Abstract: The invention provides a TFT electrode structure and its manufacturing method that can prevent metal diffusion occurring in the fabrication of a TFT, and thereby reduce the risk of contamination of the chemical vapor deposition process due to metallic ion diffusion. The transparent pixel electrode is formed after the gate electrode metal so that the pixel transparent electrode can be used as a barrier layer to prevent metal diffusion under high temperature from the gate electrode metal to adjacent insulating layers or the active layer. Further, the method used to form the transparent pixel electrode is a low-temperature physical vapor deposition process, which affected less by the processing environment, and the transparent pixel electrode is a conductive layer that is not affected by metal diffusion.

Abstract: A one drop fill (ODF) liquid crystal display panel has a CF substrate, a TFT substrate, and a liquid crystal layer positioned between the CF substrate and the TFT substrate. The TFT substrate further has a pixel array region positioned in the center part of the TFT substrate, a sealant region position in the periphery region of the TFT substrate, a light-shielding pattern positioned on the sealant region, and a sealant pattern positioned corresponding to the sealant region between the CF substrate and the TFT substrate for assembling the two substrates.

Abstract: The invention provides a TFT electrode structure and its manufacturing method that can prevent metal diffusion occurring in the fabrication of a TFT, and thereby reduce the risk of contamination of the chemical vapor deposition process due to metallic ion diffusion. The transparent pixel electrode is formed after the gate electrode metal so that the pixel transparent electrode can be used as a barrier layer to prevent metal diffusion under high temperature from the gate electrode metal to adjacent insulating layers or the active layer. Further, the method used to form the transparent pixel electrode is a low-temperature physical vapor deposition process, which affected less by the processing environment, and the transparent pixel electrode is a conductive layer that is not affected by metal diffusion.

Abstract: An electrical apparatus with an image capture unit includes a casing, an image capture unit and a connection unit. The casing has a container and a first fasten portion set in the container. The image capture unit has a second fasten portion. When the second fasten portion connects with the first fasten portion, the image capture unit is fastened in the container. The connection unit connects the image capture unit and the casing. At least one portion of the connection unit is made of a flexible material. When the first fasten portion is separated from the second fasten portion, the image capture unit and at least one portion of the connection unit are pull out and exposed out of the casing. Then, when applying a force to the connection unit, the shape of the connection unit is modified.

Abstract: The present invention provides a liquid crystal panel with an isolation wall structure and its producing method. The method comprise: selecting one substrate from two substrates that have been put under alignment process and forming on it a plurality of closing isolation wall structure that is mutual-repulsive to liquid crystal; then forming a close sealant on the substrate, the sealant being located between outer edge of the substrate and the isolation wall structure; and then, combining the two substrates for confining liquid crystal in the isolation wall structure and isolating the liquid crystal from the sealant.

Abstract: The present invention discloses a frequency-modulated dimming control system of a discharge lamp. The frequency-modulated dimming control system of a discharge lamp includes including a voltage regulator having a variable output voltage for converting an input voltage into a bus voltage, wherein a level of the bus voltage is a predetermined ratio of the input voltage, for example 10% of the input voltage, and a ballast circuit for driving the discharge lamp by detecting a variation of the bus voltage and then providing a current to the discharge lamp in response to a frequency modulation of the ballast circuit and the variation of the bus voltage so as to control a light intensity of the discharge lamp.

Abstract: A structure of liquid crystal display and manufacture method thereof are described. The liquid crystal display is manufactured by a one drop fill process. The display comprises a first substrate, a second substrate, a conductive pattern layer, a black matrix layer, a liquid crystal layer and an ultraviolet-type seal. The metal pattern layer is made of indium tin oxide and formed on the first substrate. Therefore, the metal pattern layer is a transparent layer allowing the ultraviolet light to pass through. The ultraviolet-type seal is pre-cured by the ultraviolet light from the first substrate direction to the seal, and then cured by a heating process. Hence, the liquid crystal pollution problem is reduced.

Abstract: A liquid crystal display with separating wall is described. The liquid crystal display is manufactured by a one drop fill process. The display comprises a first substrate, a second substrate, a liquid crystal layer and a seal. The separating wall is formed on the first substrate and around a periphery of the first substrate in a non-display area to block efficiently the liquid crystal from spilling out. The height of the separating wall is close to a cell gap, and therefore the separating wall can utilize a technology of spacer on color filter to produce and adjust height thereof. Hence, the quality of liquid crystal displays can be improved and manufacture cost can be reduced.

Abstract: A one drop fill (ODF) liquid crystal display panel has a CF substrate, a TFT substrate, and a liquid crystal layer positioned between the CF substrate and the TFT substrate. The TFT substrate further has a pixel array region positioned in the center part of the TFT substrate, a sealant region position in the periphery region of the TFT substrate, a light-shielding pattern positioned on the sealant region, and a sealant pattern positioned corresponding to the sealant region between the CF substrate and the TFT substrate for assembling the two substrates.

Abstract: The present invention provides a liquid crystal panel with an isolation wall structure and its producing method. The method comprise: selecting one substrate from two substrates that have been put under alignment process and forming on it a plurality of closing isolation wall structure that is mutual-repulsive to liquid crystal; then forming a close sealant on the substrate, the sealant being located between outer edge of the substrate and the isolation wall structure; and then, combining the two substrates for confining liquid crystal in the isolation wall structure and isolating the liquid crystal from the sealant.

