Abstract: A data processing method for acoustic event includes: establishing a simulated acoustic frequency event module, a data capturing module, and a sound application decision module in a software manner, setting a simulated hardware parameter to the simulated acoustic frequency event module, inputting a sound signal to a frequency filtering module of the simulated acoustic frequency event module, and obtaining metadata from a frequency event quantizer of the simulated acoustic frequency event module, dividing each of the metadata into multiple frames according to a time interval by the data capturing module, accumulating an event number of each frame by the data capturing module, setting a label of each frame according to the event number, storing these frames, the event number and the label in a database, and training a decision model by the sound application decision module according to the database and a sound application.

Abstract: A display device includes a pixel array substrate and a circuit board. The pixel array substrate has a first surface, a second surface opposite to the first surface, and a first side surface connecting the first surface and the second surface. Multiple bonding pads are located on the first surface. The circuit board is bent from above the first surface of the pixel array substrate to below the second surface. The circuit board is electrically connected to the bonding pads and includes a thermoplastic substrate. The thermoplastic substrate includes a third surface facing the pixel array substrate and a fourth surface opposite to the third surface. The thermoplastic substrate includes a first bend formed by thermoplastics.

Abstract: A power system including a first battery pack, a second battery pack, and a power management circuit is disclosed. The first battery pack has a first end and a second end, and has a first battery capacity. The second battery pack has a third end and a fourth end. The third end is coupled to the second end of the first battery pack and provides a low battery voltage. The fourth end is grounded, the second battery pack has a second battery capacity, and the second battery capacity is greater than the first battery capacity. The power management circuit is coupled to the second battery pack to receive the low battery voltage, and provides a component operating voltage to an electronic components based on the low battery voltage.

Abstract: A wafer transporting method includes following operations. A plurality of wafers are received in a semiconductor container attached to a mobile vehicle. An air processing system is coupled to a wall of the semiconductor container. The air processing system includes an inlet valve, an outlet valve, a pump between the inlet valve and the outlet valve, and a desiccant coupled to the pump. The semiconductor container is moved. The pump of the air processing system is turned on to extract air from inside the semiconductor container into the air processing system through the inlet valve. Humidity of the air is reduced when the air passes through the desiccant of the air processing system. The air is returned back to the semiconductor container through the outlet valve.

Abstract: The application relates to a method for developing the agitation system of a scale-up polymerization vessel. A simulated prediction model is obtained by use of a small polymerization vessel and by integrating Taguchi experimental design method with artificial intelligence (AI) neural network. Accordingly, vessel parameters for the agitation system of a scale-up polymerization vessel can be rapidly and accurately predicted based on simulation qualities thereof, further facilitating a construction of the agitation system of a scale-up polymerization vessel.

Abstract: An electronic package is provided, in which a first electronic element and at least one support member are disposed on a carrier structure, a spacer is disposed on the first electronic element, and a second electronic element is disposed on the at least one support member and the spacer, so as to prevent the second electronic element from tilting during a wire bonding process.

Abstract: Various examples of conductor features in integrated circuit layouts are disclosed herein. In an example, a method includes receiving an integrated circuit layout, inserting, into the integrated circuit layout, a design containing a first set of Front-End Of Line (FEOL) shapes of an integrated circuit and a first set of Back-End Of Line (BEOL) shapes of the integrated circuit, inserting, into the integrated circuit layout, a set of cells containing a second set of FEOL shapes of the integrated circuit and a second set of BEOL shapes of the integrated circuit, removing a subset of the second set of BEOL shapes that conflict with the design, and providing the integrated circuit layout that includes the design and the set of cells for fabrication of the integrated circuit. The second set of FEOL shapes includes contact shapes that define contacts of the integrated circuit.

Abstract: Various examples of conductor features in integrated circuit layouts are disclosed herein. In an example, a method includes initializing a layout for fabricating an integrated circuit. A plurality of fill cells is inserted into the layout. The plurality of fill cells includes a plurality of fill line shapes that correspond to conductive lines of the integrated circuit. Thereafter, a design is inserted into the layout that includes a plurality of functional shapes. A conflicting subset of the plurality of fill line shapes of the plurality of fill cells that conflict with the plurality functional shapes are removed. The layout that includes the plurality of fill cells and the design is provided for fabricating the integrated circuit.

Abstract: A post placement abutment treatment for cell row design is provided. In an embodiment a first cell and a second cell are placed in a first cell row and a third cell and a fourth cell are placed into a second cell row. After placement vias connecting power and ground rails to the underlying structures are analyzed to determine if any can be merged or else removed completely. By merging and removing the closely placed vias, the physical limitations of photolithography may be by-passed, allowing for smaller structures to be formed.

Abstract: A post placement abutment treatment for cell row design is provided. In an embodiment a first cell and a second cell are placed in a first cell row and a third cell and a fourth cell are placed into a second cell row. After placement vias connecting power and ground rails to the underlying structures are analyzed to determine if any can be merged or else removed completely. By merging and removing the closely placed vias, the physical limitations of photolithography may be by-passed, allowing for smaller structures to be formed.

Abstract: A post placement abutment treatment for cell row design is provided. In an embodiment a first cell and a second cell are placed in a first cell row and a third cell and a fourth cell are placed into a second cell row. After placement vias connecting power and ground rails to the underlying structures are analyzed to determine if any can be merged or else removed completely. By merging and removing the closely placed vias, the physical limitations of photolithography may be by-passed, allowing for smaller structures to be formed.

Abstract: Various examples of conductor features in integrated circuit layouts are disclosed herein. In an example, a method includes initializing a layout for fabricating an integrated circuit. A plurality of fill cells is inserted into the layout. The plurality of fill cells includes a plurality of fill line shapes that correspond to conductive lines of the integrated circuit. Thereafter, a design is inserted into the layout that includes a plurality of functional shapes. A conflicting subset of the plurality of fill line shapes of the plurality of fill cells that conflict with the plurality functional shapes are removed. The layout that includes the plurality of fill cells and the design is provided for fabricating the integrated circuit.

Abstract: A post placement abutment treatment for cell row design is provided. In an embodiment a first cell and a second cell are placed in a first cell row and a third cell and a fourth cell are placed into a second cell row. After placement vias connecting power and ground rails to the underlying structures are analyzed to determine if any can be merged or else removed completely. By merging and removing the closely placed vias, the physical limitations of photolithography may be by-passed, allowing for smaller structures to be formed.

Abstract: A post placement abutment treatment for cell row design is provided. In an embodiment a first cell and a second cell are placed in a first cell row and a third cell and a fourth cell are placed into a second cell row. After placement vias connecting power and ground rails to the underlying structures are analyzed to determine if any can be merged or else removed completely. By merging and removing the closely placed vias, the physical limitations of photolithography may be by-passed, allowing for smaller structures to be formed.

Abstract: A post placement abutment treatment for cell row design is provided. In an embodiment a first cell and a second cell are placed in a first cell row and a third cell and a fourth cell are placed into a second cell row. After placement vias connecting power and ground rails to the underlying structures are analyzed to determine if any can be merged or else removed completely. By merging and removing the closely placed vias, the physical limitations of photolithography may be by-passed, allowing for smaller structures to be formed.