Abstract: A vaporizer comprises an absorber, a heating element, and a porous cover layer. The absorber is configured to absorb a material to be vaporized. The heating element is configured to heat and vaporize the material to be vaporized in the absorber, and includes a first electrode portion, a second electrode portion, and an electrically conductive connecting member connected between the first electrode portion and the second electrode portion. The porous cover layer covers at least a portion of the heating element without covering the first and second electrode portions. A ratio of an area of the porous cover layer to an area of the electrically conductive connecting member is defined as a covering ratio, which is at least 50%. A porosity of the porous cover layer ranges from 30% to 75%.

Abstract: A display device is provided and includes a display panel, a light source, a light source controller, and a timing controller. The light source is adjacent to the display panel. The light source controller is electrically connected to the light source. The timing controller is electrically connected to the light source controller and the display panel. The timing controller includes a decoding unit and first and second processing units. The first processing unit is electrically connected to the decoding unit and the display panel. The second processing unit is electrically connected to the decoding unit and the light source controller. The decoding unit provides a refresh signal to the first and second processing units so that the display panel refreshes displayed content in a first refresh sequence according to first refresh rates, and the light source refreshes brightness in a second refresh sequence according to second refresh rates.

Abstract: A waterproof click pad device includes a click pad, a frame and a waterproof unit. The frame surrounds the click pad and surrounds an axis passing through the click pad. The waterproof unit is transverse to the axis and is in sheet form. The waterproof unit includes a frame adhesive member surrounding the axis and adhered to the frame, a first non-adhesive member surrounding the axis, connected to an inner periphery of the frame adhesive member and spaced apart from and located above the frame, a second non-adhesive member surrounding the axis, connected to an inner periphery of the first non-adhesive member and spaced apart from and located above the click pad and the frame, and an plate adhesive member connected to an inner periphery of the second non-adhesive member and adhered to the click pad.

Abstract: The present invention relates to a method for preparing a modified stem cell, including the following steps: a cell culture step: culturing stem cells in a first culture medium of a culture dish at a predetermined cell density, and removing the first culture medium after a first culture time to obtain a first cell intermediate; an activity stimulation step: preserving the first cell intermediate in a freezing container having a cell cryopreservation solution, and performing a constant temperature stimulation treatment or a variable temperature stimulation treatment for at least more than 1 day; and a product collection step: after completing the activity stimulation step, placing the freezing container in an environment at a thawing temperature for thawing, and then removing the cell cryopreservation solution to obtain the modified stem cell. The modified stem cell can release at least one or more of IL-4, IL-5, IL-13, G-CSF, Fractalkine, and EGF.

Abstract: The present disclosure provides a method for preparing mesenchymal stem cell-derived extracellular vesicle, the mesenchymal stem cell-derived extracellular vesicle prepared by the method, and use of the mesenchymal stem cell-derived extracellular vesicle for reducing adipogenesis and treating osteoarthritis. The mesenchymal stem cell-derived extracellular vesicle of the present disclosure achieves the effect of reducing adipogenesis and treating osteoarthritis through various efficacy experiments.

Abstract: A mending method for a display includes the steps of making a display device light to make a plurality of light emitting positions thereof shine, searching out a plurality of defect positions among the light emitting positions, providing a transferring device having a transferring surface with a plurality of miniature light emitting elements positioned correspondingly to the light emitting positions, planning a mending procedure which includes in the area the transferring surface corresponds to, choosing in chief the largest number of defect positions able to be mended at a single time according to the positions of the miniature light emitting elements and then in the area the transferring surface corresponds to, planning the rest of the defect positions according to the rest of the miniature light emitting elements, and according to the mending procedure, moving the transferring device to weld the miniature light emitting elements at the defect positions.

