Abstract: A semiconductor die package includes an inductor-capacitor (LC) semiconductor die that is directly bonded with a logic semiconductor die. The LC semiconductor die includes inductors and capacitors that are integrated into a single die. The inductors and capacitors of the LC semiconductor die may be electrically connected with transistors and other logic components on the logic semiconductor die to form a voltage regulator circuit of the semiconductor die package. The integration of passive components (e.g., the inductors and capacitors) of the voltage regulator circuit into a single semiconductor die reduces signal propagation distances in the voltage regulator circuit, which may increase the operating efficiency of the voltage regulator circuit, may reduce the formfactor for the semiconductor die package, may reduce parasitic capacitance and/or may reduce parasitic inductance in the voltage regulator circuit (thereby improving the performance of the voltage regulator circuit), among other examples.

Abstract: The present invention relates to a method for preparing a modified stem cell, including the following steps: a cell culture step: culturing stem cells in a first culture medium of a culture dish at a predetermined cell density, and removing the first culture medium after a first culture time to obtain a first cell intermediate; an activity stimulation step: preserving the first cell intermediate in a freezing container having a cell cryopreservation solution, and performing a constant temperature stimulation treatment or a variable temperature stimulation treatment for at least more than 1 day; and a product collection step: after completing the activity stimulation step, placing the freezing container in an environment at a thawing temperature for thawing, and then removing the cell cryopreservation solution to obtain the modified stem cell. The modified stem cell can release at least one or more of IL-4, IL-5, IL-13, G-CSF, Fractalkine, and EGF.

Abstract: The present disclosure provides a method for preparing mesenchymal stem cell-derived extracellular vesicle, the mesenchymal stem cell-derived extracellular vesicle prepared by the method, and use of the mesenchymal stem cell-derived extracellular vesicle for reducing adipogenesis and treating osteoarthritis. The mesenchymal stem cell-derived extracellular vesicle of the present disclosure achieves the effect of reducing adipogenesis and treating osteoarthritis through various efficacy experiments.

Abstract: A wafer transporting method includes following operations. A plurality of wafers are received in a semiconductor container attached to a mobile vehicle. An air processing system is coupled to a wall of the semiconductor container. The air processing system includes an inlet valve, an outlet valve, a pump between the inlet valve and the outlet valve, and a desiccant coupled to the pump. The semiconductor container is moved. The pump of the air processing system is turned on to extract air from inside the semiconductor container into the air processing system through the inlet valve. Humidity of the air is reduced when the air passes through the desiccant of the air processing system. The air is returned back to the semiconductor container through the outlet valve.

Abstract: A semiconductor device according to embodiments of the present disclosure includes a first die including a first bonding layer and a second die including a second hybrid bonding layer. The first bonding layer includes a first dielectric layer and a first metal coil embedded in the first dielectric layer. The second bonding layer includes a second dielectric layer and a second metal coil embedded in the second dielectric layer. The second hybrid bonding layer is bonded to the first hybrid bonding layer such that the first dielectric layer is bonded to the second dielectric layer and the first metal coil is bonded to the second metal coil.

Abstract: A semiconductor device includes a first die having a first bonding layer; a second die having a second bonding layer disposed over and bonded to the first bonding layer; a plurality of bonding members, wherein each of the plurality of bonding members extends within the first bonding layer and the second bonding layer, wherein the plurality of bonding members includes a connecting member electrically connected to a first conductive pattern in the first die and a second conductive pattern in the second die, and a dummy member electrically isolated from the first conductive pattern and the second conductive pattern; and an inductor disposed within the first bonding layer and the second bonding layer. A method of manufacturing a semiconductor device includes bonding a first inductive coil of a first die to a second inductive coil of a second die to form an inductor.

Abstract: A block erase method for a flash memory is provided. The block erase method is to perform block erase on a block with a predetermined block size. The block erase method includes: performing an erase verification on bytes byte-by-byte in the block when performing the block erase; checking an erase step of the byte when the byte does not pass the erase verification; when the erase step of the byte exceeds a predetermined threshold value, performing the block erase with a partitioned block smaller than the predetermined block size, and returning to an erase verification stage to perform the erase verification; and when the erase step of the bytes does not exceed the predetermined threshold value, continuing to perform the block erase with the predetermined block size, and returning to the erasure verification stage to continue to perform the erase verification.

Abstract: A resistive memory apparatus including a memory cell array and a voltage selector circuit is provided. The memory cell array includes a plurality of memory cells. The voltage selector circuit is coupled to the memory cell array. The voltage selector circuit performs a voltage applying operation on the memory cells via a plurality of different signal transmission paths. Each of the signal transmission paths passes one of the memory cells. IR drops of two of the signal transmission paths are substantially identical, and signal transmission directions thereof are different. In addition, an operating method of a resistive memory apparatus is also provided.

Abstract: A resistive memory apparatus including a memory cell array and a voltage selector circuit is provided. The memory cell array includes a plurality of memory cells. The voltage selector circuit is coupled to the memory cell array. The voltage selector circuit performs a voltage applying operation on the memory cells via a plurality of different signal transmission paths. Each of the signal transmission paths passes one of the memory cells. IR drops of two of the signal transmission paths are substantially identical, and signal transmission directions thereof are different. In addition, an operating method of a resistive memory apparatus is also provided.

Abstract: In the present invention, users on the Internet can share and accumulate experiences by referencing to different uses' experience data.

Abstract: In the present invention, users on the Internet can share and accumulate experiences by referencing to different uses' experience data.

Abstract: A cooler includes a stationary side plate, a plurality of cooling pipes, a housing and an inlet and outlet cap. The cooling pipes are contained winding around in the housing, with one ends connected with the side plate closed up with the inlet and outlet cap to let A cover is fixed on an upper wall of the housing near the side plate and a hole provided in the upper wall to let hot oil coming from an oil tube fixed in the side plate to flow in the housing to move up and down along separating plates provided vertically in such a way to form an up-and-down passageway for hot oil to be cooled down and flow out of an oil exit in the bottom of the housing.

Abstract: A glass vacuum flask coating method comprising a step to put a metal material in the gap between an inner flask and an outer flask before said inner and outer flasks being formed into a blank for a glass vacuum flask, after the process of exhausting and tipping-off said metal material being heated by a magnetic field generated from an inductance coil into a metal vapor inside said gap, permitting said metal vapor to be adhered to the glass surface inside said gap, forming into a metal reflecting film thereon.