Patents by Inventor Yu Cheng

Yu Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240165376
    Abstract: A medical insertion mechanism is provided and includes a base, a needle holder slidably disposed on the base, a needle disposed on the needle holder, a cannula holder arranged at a position corresponding to the needle holder and at least partially disposed inside the needle, a cannula disposed on the cannula holder, a pivoting assembly pivotally disposed on the base, a lever movably disposed on the base and movably engaged with the pivoting assembly, an actuator disposed on the base, and a driving component for driving the pivoting assembly to pivot when the actuator slides to disengage from the pivoting assembly. When the pivoting assembly pivots, the lever drives the needle holder to slide along an insertion direction and then along a retraction direction, so as to insert the cannula into the patient's body. Besides, a medical device having the aforementioned medical insertion mechanism is also provided.
    Type: Application
    Filed: November 23, 2022
    Publication date: May 23, 2024
    Applicant: ALTEK BIOTECHNOLOGY CORPORATION
    Inventor: Yu-Cheng Huang
  • Publication number: 20240170225
    Abstract: This invention describes a packaging structure for roll-type (wound-type) aluminum conductive polymer capacitor element. Two protective substrates are applied to sandwich a roll-type capacitor element in between with an insulating material surrounding the capacitor element also in between the protective substrates. The protective substrates comprise electrically separated anodic conductive pad and cathodic conductive pad on their surfaces and through holes that pass through the conductive pads. The capacitor element is oriented with its axis perpendicular to the two substrates. The anodic and cathodic leads of the capacitor element pass through the through holes. An anodic external terminal is plated over the anodic conductive pad and a cathodic external terminal is plated over the cathodic conductive pad so that the anodic external terminal is electrically connected to the anodic lead and the cathodic external terminal is electrically connected to the cathodic lead.
    Type: Application
    Filed: November 22, 2022
    Publication date: May 23, 2024
    Inventors: Yu-Peng Chung, Chia-Wei Li, Wen Cheng Hsu, En-Ming Chen, Che-Chih Tsao
  • Publication number: 20240170345
    Abstract: A method of manufacturing a circuit pattern structure, a measurement method, and a circuit pattern structure are provided. The method of manufacturing the circuit pattern structure includes: forming a dielectric layer; forming at least one first pad at least partially in the dielectric layer; forming a second pad adjacent to the at least one first pad and having a height greater than that of the at least one first pad.
    Type: Application
    Filed: November 17, 2022
    Publication date: May 23, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Yu-Kai LIN, Chih-Cheng LEE
  • Publication number: 20240167149
    Abstract: The present disclosure provides a multifunction chamber having a multifunctional shutter disk. The shutter disk includes a lamp device, a DC/RF power device, and a gas line on one surface of the shutter disk. With this configuration, simplifying the chamber type is possible as the various specific, dedicated chambers such as a degas chamber, a pre-clean chamber, a CVD/PVD chamber are not required. By using the multifunctional shutter disk, the degassing function and the pre-cleaning function are provided within a single chamber. Accordingly, a separate degas chamber and a pre-clean chamber are no longer required and the overall transfer time between chambers is reduced or eliminated.
    Type: Application
    Filed: January 26, 2024
    Publication date: May 23, 2024
    Inventors: Wen-Hao Cheng, Yen-Yu Chen, Yi-Ming Dai
  • Patent number: 11991886
    Abstract: A method of forming a ferroelectric random access memory (FeRAM) device includes: forming a first layer stack and a second layer stack successively over a substrate, where the first layer stack and the second layer stack have a same layered structure that includes a layer of a first electrically conductive material over a layer of a first dielectric material, where the first layer stack extends beyond lateral extents of the second layer stack; forming a trench that extends through the first layer stack and the second layer stack; lining sidewalls and a bottom of the trench with a ferroelectric material; conformally forming a channel material in the trench over the ferroelectric material; filling the trench with a second dielectric material; forming a first opening and a second opening in the second dielectric material; and filling the first opening and the second opening with a second electrically conductive material.
    Type: Grant
    Filed: January 9, 2023
    Date of Patent: May 21, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Meng-Han Lin, Bo-Feng Young, Han-Jong Chia, Sheng-Chen Wang, Feng-Cheng Yang, Sai-Hooi Yeong, Yu-Ming Lin
  • Patent number: 11990443
    Abstract: In an embodiment, an interposer has a first side, a first integrated circuit device attached to the first side of the interposer with a first set of conductive connectors, each of the first set of conductive connectors having a first height, a first die package attached to the first side of the interposer with a second set of conductive connectors, the second set of conductive connectors including a first conductive connector and a second conductive connector, the first conductive connector having a second height, the second conductive connector having a third height, the third height being different than the second height, a first dummy conductive connector being between the first side of the interposer and the first die package, an underfill disposed beneath the first integrated circuit device and the first die package, and an encapsulant disposed around the first integrated circuit device and the first die package.