Abstract: In conventional arts, a liquid crystal display with one drop fill (ODF) has a problem that the liquid is contaminated by a uncured sealant resulted from UV light being blocked by a black matrix, a conducting layer, etc from irradiating the sealant. In this present invention, a material of the array is replaced with a transparent material at least in a portion of an area sealant located, where the portion of area is the border between the liquid crystal and the sealant. Therefore, the sealant contacting with the liquid is completely cured by UV light without the blocking of the black matrix or the conducting layer.

Abstract: A structure of liquid crystal display and manufacture method thereof are described. The liquid crystal display is manufactured by a one drop fill process. The display comprises a first substrate, a second substrate, a conductive pattern layer, a black matrix layer, a liquid crystal layer and an ultraviolet-type seal. The metal pattern layer is made of indium tin oxide and formed on the first substrate. Therefore, the metal pattern layer is a transparent layer allowing the ultraviolet light to pass through. The ultraviolet-type seal is pre-cured by the ultraviolet light from the first substrate direction to the seal, and then cured by a heating process. Hence, the liquid crystal pollution problem is reduced.

Abstract: A liquid crystal display with separating wall is described. The liquid crystal display is manufactured by a one drop fill process. The display comprises a first substrate, a second substrate, a liquid crystal layer and a seal. The separating wall is formed on the first substrate and around a periphery of the first substrate in a non-display area to block efficiently the liquid crystal from spilling out. The height of the separating wall is close to a cell gap, and therefore the separating wall can utilize a technology of spacer on color filter to produce and adjust height thereof. Hence, the quality of liquid crystal displays can be improved and manufacture cost can be reduced.

Abstract: A liquid crystal display with ink jet color filters and manufacture method thereof are described. The display comprises a thin film transistor array, an ink isolating wall, color filters, and a pixel electrode layer. The ink isolating layer is formed on the thin film transistor array and constructs transparent areas and non-transparent areas, black matrix, on electric control circuits. Each of the transparent areas is surrounded by an enclosing space formed by the ink isolating wall. The color filter is injected inside the enclosing space by an ink jet technology. The color filter is produced on the thin film transistor array directly, and therefore the display assembly tends to align easily, the aperture ratio is increased and the image quality of the displayer is improved.

Abstract: The present invention discloses a frequency-modulated dimming control system of a discharge lamp. The frequency-modulated dimming control system of a discharge lamp includes including a voltage regulator having a variable output voltage for converting an input voltage into a bus voltage, wherein a level of the bus voltage is a predetermined ratio of the input voltage, for example 10 % of the input voltage, and a ballast circuit for driving the discharge lamp by detecting a variation of the bus voltage and then providing a current to the discharge lamp in response to a frequency modulation of the ballast circuit and the variation of the bus voltage so as to control a light intensity of the discharge lamp.

Abstract: A method for forming a compact LCD package and devices formed by such method are disclosed. In the method, an LCD display panel is formed by bonding an upper glass panel and a lower glass panel together and exposing an edge portion formed by a larger lower glass panel. Conductive traces formed of a conductive film layer such as ITO is provided on the edge portion of the LCD display panel for providing electrical connection to the drive lines and scan lines for the LCD panel. A two-step bonding method is used to first bond a printed circuit board in a pre-bonding step to the exposed edge portion of the LCD panel by using an anisotropic conductive film layer. The bonding is conducted under pressure and heat such that electrical communication is established through the conductive metal particles contained in the anisotropic conductive film.

Abstract: A bonded structure comprising the physical and electrical connections between an integrated circuit element and substrate using a composite bump comprised of a single polymer body of low Young's Modulus and a conductive metal coating. When the bonded structure is formed the composite bump is deformed and the low Young's Modulus of the polymer body allows a very reliable bonded structure with very low bonding force. Due to the low Young's Modulus there is little tendency to separate the connections after the bonded structure is formed. The bond can be formed using thermocompression bonding, ultrasonic bonding, application of heat or application of light. The bond can also be formed using a non conductive adhesive between the integrated circuit element and the substrate. The bond can also be formed with a conductive adhesive coating on the composite bump.

Abstract: A repairable TFT-LCD assembly and a method for fabricating such assembly have been disclosed. In the repairable TFT-LCD assembly, a novel separation tape is utilized between the TFT and the LCD substrate such that when the tape is pulled in a perpendicular direction to the planar surface of the LCD substrate, the TFT can be separated from the assembly without causing damages to the LCD substrate. The separation tape is fabricated of a polymeric based insulating material with a multiplicity of apertures filled with a conductive metal. The back of the separation tape is laminated with a copper film which is patterned corresponding to the pattern of conductive pads provided on the LCD substrate. The present invention is further directed to a method for fabricating the separation tape for use in a repairable TFT-LCD assembly.

Abstract: A bonded structure comprising the physical and electrical connections between an integrated circuit element and substrate using a composite bump comprised of a single polymer body of low Young's Modulus and a conductive metal coating. The bond can be formed using thermocompression bonding, ultrasonic bonding, application of heat or application of light. The bond can also be formed using a non conductive adhesive between the integrated circuit element and the substrate. The bond can also be formed with a conductive adhesive coating on the composite bump.

Abstract: A bonded structure comprising the physical and electrical connections between an integrated circuit element and substrate using a composite bump comprised of a single polymer body of low Young's Modulus, a conductive barrier metal coating covering the polymer body and a soldering metal coating covering the conductive barrier metal coating. When the bonded structure is formed the composite bump is deformed and the low Young's Modulus of the polymer body allows a very reliable bonded structure with very low bonding force. Due to the low Young's Modulus there is little stress tending to break the solder joint after the bonded structure is formed. The bond is formed using a soldering process so that the soldering metal forms a conductive adhesive between the composite bumps and either the substrate input/output pads or the integrated circuit element input/output pads.