Yu-Chen Hsin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10725126Abstract: A biomolecule magnetic sensor configured to sense magnetic beads attached with biomolecules includes an adsorption pad, a magnetic field line generator and at least one magnetic sensor. The adsorption pad is configured to adsorb the magnetic beads. The magnetic field line generator is configured to generate a plurality of first magnetic field lines, and at least one of the first magnetic field lines passes through the magnetic beads along a first direction to induce a plurality of second magnetic field lines, wherein the magnetic field line generator is disposed between the adsorption pad and the magnetic sensor in the first direction. The magnetic sensor is configured to sense a magnetic field component of at least one of the second magnetic field lines in a second direction. A second shift is provided between the magnetic sensor and the adsorption pad in the second direction.Type: GrantFiled: December 30, 2016Date of Patent: July 28, 2020Assignee: Industrial Technology Research InstituteInventors: Hsin-Han Lee, Yu-Sheng Chen, Ding-Yeong Wang, Yu-Chen Hsin
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Patent number: 10416114Abstract: A structure of an electrochemical unit includes a substrate, a first metal layer disposed on the substrate, and an array of electrochemical cells disposed on the first metal layer. The array of the electrochemical cells includes a plurality of electrochemical cells. Each of the electrochemical cells includes the first metal layer disposed on the substrate, a first electrode disposed on the first metal layer, a polymer layer disposed on the substrate and adjacent to the first metal layer and the first electrode. A second metal layer is disposed on the polymer layer, and a second electrode is disposed on the second metal layer. A pore is constituted between the polymer layers of every the two electrochemical cells. A cavity located above the first electrode is defined between every the two electrochemical cells, wherein the cavity is communicated with the pore.Type: GrantFiled: November 15, 2016Date of Patent: September 17, 2019Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Jui-Chin Chen, Pei-Jer Tzeng, Tzu-Kun Ku, Yu-Chen Hsin, Yiu-Hsiang Chang
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Publication number: 20180067175Abstract: A biomolecule magnetic sensor configured to sense magnetic beads attached with biomolecules includes an adsorption pad, a magnetic field line generator and at least one magnetic sensor. The adsorption pad is configured to adsorb the magnetic beads. The magnetic field line generator is configured to generate a plurality of first magnetic field lines, and at least one of the first magnetic field lines passes through the magnetic beads along a first direction to induce a plurality of second magnetic field lines, wherein the magnetic field line generator is disposed between the adsorption pad and the magnetic sensor in the first direction. The magnetic sensor is configured to sense a magnetic field component of at least one of the second magnetic field lines in a second direction. A second shift is provided between the magnetic sensor and the adsorption pad in the second direction.Type: ApplicationFiled: December 30, 2016Publication date: March 8, 2018Applicant: Industrial Technology Research InstituteInventors: Hsin-Han Lee, Yu-Sheng Chen, Ding-Yeong Wang, Yu-Chen Hsin
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Publication number: 20170343506Abstract: A structure of an electrochemical unit includes a substrate, a first metal layer disposed on the substrate, and an array of electrochemical cells disposed on the first metal layer. The array of the electrochemical cells includes a plurality of electrochemical cells. Each of the electrochemical cells includes the first metal layer disposed on the substrate, a first electrode disposed on the first metal layer, a polymer layer disposed on the substrate and adjacent to the first metal layer and the first electrode. A second metal layer is disposed on the polymer layer, and a second electrode is disposed on the second metal layer. A pore is constituted between the polymer layers of every the two electrochemical cells. A cavity located above the first electrode is defined between every the two electrochemical cells, wherein the cavity is communicated with the pore.Type: ApplicationFiled: November 15, 2016Publication date: November 30, 2017Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Jui-Chin CHEN, Pei-Jer TZENG, Tzu-Kun KU, Yu-Chen HSIN, Yiu-Hsiang CHANG
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Patent number: 9257337Abstract: A method for fabricating a semiconductor device is provided. The method includes: providing a first wafer having a first active surface and a first rear surface opposite to the first active surface, the first wafer comprising a first circuit formed therein; providing a second wafer having a second active surface and a second rear surface opposite to the second active surface, the second wafer comprising a second circuit formed therein; bonding the first active surface of the first wafer with the second active surface of the second wafer so as to electrically connecting the first circuit and the second circuit; thinning the second wafer from the second rear surface; and forming at least a conductive through via in the second wafer, wherein the conductive through via is electrically connected to the first circuit through the second circuit.Type: GrantFiled: December 17, 2014Date of Patent: February 9, 2016Assignee: Industrial Technology Research InstituteInventors: Shang-Chun Chen, Cha-Hsin Lin, Yu-Chen Hsin
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Patent number: 9041163Abstract: A semiconductor structure and a manufacturing method thereof are provided. The semiconductor structure includes a substrate, a device layer and a least one conductive post. The substrate includes a first surface, a second surface opposite to the first surface, and at least one through hole penetrating the substrate. The substrate includes a first side wall portion and a second side wall portion at the through hole. The first side wall portion is connected to the first surface and includes a plurality of first scallops. The second side wall portion is connected to the second surface and includes a non-scalloped surface. The device layer is disposed on the second surface, and the second side wall portion of the substrate further extends into the device layer along the non-scalloped surface. The conductive post is disposed in the through hole, wherein the conductive post is electrically connected to the device layer.Type: GrantFiled: September 23, 2013Date of Patent: May 26, 2015Assignee: Industrial Technology Research InstituteInventors: Shang-Chun Chen, Cha-Hsin Lin, Yu-Chen Hsin
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Publication number: 20150104927Abstract: A method for fabricating a semiconductor device is provided. The method includes: providing a first wafer having a first active surface and a first rear surface opposite to the first active surface, the first wafer comprising a first circuit formed therein; providing a second wafer having a second active surface and a second rear surface opposite to the second active surface, the second wafer comprising a second circuit formed therein; bonding the first active surface of the first wafer with the second active surface of the second wafer so as to electrically connecting the first circuit and the second circuit; thinning the second wafer from the second rear surface; and forming at least a conductive through via in the second wafer, wherein the conductive through via is electrically connected to the first circuit through the second circuit.Type: ApplicationFiled: December 17, 2014Publication date: April 16, 2015Inventors: Shang-Chun Chen, Cha-Hsin Lin, Yu-Chen Hsin
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Publication number: 20140312468Abstract: A semiconductor structure and a manufacturing method thereof are provided. The semiconductor structure includes a substrate, a device layer and a least one conductive post. The substrate includes a first surface, a second surface opposite to the first surface, and at least one through hole penetrating the substrate. The substrate includes a first side wall portion and a second side wall portion at the through hole. The first side wall portion is connected to the first surface and includes a plurality of first scallops. The second side wall portion is connected to the second surface and includes a non-scalloped surface. The device layer is disposed on the second surface, and the second side wall portion of the substrate further extends into the device layer along the non-scalloped surface. The conductive post is disposed in the through hole, wherein the conductive post is electrically connected to the device layer.Type: ApplicationFiled: September 23, 2013Publication date: October 23, 2014Applicant: Industrial Technology Research InstituteInventors: Shang-Chun Chen, Cha-Hsin Lin, Yu-Chen Hsin