Abstract: A metal adhesion layer may be formed on a bottom and a sidewall of a trench prior to formation of a metal plug in the trench. A plasma may be used to modify the phase composition of the metal adhesion layer to increase adhesion between the metal adhesion layer and the metal plug. In particular, the plasma may cause a shift or transformation of the phase composition of the metal adhesion layer to cause the metal adhesion layer to be composed of a (111) dominant phase. The (111) dominant phase of the metal adhesion layer increases adhesion between the metal adhesion layer.

Abstract: A semiconductor package is provided. The semiconductor package includes a heat dissipation substrate including a first conductive through-via embedded therein; a sensor die disposed on the heat dissipation substrate; an insulating encapsulant laterally encapsulating the sensor die; a second conductive through-via penetrating through the insulating encapsulant; and a first redistribution structure and a second redistribution structure disposed on opposite sides of the heat dissipation substrate. The second conductive through-via is in contact with the first conductive through-via. The sensor die is located between the second redistribution structure and the heat dissipation substrate. The second redistribution structure has a window allowing a sensing region of the sensor die receiving light. The first redistribution structure is electrically connected to the sensor die through the first conductive through-via, the second conductive through-via and the second redistribution structure.

Abstract: Some implementations described herein include systems and techniques for fabricating a wafer-on-wafer product using a filled lateral gap between beveled regions of wafers included in a stacked-wafer assembly and along a perimeter region of the stacked-wafer assembly. The systems and techniques include a deposition tool having an electrode with a protrusion that enhances an electromagnetic field along the perimeter region of the stacked-wafer assembly during a deposition operation performed by the deposition tool. Relative to an electromagnetic field generated by a deposition tool not including the electrode with the protrusion, the enhanced electromagnetic field improves the deposition operation so that a supporting fill material may be sufficiently deposited.

Abstract: A package structure includes a thermal dissipation structure, a first encapsulant, a die, a through integrated fan-out via (TIV), a second encapsulant, and a redistribution layer (RDL) structure. The thermal dissipation structure includes a substrate and a first conductive pad disposed over the substrate. The first encapsulant laterally encapsulates the thermal dissipation structure. The die is disposed on the thermal dissipation structure. The TIV lands on the first conductive pad of the thermal dissipation structure and is laterally aside the die. The second encapsulant laterally encapsulates the die and the TIV. The RDL structure is disposed on the die and the second encapsulant.

Abstract: A display device includes a display panel. The display panel has a functional display area. The functional display area includes a plurality of display pixels and a plurality of light transmitting regions. The plurality of display pixels are around by the plurality of the light transmitting regions. A boundary between one of the plurality of display pixels and one of the plurality of light transmitting regions comprises an arc segment.

Abstract: A method of fabricating a semiconductor structure includes the following steps. A semiconductor wafer is provided. A plurality of first surface mount components and a plurality of second surface mount components are bonded onto the semiconductor wafer, wherein a first portion of each of the second surface mount components is overhanging a periphery of the semiconductor wafer. A first barrier structure is formed in between the second surface mount components and the semiconductor wafer. An underfill structure is formed under a second portion of each of the second surface mount components, wherein the first barrier structure blocks the spreading of the underfill structure from the second portion to the first portion.

Abstract: A risk control system for traffic devices includes a light emitting device, a processing element and a user prompting element. The processing element is electrically connected with the light emitting device, and outputs a prompt signal. The user prompting element is electrically connected with the processing element, and receives the prompt signal.

Abstract: A semiconductor image sensing structure includes a semiconductor substrate having a front side and a back side, a pixel sensor disposed in the semiconductor substrate, a transistor disposed over the front side of the semiconductor substrate, and a reflective structure disposed over the front side of the semiconductor substrate. A gate structure of the transistor and the reflective structure include a same material. A top surface of the gate structure of the transistor and a top surface of the reflective structure are aligned with each other.