    Type: Grant
    Filed: April 9, 2021
    Date of Patent: May 21, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Kuan-Yu Huang, Sung-Hui Huang, Shang-Yun Hou, Shu Chia Hsu, Yu-Yun Huang, Wen-Yao Chang, Yu-Jen Cheng
  • Patent number: 11987027
    Abstract: The present disclosure relates to an innovative leather and a manufacturing method thereof. The innovative leather includes a TPU substrate, a TPU adhering layer, and a TPU surface layer. The TPU adhering layer is disposed on the TPU substrate. The TPU surface layer is disposed on the TPU adhering layer. All materials of the innovative leather of the present disclosure are the same TPU materials, thus the innovative leather of the present disclosure can be recycled after the innovative leather of the present disclosure is used. The innovative leather of the present disclosure has recycling benefit.
    Type: Grant
    Filed: June 22, 2022
    Date of Patent: May 21, 2024
    Assignee: SAN FANG CHEMICAL INDUSTRY CO., LTD.
    Inventors: Chih-Yi Lin, Kuo-Kuang Cheng, Li-Yuan Chen, Yung-Yu Fu
  • Patent number: 11989046
    Abstract: Disclosed herein are related to an integrated circuit to regulate a supply voltage. In one aspect, the integrated circuit includes a metal rail including a first point, at which a first functional circuit is connected, and a second point, at which a second functional circuit is connected. In one aspect, the integrate circuit includes a voltage regulator coupled between the first point of the metal rail and the second point of the metal rail. In one aspect, the voltage regulator senses a voltage at the second point of the metal rail and adjusts a supply voltage at the first point of the metal rail, according to the sensed voltage at the second point of the metal rail.
    Type: Grant
    Filed: February 6, 2023
    Date of Patent: May 21, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Haruki Mori, Hidehiro Fujiwara, Zhi-Hao Chang, Yangsyu Lin, Yu-Hao Hsu, Yen-Huei Chen, Hung-Jen Liao, Chiting Cheng
  • Publication number: 20240164109
    Abstract: In an embodiment, a device includes: a word line extending in a first direction; a data storage layer on a sidewall of the word line; a channel layer on a sidewall of the data storage layer; a back gate isolator on a sidewall of the channel layer; and a bit line having a first main region and a first extension region, the first main region contacting the channel layer, the first extension region separated from the channel layer by the back gate isolator, the bit line extending in a second direction, the second direction perpendicular to the first direction.
    Type: Application
    Filed: January 8, 2024
    Publication date: May 16, 2024
    Inventors: Meng-Han Lin, Han-Jong Chia, Sheng-Chen Wang, Feng-Cheng Yang, Yu-Ming Lin, Chung-Te Lin
  • Publication number: 20240160185
    Abstract: The invention provides a portable CNC machine, including a body and four anchorage bases. The body is put on a surface of a work frame. The body is provided with a machining tool, a processing module and four take-up and pay-off modules, each take-up and pay-off module takes up and pays off a cable, a tail end of each cable is provided with an anchor, and the processing module is connected to and controls the four take-up and pay-off modules. The four anchorage bases are disposed at four corners of the work frame respectively, and stretch and hang the four anchors thereon respectively. The processing module controls the four take-up and pay-off modules to take up and pay off the cables to control the body to freely move on the work frame, and at the same time, the processing module controls the machining tool to carry out a machining operation.
    Type: Application
    Filed: September 27, 2023
    Publication date: May 16, 2024
    Inventors: Ren-Yu Yeh, Po-Hsiang Yu, Chih-Wen Cheng
  • Publication number: 20240156413
    Abstract: An apparatus and a method for detecting heartbeat include a sensor configured to detect displacements of an object without contacting the object wherein the object displaces corresponding the a human's heartbeat, a data processing unit configured to extract a feature dataset from the detected displacement data, and a neural network configured to inference inter beat intervals from the extracted feature dataset using a pre-trained model.
    Type: Application
    Filed: November 8, 2022
    Publication date: May 16, 2024
    Applicant: WISTRON CORPORATION
    Inventors: Yin-Yu CHEN, Kai Jen CHENG, Yao-Tsung CHANG
  • Publication number: 20240162809
    Abstract: A power supply circuit is provided. The power factor correction (PFC) circuit is used to perform a power factor correction according to a first voltage to generate an intermediate voltage. The first storage capacitor is used to store a first electrical energy related to the intermediate voltage. The boost conversion circuit is connected to the PFC circuit and used to generate an output voltage according to the intermediate voltage. The boost conversion circuit includes a first post-stage inductor, a first post-stage diode and a first post-stage transistor. The second storage capacitor is used to store a second electrical energy related to the output voltage. The capacitance value of the second storage capacitor is less than the capacitance value of the first storage capacitor; the first electrical energy is completely or partially transferred as the second electrical energy.
    Type: Application
    Filed: March 6, 2023
    Publication date: May 16, 2024
    Inventors: Yu-Cheng LIN, Te-Hung YU, Chia-Hui LIANG, Min-Hao HSU
  • Publication number: 20240158309
    Abstract: The invention provides a material surface treatment equipment, which is applied to a material substrate. The material surface treatment equipment includes a surface treatment device and at least one waveguide device. The surface treatment device is used to carry the material substrate to perform a surface treatment process. Each waveguide device is used for introducing electromagnetic waves to the material substrate to assist in performing the surface treatment process. Through the introduction of electromagnetic waves, the surface treatment process of the material substrate is easy to perform and can achieve the strengthening effect.
    Type: Application
    Filed: December 15, 2022
    Publication date: May 16, 2024
    Inventors: TIEN-HSI LEE, JUN-HUANG WU, YU-SHENG CHIOU, SHU-CHENG LI, WEI-CHI HUANG, HSIN CHEN
  • Patent number: 11983475
    Abstract: A semiconductor device includes: M*1st conductors in a first layer of metallization (M*1st layer) and being aligned correspondingly along different corresponding ones of alpha tracks and representing corresponding inputs of a cell region in the semiconductor device; and M*2nd conductors in a second layer of metallization (M*2nd layer) aligned correspondingly along beta tracks, and the M*2nd conductors including at least one power grid (PG) segment and one or more of an output pin or a routing segment; and each of first and second ones of the input pins having a length sufficient to accommodate at most two access points; each of the access points of the first and second input pins being aligned to a corresponding different one of first to fourth beta tracks; and the PG segment being aligned with one of the first to fourth beta tracks.
    Type: Grant
    Filed: February 7, 2023
    Date of Patent: May 14, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Pin-Dai Sue, Po-Hsiang Huang, Fong-Yuan Chang, Chi-Yu Lu, Sheng-Hsiung Chen, Chin-Chou Liu, Lee-Chung Lu, Yen-Hung Lin, Li-Chun Tien, Yi-Kan Cheng
  • Patent number: 11984485
    Abstract: A semiconductor device includes a substrate, a gate structure on the substrate, a source/drain (S/D) region and a contact. The S/D region is located in the substrate and on a side of the gate structure. The contact lands on and connected to the S/D region. The contact wraps around the S/D region.
    Type: Grant
    Filed: March 3, 2022
    Date of Patent: May 14, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Po-Hsien Cheng, Jr-Hung Li, Tai-Chun Huang, Tze-Liang Lee, Chung-Ting Ko, Jr-Yu Chen, Wan-Chen Hsieh
  • Patent number: 11981990
    Abstract: The invention provides a deposition equipment with a shielding mechanism, which includes a reaction chamber, a carrier, a cover ring and a shielding mechanism. The shielding mechanism includes a first bearing arm, a second bearing arm, a first shielding plate and a second shielding plate. The first and second shielding plates are respectively placed on the first and second bearing arms. There are corresponding alignment units between the lower surface of the first and second shielding plates and the upper surface the carrier, so that the first and second shielding plates can be aligned with the carrier. There is also a corresponding alignment unit between the upper surface of the first and second shielding plates and the lower surface the cover ring, so that the cover ring can be aligned with the first and second shielding plates to define a cleaning space in the reaction chamber.
    Type: Grant
    Filed: August 30, 2022
    Date of Patent: May 14, 2024
    Assignee: SKY TECH INC.
    Inventors: Jing-Cheng Lin, Yu-Te Shen
  • Patent number: 11984089
    Abstract: The present invention provides improved driving methods for four particle electrophoretic displays that improves the performance of such displays when they are deployed in low temperature environments and the displays are required to be updated when positioned vertically (i.e., the driving electric fields are substantially perpendicular to the direction of Earth's gravity). Methods are provided for displaying each of the colors at each pixel, as desired, with minimal interference (contamination) from the other particles.
    Type: Grant
    Filed: April 25, 2023
    Date of Patent: May 14, 2024
    Assignee: E Ink Corporation
    Inventors: Ning-Wei Jan, Chen-Kai Chiu, Feng-Shou Lin, Chih-Yu Cheng
  • Patent number: 11983321
    Abstract: A display device is configured to display a virtual world. A hand-mounted device is adapted to be worn on a hand of a user and includes an ultrasound transducer and a contact sensor. The ultrasound transducer is configured to emit an ultrasound haptic. The contact sensor is configured to detect a sensor value. A processor is configured to obtain a real position of the hand-mounted device to determine a virtual position of a virtual hand in the virtual world and to determine a virtual distance between the virtual hand and a virtual object in the virtual world based on the virtual position. The processor is configured to determine the hand of the user is open based on the sensor value and in response to the virtual distance being smaller than a contact distance and the hand being open, enable the ultrasound transducer to emit the ultrasound haptic to the finger.
    Type: Grant
    Filed: April 10, 2023
    Date of Patent: May 14, 2024
    Assignee: HTC Corporation
    Inventor: Fang Yu Cheng
  • Patent number: D1026816
    Type: Grant
    Filed: September 1, 2021
    Date of Patent: May 14, 2024
    Assignee: VOLTRONIC POWER TECHNOLOGY CORP.
    Inventors: You-Sheng Chiang, Yu-Cheng Lu, Juor-Ming Hsieh
  • Patent number: D1026817
    Type: Grant
    Filed: September 1, 2021
    Date of Patent: May 14, 2024
    Assignee: VOLTRONIC POWER TECHNOLOGY CORP.
    Inventors: You-Sheng Chiang, Yu-Cheng Lu, Juor-Ming Hsieh