Abstract: Disclosed are methods, systems, and non-transitory computer-readable medium for analysis of images including wearable items. For example, a method may include obtaining a first set of images, each of the first set of images depicting a product; obtaining a first set of labels associated with the first set of images; training an image segmentation neural network based on the first set of images and the first set of labels; obtaining a second set of images, each of the second set of images depicting a known product; obtaining a second set of labels associated with the second set of images; training an image classification neural network based on the second set of images and the second set of labels; receiving a query image depicting a product that is not yet identified; and performing image segmentation of the query image and identifying the product in the image by performing image analysis.

Abstract: The present disclosure, in some embodiments, relates to a metal-insulator-metal (MIM) capacitor structure. The MIM capacitor structure includes one or more lower interconnects disposed within a lower dielectric structure over a substrate. A first dielectric layer is over the lower dielectric structure and includes sidewalls defining a plurality of openings extending through the first dielectric layer. A lower electrode is arranged along the sidewalls and over an upper surface of the first dielectric layer, a capacitor dielectric is arranged along sidewalls and an upper surface of the lower electrode, and an upper electrode is arranged along sidewalls and an upper surface of the capacitor dielectric. A spacer is along opposing outermost sidewalls of the upper electrode. The spacer has an outermost surface extending from a lowermost surface of the spacer to a top of the spacer. The outermost surface is substantially aligned with an outermost sidewall of the lower electrode.

Abstract: The present disclosure, in some embodiments, relates to a method of forming a capacitor structure. The method includes forming a capacitor dielectric layer over a lower electrode layer, and forming an upper electrode layer over the capacitor dielectric layer. The upper electrode layer is etched to define an upper electrode and to expose a part of the capacitor dielectric layer. A spacer structure is formed over horizontally extending surfaces of the upper electrode layer and the capacitor dielectric layer and also along sidewalls of the upper electrode. The spacer structure is etched to remove the spacer structure from over the horizontally extending surfaces of the upper electrode layer and the capacitor dielectric layer and to define a spacer. The capacitor dielectric layer and the lower electrode layer are etched according to the spacer to define a capacitor dielectric and a lower electrode.

Abstract: A semiconductor device includes an image sensor structure and a periphery device structure. The image sensor structure includes a first semiconductor substrate, a first interconnect structure, a radiation device, a transfer gate transistor electrically coupled to the radiation device, a floating diffusion region electrically coupled to the transfer gate, and a first capacitor disposed in the first interconnect structure. The transfer gate transistor electrically interconnects and disconnects the radiation device and the floating diffusion region. The periphery device structure includes a second interconnect structure disposed on the first interconnect structure, a second semiconductor substrate disposed on the second interconnect structure, a plurality of logic devices disposed in the second semiconductor substrate, and a second capacitor disposed in the second interconnect structure. The first capacitor and the second capacitor are electrically coupled to the floating diffusion region.

Abstract: The present disclosure, in some embodiments, relates to a method of forming a capacitor structure. The method includes forming a capacitor dielectric layer over a lower electrode layer, and forming an upper electrode layer over the capacitor dielectric layer. The upper electrode layer is etched to define an upper electrode and to expose a part of the capacitor dielectric layer. A spacer structure is formed over horizontally extending surfaces of the upper electrode layer and the capacitor dielectric layer and also along sidewalls of the upper electrode. The spacer structure is etched to remove the spacer structure from over the horizontally extending surfaces of the upper electrode layer and the capacitor dielectric layer and to define a spacer. The capacitor dielectric layer and the lower electrode layer are etched according to the spacer to define a capacitor dielectric and a lower electrode.

Abstract: A fitness equipment control system is provided. The system includes a receiver and a mobile apparatus, and performs the operations: generating a first control signal based on a training course of a user; transmitting the first control signal to the receiver to make the receiver generates a signal which is readable by the fitness equipment according to the first control signal and transmit the readable signal to the fitness equipment; receiving at least one physiological signal from at least one of the wearable devices worn by the user; based on the training course and the at least one physiological signal, generating a second control signal; and when the second control signal is generated, transmitting the second control signal to the receiver, wherein the receiver generates a signal which is readable by the fitness equipment according to the second control signal and transmits it to the fitness equipment.